THE WOODLANDS, TX, July 9, 2024 – BlackPearl Technology, Inc. has announced the release of the Zephyr, an ultra-low-power, Class 1 Division 1, 11 sensors-in-1 wireless instrument gauge that redefines the boundaries of data acquisition in diverse industrial applications.

Key Features and Benefits

• 11 Sensors-in-1: Zephyr integrates (2) onboard sensors—a temperature sensor and IMU with an accelerometer—and supports (9) external, hardware-configurable sensor inputs including 4-20mA sensors, voltage input sensors, strain gauge sensors, thermocouples, and more.
• Comprehensive Wireless Connectivity: The Zephyr supports Bluetooth, Wi-Fi (2.4GHz and 5GHz), 900MHz Mesh Networking, and LoRaWAN for seamless integration with any network or existing system.
• Ultra Low-Power: With an ultra-low-power design, the Zephyr can run on battery power for up to 3 years, making it ideal for remote and long-term monitoring applications.
• Secure Data Management: The Zephyr comes standard with encryption technology to secure data and onboard storage and ensure confidentiality.
• Rugged and Reliable: Housed in a Class 1 Division 1, explosion-proof enclosure, the Zephyr is built to thrive in harsh industrial environments.
• Extensive Protocol Support: The Zephyr supports most machine-to-machine communication protocols for easy integration with existing systems and infrastructure.
• Ready Availability: The Zephyr is proudly made in North America resulting in quick delivery and high-quality craftsmanship.

“The Zephyr embodies a revolution in industrial wireless data acquisition,” said David Smith, co-founder & VP of Innovation at BlackPearl Technology, Inc. “With its all-in-one design, ultra-low-power consumption, and robust connectivity options, the Zephyr is the ultimate solution for industrial businesses seeking uninterrupted data integration and reliable performance. This launch sets a new standard for operational efficiency and safety in hazardous environments.”

This announcement follows closely on the heels of BlackPearl’s latest innovation launch—BlackDAQ, a modular, all-in-one data acquisition system engineered for the harshest industrial environments. Introduced with features like expansive connectivity options, rugged industrial design, and advanced data processing capabilities, BlackDAQ complements the Zephyr by providing a flexible and comprehensive solution for seamless data acquisition, processing, and transfer.

For more information and specifications, or to download the data sheet, please visit www.BlackPearlTechnology.com.

About BlackPearl Technology, Inc.

Headquartered in The Woodlands, TX, BlackPearl Technology is a leading provider of innovative IIoT solutions for industries worldwide. Specializing in engineering, manufacturing, and client services, the BlackPearl ecosystem supports the entire product design and development lifecycle from conception to full-scale manufacturing.

The BlackPearl team of skilled electrical, mechanical, software, and firmware engineers is dedicated to bringing innovative ideas to life. By leveraging the latest technology, BlackPearl develops reliable solutions that solve problems and enhance operational processes. All design and development work is conducted in North America.

For more information, visit www.blackpearltechnology.com.

SCOTTSDALE, AZ, July 3, 2024 – As part of onsemi’s continuous drive to provide the most robust, cutting-edge technologies for intelligent image sensing, the company announced today it has completed the acquisition of SWIR Vision Systems. SWIR Vision Systems is a leading provider of CQD (colloidal quantum-dot-based) short wavelength infrared (SWIR) technology – a technology that extends the detectable light spectrum to see through objects and capture images that were not previously possible. The integration of this patented technology within onsemi’s industry-leading CMOS sensors will significantly enhance the company’s intelligent sensing product portfolio and pave the way for further growth in key markets including industrial, automotive and defense.

CQD uses nanoparticles or crystals with unique optical and electronic properties that can be precisely tuned to absorb an extended wavelength of light. This technology extends the visibility and detection of systems beyond the range of standard CMOS sensors to SWIR wavelengths. To date, SWIR technology has been limited in adoption due to the high cost and manufacturing complexity of the traditional indium gallium arsenide (InGAas) process. With this acquisition, onsemi will combine its silicon-based CMOS sensors and manufacturing expertise with the CQD technology to deliver highly integrated SWIR sensors at lower cost and higher volume. The result are more compact, cost-effective imaging systems that offer extended spectrum and can be used in a wide array of commercial, industrial and defense applications.

These advanced SWIR sensors are able to see through dense materials, gases, fabrics and plastics, which is essential across many industries, particularly for industrial applications such as surveillance systems, silicon inspection, machine vision imaging and food inspection. In autonomous vehicle imaging, the higher spectra will create better visibility to see through difficult conditions such as extreme darkness, thick fog or winter glare.

SWIR Vision Systems is now a wholly owned subsidiary of onsemi, with its highly skilled team being integrated into the company’s Intelligent Sensing Group. The team will continue to operate in North Carolina. The acquisition is not expected to have any meaningful impact on onsemi’s near to midterm financial outlook.

More Information: onsemi Intelligent Sensing

About onsemi

onsemi is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. onsemi offers a highly differentiated and innovative product portfolio, delivering intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way to creating a safer, cleaner and smarter world.

Learn more about onsemi at www.onsemi.com.

HSINCHU, Taiwan, July 1, 2024 – Faraday Technology Corp., a leader in ASIC design services and IP solutions, announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicle. This participation in the alliance underscores a shared commitment to innovation and customer success.

Since its establishment in 1993, Faraday has been at the forefront, offering an extensive range of ASIC services, from frontend to backend development, aimed at empowering customers to realize their device performance and cost objectives. In addition, the company offers a robust Business Continuity Plan and system management, ensuring long-term supply guarantees for ASICs. Faraday has also earned acclaim for its expertise in IP design and utilization, providing value-added IP service such as SoC/subsystem integration, IP customization, and IP hardening.

“We are glad to be a part of Intel Foundry Accelerator Design Services Alliance,” said Flash Lin, COO of Faraday. “Intel Foundry’s leading-edge RibbonFET process and innovative 2.5D/3D-IC packaging solutions for new-generation multi-tile chips align perfectly with our capability and resource commitment to excellence. This collaboration enables us to expand our service portfolio, catering to customers targeting advanced applications.”

“Our collaboration with Faraday is poised to expedite the realization of silicon-product concepts into successful production,” said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. “Faraday’s flexible business models across various stages of ASIC development, including Spec-in to GDS-in design, verification, implementation, and OSAT services, facilitates seamless end-to-end co-development and empowers the creation of next-generation custom SoC products.”

About Faraday Technology Corp.

Faraday Technology Corp. is dedicated to the mission of benefiting humanity and upholding sustainable values in every IC it handles. The company offers a comprehensive range of ASIC solutions, including total 3DIC packaging, Neoverse CSS design, FPGA-Go-ASIC, and design implementation services. Furthermore, its extensive silicon IP portfolio encompasses a wide array of offerings, such as I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, LPDDR4/4X, DDR4/3, MIPI D-PHY, V-by-One, USB 3.1/2.0, 10/100 Ethernet, Giga Ethernet, SATA3/2, PCIe Gen4/3, and SerDes.

For further details, visit www.faraday-tech.com.

PLANO, TX, June 25, 2024 – Siemens Digital Industries Software announced today that its ongoing collaboration with Intel Foundry has established a new Electronic Design Automation (EDA) product certification, as well as an embedded multi-die interconnect bridge (EMIB) enablement breakthrough that can help mutual customers leverage the performance, space and power efficiency advantages of 3D-IC (3D integrated circuit) designs much more quickly.

The partners recently certified Siemens’ new Solido SPICE, part of Solido Simulation Suite software for the foundry’s Intel 16 and Intel 18A nodes. An advanced portfolio of AI-accelerated simulators for intelligent IC design and verification, Siemens’ new Solido Simulation Suite provides leading-edge, feature-rich circuit verification for analog, mixed-signal, RF, memory, library IP, 3D-IC and System-on-a-chip (SoC) design.

Intel 18A represents the latest advancement in Intel Foundry’s process technology roadmap, featuring advanced RibbonFET gate-all-around (GAA) transistor architecture and PowerVia backside power delivery technologies to help customers optimize the density and performance of their next-generation products. Intel 18A is ideal for IC designs targeting high growth applications including the High-Performance Computing (HPC), mobile and other demanding and fast-growing applications. Intel 18A and Intel 16 are also now enabled with Open Model Interface (OMI), the industry-standard platform for enabling aging modeling and reliability analyses, supported by Siemens’ Solido Simulation Suite.

“Siemens is committed to collaborating with Intel Foundry to provide our mutual customers with the most advanced technologies possible to leverage when designing highly complex ICs and advanced packaging,” said Amit Gupta, vice president and general manager, Custom IC Verification, Siemens Digital Industries Software. “The certification of Solido SPICE and the availability of the EMIB reference flow for early customers by Intel reinforce our joint commitment to providing mutual customers with highly accurate, next-generation tools that enable innovation required to differentiate and win in highly competitive markets.”

Siemens today also announced the availability of the EMIB reference flow that can help Intel Foundry’s early customers utilize the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. With the delivery of this early-adoption Intel Foundry EMIB workflow, Intel Foundry’s customers can tackle the full range of critical tasks needed for a successful design and tape-out. Driven by an Intel Foundry developed and supplied Package Assembly Design Kit (PADK), Intel Foundry’s EMIB customers can also leverage Siemens’ Calibre nmPlatform to validate the EMIB silicon layouts for DRC, LVS, and 3DThermal analysis.

Mutual customers can also conduct package and substrate system planning, design, and verification using Siemens’ Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx SI/PI software, and Calibre 3DSTACK software — leveraging the expertise and world-class technology of Siemens’ industry leading IC and semiconductor packaging portfolios, which provide comprehensive package assembly prototyping and floorplanning with Xpedition Substrate Integrator and predictive shift-left multi-physics analysis from Calibre.

“Intel Foundry is revitalizing the semiconductor industry with new fabrication and highly innovative advanced packaging technologies targeted at taking modern day electronics to entirely new levels. Our collaboration with Siemens for precise EDA enablement is key to nurturing the growing ecosystem,” said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. “The recent certification of Siemens’ newly released Solido SPICE, part of Solido Simulation Suite, to run seamlessly on our advanced process technologies underscores the success we’ve seen in our ongoing close collaboration with Siemens. And by developing a certified, production ready EMIB technology reference flow, Intel Foundry and Siemens EDA have delivered yet another major milestone, empowering IC design companies to boldly innovate complex ICs for any electronic application.”

To learn more about Siemens’ offerings in the integrated circuit design industry, visit: https://eda.sw.siemens.com/en-US/.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

PLANO, TX, June 25, 2024 – Siemens Digital Industries Software announced a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology. Combining the power of Siemens’ Calibre PERC software with the proven SPICE accuracy of its AI-powered Solido Simulation Suite, it provides a fast and highly accurate method for checking compliance against foundry rules spanning all phases of IC design.

Supporting full-chip level verification, the solution helps engineering teams better manage design and manufacturing challenges in both established and emerging process nodes. Its context-aware checks can help to improve the accuracy of results, while reducing turnaround time for physical, circuit, electrical and reliability IC design verification.

The solution’s context-aware checking allows design teams to verify ESD paths quickly, in time to secure waivers from foundry rules that can lead to smaller die sizes and optimized designs – ultimately helping design teams quickly arrive at data driven decisions 8x faster than current methods.

Foundry ESD rules are designed to prevent ESD failures, while accommodating the diverse design styles submitted by fabless companies globally. However, these rules may be overly conservative for specific design styles and mission profiles. By rapidly identifying and simulating ESD paths that might fail foundry rules with detailed transistor-level breakdown models, this Siemens’ new software identifies at-risk paths with SPICE-level precision, allowing for fast, targeted and automated fixes.

“Siemens’ new context-aware ESD simulation solution can help deliver accurate reliability assessment for complex IC designs,” said Silicon Labs’ Michael Khazhinsky, Principal ESD Engineer of Central R&D. “The push-button solution integrates dynamic simulation results from Solido into a full-chip Calibre PERC result that can be used to quickly determine if designs are electrically robust. In the event of circuit errors, this Siemens solution identifies nets and devices that need to be improved.”

Automated context-aware IC design verification can now become a best practice, helping the quick delivery of reliable and timely IC chips to market. Featuring functionalities such as automated voltage propagation, voltage-aware design rule checking, and the integration of physical and electrical information within a logic-driven layout framework, it helps design teams working to tight schedules.

“By leveraging automated context-aware checking, Siemens is empowering design teams to address more quickly the complexities of modern IC design reliability verification,” said Michael Buehler-Garcia, vice president of Calibre Product Management at Siemens Digital Industries Software.” This integration combines the strengths of our dynamic simulation from Solido and sign-off level ESD verification in Calibre PERC. Our integrated solution speeds up the verification process while at the same time ensuring the reliability of IC designs, helping our customers achieve their goals more efficiently. This is the first in a series of solutions that Siemens plans to provide that leverage offerings from different elements of our software portfolio to speed overall design cycle time.”

For more information about Siemens’ new context-aware ESD verification solution, visit https://eda.sw.siemens.com/en-US/ic/calibre-design/reliability-verification/perc/.

And for further information on this topic, please RSVP for Siemens’ luncheon discussion set for June 25 at DAC 2024 at: https://eda.sw.siemens.com/en-US/eda-events/calibre-dac/.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

PLANO, TX, June 25, 2024 – Siemens Digital Industries Software introduced Solido Simulation Suite software (‘Solido Sim’ software), an integrated suite of AI-accelerated SPICE, Fast SPICE and mixed-signal simulators designed to help customers dramatically accelerate critical design and verification tasks for their next-generation analog, mixed-signal and custom IC designs.

Built on the foundation of Siemens’ industry-proven, foundry-certified Analog FastSPICE (AFS) platform, Solido Sim incorporates three innovative new simulators:Solido SPICE software, Solido FastSPICE software and Solido LibSPICE software, as well as Siemens’ market-proven AFS platform, ELDO software and Symphony software.

“Solido Simulation Suite, featuring AI-accelerated SPICE and FastSPICE engines, represents a significant leap forward in custom IC simulation technology, providing unmatched accuracy and efficiency for chip design and verification engineers,” said Michael Ellow, CEO, Silicon Systems, Siemens Digital Industries Software. “Our initial Solido Sim customers have experienced remarkable success across multiple processes technology platforms, all while demonstrating faster runtimes and enabling compelling new capabilities for their next-generation analog, RF, mixed-signal and library IP designs.”

Solido Sim is engineered to help IC design teams meet increasingly stringent specifications, verification coverage metrics and time-to-market requirements. It delivers comprehensive application coverage with best-in-class circuit and System-on-a-Chip (SoC) verification capabilities. Powered by AI technologies, Solido Sim is developed with next-generation process technologies and complex integrated circuit (IC) structures in mind, providing the required toolsets and capabilities to help achieve accurate signal and power integrity goals.

Solido Sim features a simplified use model, accelerated verification and a unified workflow. It delivers a compelling set of innovative new simulation technologies, including:

• Solido SPICE is Siemens’ next-generation, feature-rich SPICE simulation technology, providing a 2-30x speedup for analog, mixed-signal, RF and 3D IC verification. With newer convergence, cache efficient algorithms and high multi-core scalability, Solido SPICE provides a significant performance boost for large pre- or post-layout designs. RF IC developers can directly benefit from Solido SPICE’s new RF verification capabilities, while multi-die, 2.5D, 3D and memory interface developers can now experience an efficient capability for full channel transceiver verification that includesequalization, drastically reducing interface assumptions and accelerating verification.
• Solido FastSPICE is Siemens’ cutting-edge Fast SPICE simulation technology, providing an order-of-magnitude speedup for SoC, memory and analog functional verification. It provides a dynamic use model for SPICE-to-Fast SPICE scaling, providing a scalable interface to help achieve speed goals with predictable accuracy. Solido FastSPICE includes multi-resolution technology for differentiated performance and SPICE-accurate waveforms during critical path analysis for memory and analog characterization.
• Solido LibSPICEis Siemens’ purpose-built batch solver technology for small designs, providing optimized runtimes for Library IP applications. Solido LibSPICE is uniquely integrated into Siemens’ popular Solido Design Environment and Solido Characterization Suite offerings for performance acceleration, enabling a full-flow solution for seamless and robust verification of standard cells and memory bit-cells.

Powering all 3 of these new solvers is Solido Sim AI – the latest version of Siemens’ groundbreaking, AI- accelerated simulation technology. Solido Sim AI is the newest iteration of the AI technology that Solido Design Automation used to pioneer the design and deployment of AI for EDA purposes 15 years ago. With Solido Sim AI, circuit simulation is advanced to the next level with algorithms that are self-verifying and tuned to SPICE accuracy, providing orders-of-magnitude improved acceleration – all accomplished using existing foundry-certified device models without alteration.

Solido Sim integrates natively within Siemens Solido Design Environment and Solido Characterization Suite, offering customers superior performance with optimal accuracy, improved productivity, and scalability across cloud infrastructures. Further, Solido Simulation Suite works closely with Siemens’ industry leading IC sign-off flows Calibre platform Design solutions and Tessent Test solutions as well as Siemens’ electronic systems design and manufacturing PCB solutions, providing full-flow verification solutions across applications.

Availability

The Solido Simulation Suite is now available. To learn more, visit https://eda.sw.siemens.com/en-US/ic/solido/.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

About Siemens Digital Industries

Siemens Digital Industries (DI) is an innovation leader in automation and digitalization. Closely collaborating with partners and customers, DI drives the digital transformation in the process and discrete industries. With its Digital Enterprise portfolio, DI provides companies of all sizes with an end-to-end set of products, solutions and services to integrate and digitalize the entire value chain. Optimized for the specific needs of each industry, DI’s unique portfolio supports customers to achieve greater productivity and flexibility. DI is constantly adding innovations to its portfolio to integrate cutting-edge future technologies. Siemens Digital Industries has its global headquarters in Nuremberg, Germany, and has around 72,000 employees internationally.

About Siemens AG

Siemens AG (Berlin and Munich) is a leading technology company focused on industry, infrastructure, transport, and healthcare. From more resource-efficient factories, resilient supply chains, and smarter buildings and grids, to cleaner and more comfortable transportation as well as advanced healthcare, the company creates technology with purpose adding real value for customers. By combining the real and the digital worlds, Siemens empowers its customers to transform their industries and markets, helping them to transform the everyday for billions of people. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a globally leading medical technology provider shaping the future of healthcare.

In fiscal 2023, which ended on September 30, 2023, the Siemens Group generated revenue of €77.8 billion and net income of €8.5 billion. As of September 30, 2023, the company employed around 320,000 people worldwide. Further information is available on the Internet at www.siemens.com.