Universal Robots Integrates SRCI into Software

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Universal Robots (UR) has now integrated the Standard Robot Command Interface (SRCI) into its software. UR is proud to be among the first cobot vendors to offer this functionality.

automated processes in control cabinet construction

The SRCI is a new standard for robotics manufacturers that aims to create a single interface between PLCs and robots. The full integration of SRCI into UR’s software will enhance the connectivity capabilities of UR’s cobots and will ensure customers a frictionless integration with Siemens PLCs (Programmable Logic Controllers), since Siemens is the first – and currently only – PLC Vendor supporting SRCI in the automation market.

The uniform cross-manufacturer data interface of the SRCI makes robot implementation interoperable, and it standardizes definitions and robot commands between UR cobots and Siemens PLCs. This allows for easier and quicker setup and simplifies the deployment of UR robots into existing and new Siemens ecosystem-based production lines.

The SRCI is available for UR’s e-Series family and the next-generation robots UR20 and UR30. It can be installed and activated with PolyScope version 5.15 or higher via add-on URcap software. For more info, click here.

Read more about Siemens’ SIMATIC Robot Integrator here.

About Universal Robots

Universal Robots is a provider of collaborative robots (cobots) used across a wide range of industries and in education. Founded in 2005 and headquartered in Odense, Denmark, Universal Robots aims to create a world where people work with robots, not like robots.

Since introducing the world’s first commercially viable cobot in 2008, Universal Robots has developed a product portfolio reflecting a range of reaches and payloads and has sold over 75,000 cobots worldwide. An extensive ecosystem has grown around the company’s cobot technology creating innovation, choice for customers and a wide range of components, kits and solutions to suit every application.

For more information, please visit www.universal-robots.com.

Stratasys Launches H350 v1.5 Printer

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Announces SAF HighDef Printing Capabilities

EDEN PRAIRIE, MN & REHOVOT, Israel, Apr 26, 2024 – Stratasys announced its new SAF HighDef Printing capabilities and the launch of the H350 printer, version 1.5 (V.1.5) to expand SAF adoption with additional applications and use cases for a growing set of manufacturing end markets.

Stratasys announces new High-Definition Printing capabilities. Seen here are new high-definition sensors and on the end, 3D printed grains of rice. (Photo: Business Wire)

Introducing High Definition

Stratasys’ new HighDef Printing capabilities are designed to allow for more exact, high-definition printing with detailed resolution. This gives manufacturers the ability to rapidly scale their additive manufacturing through reliable repeatability, while creating more intricate parts and expanding their design capabilities. Customers from industries such as aerospace, automotive, and healthcare can take advantage of SAF thermal control to create applications that require smooth, precise features like gears and mechanisms.

“High-definition printing enables tighter tolerances, moving assemblies and a new range of applications for SAF customers,” said Adam Ellis, corporate applications manager, Stratasys. “Bringing HighDef to our customers will help us expand and improve their capabilities and increase their adoption of 3D printing in manufacturing roles.”

Delivered as part of a firmware update, Stratasys’ HighDef Printing will be backwards compatible with previous H350 models and made available to customers at no additional cost.

New Stratasys H350 v1.5 printer, which is now available. (Photo: Business Wire)

The New H350

Stratasys is introducing the new H350 v1.5 printer. This new printer has improved sensors and remote service capabilities, making the printer easier to operate and service. The H350 V1.5 will also come with the new Stratasys HighDef Printing firmware update.

“The new capabilities and the upgraded H350 align with the performance needs that our customers indicated to us, that will allow them to further benefit from additive manufacturing and SAF technology in particular,” said Torben Lange, vice president, SAF Research & Development, Stratasys. “New applications and use cases will allow manufacturers to scale their production, with more intricate parts, without compromising speed or quality.”

About Stratasys

Stratasys is leading the global shift to additive manufacturing with innovative 3D printing solutions for industries such as aerospace, automotive, consumer products and healthcare. Through smart and connected 3D printers, polymer materials, a software ecosystem, and parts on demand, Stratasys solutions deliver competitive advantages at every stage in the product value chain. The world’s leading organizations turn to Stratasys to transform product design, bring agility to manufacturing and supply chains, and improve patient care.

To learn more about Stratasys, visit www.stratasys.com.

JOOLA Selects Centric PLM

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CAMPBELL, CA, Apr 24, 2024 – Centric Software is pleased to announce that the sports brand JOOLA has selected their product lifecycle management (PLM) solution, Centric PLM. Centric Software provides the most innovative enterprise solutions to plan, design, develop, source, buy, make, price, allocate, sell and replenish products such as fashion, outdoor, luxury, multi-category retail, grocery, food & beverage, cosmetics & personal care and consumer electronics to achieve strategic and operational digital transformation goals.

Founded in 1952 in Germany, JOOLA is a globally recognized indoor and outdoor table tennis equipment brand that has sponsored 3 Olympic Games. JOOLA designs and manufactures both hardline goods such as tables, rackets and balls, as well as softline products such as apparel, footwear and accessories. Since 2022, JOOLA has embraced the fast-growing sport of pickleball and expanded into a range of products for pickleball players.

Now headquartered in the US, JOOLA is working hard to grow the brand internationally and wanted a PLM solution to better organize product development data and free up resources.

“We launched the pickleball business in 2022, and we’ve seen tremendous growth since then,” says Richard Lee, CEO of JOOLA. “We’re launching new products left and right, so we definitely need more data organization to make sure we are tracking everything properly.”

Austin Kim, product manager at JOOLA, adds, “There’s a lot of cross-team collaboration, especially for design, so that transfer of information and data management can get tricky. User errors happen, and it’s hard to keep everything updated.”

JOOLA conducted extensive PLM research and due diligence, ultimately selecting Centric PLM based on its industry reputation, market leadership and usability. JOOLA will implement Centric PLM for its global operations.

“Our teams are already pretty well-versed in Centric,” says Sunny Le, director, Softline Products at JOOLA. “We’re excited to start using it, as we’re going to be living in it every day. Along with streamlining processes and organizing data, it’s also going to be beneficial from a labor standpoint as we’ll be able to use resources more efficiently. It will make it really easy for us to work more collaboratively.”

“The Centric team answers any questions we have and provides solutions around best practices,” concludes Kim. “We have had a wonderful time working with them.”

“We are delighted that JOOLA has placed their trust in Centric to build a digital foundation for growth,” says Fabrice Canonge, president of Centric Software. “We look forward to working closely with JOOLA to drive more efficient product development, expansion and innovation.”

About JOOLA

Established in Germany in 1952, JOOLA has dominated the professional table tennis scene in the United States for over 15 years. Partnering with North American Table Tennis (NATT) early on, JOOLA established a strong presence through the North American Tour and NATT‘s flagship event, the North American Teams Championships. Each event in the Tour generally drew in 200 to 300 participants and showcased about 30 JOOLA tables, while the Teams event exposed the brand to nearly 1000 players, who competed on about 150 JOOLA tables. With each successful event, JOOLA grew its fan base and eventually became the most visible table tennis brand in US table tennis.

JOOLA later served as the Official Table Sponsor of USA Table Tennis’ (USATT), the national governing body for table tennis, major tournaments from 2012 until 2019. This included the US Open and US National Championships.

In 2019, Sport Squad, Inc., the US-based distributor and licensee of JOOLA for the North American and Brazilian market., announced its acquisition of JOOLA Tischtennis GmbH. Established in 2006 and based in Rockville, MD, Sport Squad, Inc. was founded by Richard Lee out of a love for table tennis. Sport Squad eventually expanded to include 4 different brands dedicated to offering interactive and immersive games and gaming equipment. It is the parent company to JOOLA, iPong, Sport Squad, and Hit Mit. In 2022, JOOLA launched JOOLA Pickleball and immediately took the sport by storm as the sponsor of pickleball world #1 Ben Johns and a partner of USPPA.

For more information, visit joola.com.

About Centric Software

Silicon Valley-based Centric Software provides an innovative product concept-to-customer platform for producers, brands and retailers of all sizes in the food & beverage industry, food service and grocery retail sectors. Centric Software works closely with customers to achieve more efficient project management and safer product development, execute a competitive retail and product strategy, increase agility, speed time to market and get closer to consumers, resulting in maximized revenues and margins.

Centric Software is a subsidiary of Dassault Systèmes, the world leader in 3D design software, 3D digital mock-up and PLM solutions.

For more information, visit www.centricsoftware.com.

Keysight, Synopsys, Ansys Introduce RF Design Migration Flow

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from TSMC’s N16 Process to N6RF+

SANTA ROSA, CA, Apr 25, 2024 – Keysight Technologies, Inc., Synopsys, Inc., and Ansys introduce a new integrated radio frequency (RF) design migration flow from TSMC’s N16 process to its N6RF+ technology to address the power, performance, and area (PPA) requirements of today’s most demanding wireless integrated circuit applications. The new migration workflow integrates millimeter wave (mmWave) and RF solutions from Keysight, Synopsys, and Ansys into an efficient design flow that streamlines re-design of passive devices and design components to TSMC’s more advanced RF process.

The new Synopsys, Keysight, and Ansys N16 to N6RF+ integrated radio frequency design migration workflow.

This RF design migration initiative extends TSMC’s Analog Design Migration (ADM) methodology with additional capabilities for RF circuit designers. Beyond the productivity gains offered by ADM, the Keysight, Synopsys, and Ansys migration workflow demonstrates significant power reduction for a 2.4GHz low noise amplifier (LNA) design re-targeted to the N6RF+ process.

Key components of the design migration flow include:

RF circuit designers can adopt the migration flow to rapidly re-design their devices to the N6RF+ process specifications and accelerate time-to-market. Keysight RFPro enables parameterization of passive devices including inductors and automatically re-creates highly accurate simulation models with layout tuned to the new process. Designers view the re-created device layout in Synopsys Custom Compiler along with synthesized inductors from Ansys VeloceRF, and then perform interactive EM analysis in complex wireless chips.

Sanjay Bali, vice president strategy and product management EDA Group, Synopsys, said: “The need to rapidly migrate designs from node to node is essential to address the industry’s relentless drive towards enhanced quality-of-results on TSMC’s leading process technologies. The new flow, leveraging Synopsys’ Custom Compiler, ASO.ai and PrimeSim solutions, offers an integrated RF and analog design migration solution that enables efficient migration of designs from TSMC N16 technology platform to N6RF+. Combining the strengths of trusted and industry-leading RF and mmWave solutions from Keysight, Synopsys and Ansys provides mutual customers with an interoperable design flow to unlock massive productivity gains.”

Niels Faché, vice president and general manager, Keysight EDA, said: “Meeting PPA requirements while adhering to new process design rules is one of the biggest challenges facing complex RF chip designs. RF circuit designers want to leverage and reuse their libraries of N16 device and component intellectual property to improve ROI. This new flow facilitates fast re-design in the latest TSMC N6RF+ technology for existing components originally built in N16. Keysight RFPro enables circuit designers to easily perform the device parameterization, new simulation model generation, and interactive EM analysis inside the Synopsys Custom Compiler layout environment. No time-consuming data handoffs or domain specialization are required, which increases overall engineering productivity for RF circuit designers.”

John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys, said: “Electromagnetic simulation and modeling play a central role in developing predictively accurate solutions for RF, high-speed analog, HPC data transmission, 3DIC interconnect, and co-packaged optics. We take pride in our partnership with Keysight, Synopsys and TSMC, because it enables Ansys to nimbly address some of the most challenging problems in this rapidly evolving and dynamic market. By fostering open platforms that integrate best-of-breed solutions, our joint customers will derive greater value and achieve enhanced product outcomes.”

Dan Kochpatcharin, head of the design infrastructure management division at TSMC, said: “We’re delighted about our recent collaboration with Ansys, Keysight and Synopsys, which offers our mutual customers an efficient pathway to migrate their designs to our more advanced processes, ensuring that they meet the stringent PPA requirements. We’re committed to continuing our collaboration with our Open Innovation Platform (OIP) ecosystem partners to enable customers’ next-generation designs with solutions benefiting from the significant power and performance boost of our leading-edge technologies.”

About Keysight Technologies

At Keysight, they inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product lifecycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world.

Learn more at www.keysight.com.

About Synopsys

Catalyzing the era of pervasive intelligence, Synopsys, Inc. delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. They partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

Learn more at www.synopsys.com.

About Ansys

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

For more information, visit www.ansys.com.

Cadence, TSMC Extend Partnership

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to Transform System, Semiconductor Design

SAN JOSE, CA, Apr 25, 2024 – Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics. This collaboration significantly advances system and semiconductor design for AI, automotive, aerospace, hyperscale and mobile applications and has resulted in the following recent technology achievements:

  • Cadence collaborates with TSMC to infuse the Integrity 3D-IC platform with new features and functionality: The Cadence Integrity 3D-IC platform, the industry’s comprehensive solution certified for all the latest TSMC 3DFabric offerings, now supports a hierarchical 3Dblox specification developed to integrate multiple chiplets into hierarchies for reuse and modular design. It also includes new features developed to ease chiplet assembly and design, and an automated alignment markers insertion flow to accelerate the design and assembly of stacked chiplets on different interposers and packages.
  • Cadence’s digital solutions are certified for TSMC N2 design flow, including Innovus Implementation System, Quantus Extraction Solution, Quantus Field Solver, Tempus Timing Signoff and ECO Solution, Pegasus Verification System, Liberate characterization, and the Voltus IC Power Integrity Solution. The Genus Synthesis Solution is also enabled for N2 technology. Cadence and TSMC are collaborating on AI-driven Cadence solutions to enable an AI-assisted design flow for productivity and optimization of PPA results.
  • The Cadence Custom/Analog Design Flow is fully certified for TSMC’s latest N2 Process Design Kit (PDK): Cadence custom tools optimized for TSMC N2 PDKs include Virtuoso Schematic Editor for design capturing and the Virtuoso ADE Suite for analysis, which are both part of Virtuoso Studio, and the integrated Spectre Simulator. All have been enhanced for managing corner simulations, statistical analyses, design centering, and circuit optimization, which are now common with advanced nodes. Virtuoso Studio has also been augmented to support front-to-back process migration from schematic mapping to optimized design specifications to full-layout place-and-route automation. The Virtuoso Studio and Spectre Simulation platforms, including Spectre X, Spectre XPS and the Spectre RF Option, have achieved the latest TSMC N2 certifications.
  • Cadence and TSMC have worked closely together to release a Virtuoso Studio N16 to N6 RF migration reference flow to substantially reduce turnaround time: Purposed-based instance mapping rapidly retargets schematics, while EMX Planar 3D Solver provides inductor synthesis and EM extraction for nets and components during the design phase. The Virtuoso ADE Suite provides design optimization using Spectre Simulation’s RF analysis capabilities, and Virtuoso Studio Layout tools accelerate the reuse and reimplementation of RF layouts while preserving design intent.
  • Cadence announces the availability of a comprehensive portfolio of industry-leading IP cores for TSMC’s N3 process, including:
    • Cadence’s IP for UCIe on TSMC N3 is available in both advanced and standard package options. Cadence also offers IP for UCIe on multiple processes and configurations to enable a comprehensive solution for die-to-die (D2D) interconnect for its customers.
    • The Cadence memory interface IP portfolio (DDR5, LPDDR5 and GDDR6) is silicon-proven with best-in-class system margins and a PPA-optimized architecture that is ready to enable next-generation enterprise, high-performance computing and AI applications.
    • Cadence’s IP for PCIe 5.0/CXL2.0 and PCIe 6.0/CXL3.0 on TSMC N3 are designed to provide the highest link throughput and utilization while operating with low latency, providing customers with SoC design excellence.
  • The Cadence EMX 3D Planar Solver has received certification for TSMC’s N5 process technology: This certification enables joint customers to seamlessly integrate the EMX Solver into their advanced-node IC design flow, allowing for highly accurate EM analysis that can overcome the challenges of EM crosstalk and parasitics. Additionally, certification for N2 and N3 process technology is well underway.
  • Cadence unveils a new silicon photonics flow to support TSMC’s Compact Universal Photonic Engine (COUPE) technology: Cadence and TSMC collaborate to develop a design flow for the COUPE 3D photonics process that features the Cadence Integrity 3D-IC platform. The TSMC COUPE technology enables the heterogeneous integration of photonics ICs with electrical ICs while minimizing coupling losses. The developing design flow from Cadence will support TSMC’s COUPE technology and includes the Cadence Spectre X Simulator, Virtuoso Studio, EMX 3D Planar Solver and Pegasus Verification System, enabling joint customers to meet the most demanding system requirements and pave the way for high-performance computing applications.

“We have a distinguished track record collaborating with TSMC to deliver a broad set of innovations across EDA, packaging and IP to accelerate system and semiconductor design and enable customers to achieve aggressive time-to-market goals,” said Chin-Chi Teng, SVP and GM, R&D, Cadence. “These new certified design flows and standardized solutions allow customers to confidently design for TSMC advanced nodes and usher in improved design efficiency and technological advancements.”

“TSMC works closely with Cadence to accelerate customer innovation by providing high-quality design tools certified for use with our most advanced processes,” said Dan Kochpatcharin, Head of the Design Infrastructure Management Division at TSMC. “Through our longstanding collaboration, we’re able to deliver greater value for the most advanced SoC designs, benefiting from the significant power and performance boost afforded by our latest technology innovations.”

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For 10 years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For.

Learn more at cadence.com.