Category Archives: Computing

Cadence, TSMC Extend Partnership

to Transform System, Semiconductor Design

SAN JOSE, CA, Apr 25, 2024 – Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics. This collaboration significantly advances system and semiconductor design for AI, automotive, aerospace, hyperscale and mobile applications and has resulted in the following recent technology achievements:

  • Cadence collaborates with TSMC to infuse the Integrity 3D-IC platform with new features and functionality: The Cadence Integrity 3D-IC platform, the industry’s comprehensive solution certified for all the latest TSMC 3DFabric offerings, now supports a hierarchical 3Dblox specification developed to integrate multiple chiplets into hierarchies for reuse and modular design. It also includes new features developed to ease chiplet assembly and design, and an automated alignment markers insertion flow to accelerate the design and assembly of stacked chiplets on different interposers and packages.
  • Cadence’s digital solutions are certified for TSMC N2 design flow, including Innovus Implementation System, Quantus Extraction Solution, Quantus Field Solver, Tempus Timing Signoff and ECO Solution, Pegasus Verification System, Liberate characterization, and the Voltus IC Power Integrity Solution. The Genus Synthesis Solution is also enabled for N2 technology. Cadence and TSMC are collaborating on AI-driven Cadence solutions to enable an AI-assisted design flow for productivity and optimization of PPA results.
  • The Cadence Custom/Analog Design Flow is fully certified for TSMC’s latest N2 Process Design Kit (PDK): Cadence custom tools optimized for TSMC N2 PDKs include Virtuoso Schematic Editor for design capturing and the Virtuoso ADE Suite for analysis, which are both part of Virtuoso Studio, and the integrated Spectre Simulator. All have been enhanced for managing corner simulations, statistical analyses, design centering, and circuit optimization, which are now common with advanced nodes. Virtuoso Studio has also been augmented to support front-to-back process migration from schematic mapping to optimized design specifications to full-layout place-and-route automation. The Virtuoso Studio and Spectre Simulation platforms, including Spectre X, Spectre XPS and the Spectre RF Option, have achieved the latest TSMC N2 certifications.
  • Cadence and TSMC have worked closely together to release a Virtuoso Studio N16 to N6 RF migration reference flow to substantially reduce turnaround time: Purposed-based instance mapping rapidly retargets schematics, while EMX Planar 3D Solver provides inductor synthesis and EM extraction for nets and components during the design phase. The Virtuoso ADE Suite provides design optimization using Spectre Simulation’s RF analysis capabilities, and Virtuoso Studio Layout tools accelerate the reuse and reimplementation of RF layouts while preserving design intent.
  • Cadence announces the availability of a comprehensive portfolio of industry-leading IP cores for TSMC’s N3 process, including:
    • Cadence’s IP for UCIe on TSMC N3 is available in both advanced and standard package options. Cadence also offers IP for UCIe on multiple processes and configurations to enable a comprehensive solution for die-to-die (D2D) interconnect for its customers.
    • The Cadence memory interface IP portfolio (DDR5, LPDDR5 and GDDR6) is silicon-proven with best-in-class system margins and a PPA-optimized architecture that is ready to enable next-generation enterprise, high-performance computing and AI applications.
    • Cadence’s IP for PCIe 5.0/CXL2.0 and PCIe 6.0/CXL3.0 on TSMC N3 are designed to provide the highest link throughput and utilization while operating with low latency, providing customers with SoC design excellence.
  • The Cadence EMX 3D Planar Solver has received certification for TSMC’s N5 process technology: This certification enables joint customers to seamlessly integrate the EMX Solver into their advanced-node IC design flow, allowing for highly accurate EM analysis that can overcome the challenges of EM crosstalk and parasitics. Additionally, certification for N2 and N3 process technology is well underway.
  • Cadence unveils a new silicon photonics flow to support TSMC’s Compact Universal Photonic Engine (COUPE) technology: Cadence and TSMC collaborate to develop a design flow for the COUPE 3D photonics process that features the Cadence Integrity 3D-IC platform. The TSMC COUPE technology enables the heterogeneous integration of photonics ICs with electrical ICs while minimizing coupling losses. The developing design flow from Cadence will support TSMC’s COUPE technology and includes the Cadence Spectre X Simulator, Virtuoso Studio, EMX 3D Planar Solver and Pegasus Verification System, enabling joint customers to meet the most demanding system requirements and pave the way for high-performance computing applications.

“We have a distinguished track record collaborating with TSMC to deliver a broad set of innovations across EDA, packaging and IP to accelerate system and semiconductor design and enable customers to achieve aggressive time-to-market goals,” said Chin-Chi Teng, SVP and GM, R&D, Cadence. “These new certified design flows and standardized solutions allow customers to confidently design for TSMC advanced nodes and usher in improved design efficiency and technological advancements.”

“TSMC works closely with Cadence to accelerate customer innovation by providing high-quality design tools certified for use with our most advanced processes,” said Dan Kochpatcharin, Head of the Design Infrastructure Management Division at TSMC. “Through our longstanding collaboration, we’re able to deliver greater value for the most advanced SoC designs, benefiting from the significant power and performance boost afforded by our latest technology innovations.”

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For 10 years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For.

Learn more at cadence.com.

Digital Twin Capabilities Periodic Table v1.1 Released

BOSTON, MA, Apr 25, 2024 – Digital Twin Consortium (DTC) announced version 1.1 of the Digital Twin Capabilities Periodic Table (CPT), an architecture and technology agnostic requirements definition framework for organizations that want to design, develop, deploy, and operate digital twins based on use case capability requirements versus the features of technology solutions.

The CPT follows a periodic table approach with capabilities grouped around common characteristics. It provides visual guidance for collaboration, brainstorming, and making capability requirements explicit. The latest iteration reflects our commitment to continuous improvement, driven by our community’s valuable insights and active participation.

“CPT Version 1.1 provides important additions that continue to emphasize capabilities over specific technologies and includes a revised machine-readable schema for greater ease of implementation,” said Pieter Van Schalkwyk, CEO of XMPro, co-chair of the AI Joint Working Group, part of OMG / Digital Twin Consortium. “Serving as the key part of the Composability Framework, the CPT facilitates greater flexibility and innovation, ensuring that digital twin system development focuses on interoperability, scalability, design reuse, and aligned with the evolving needs of businesses.”

“We are laying a robust foundation for the evolution of the Capabilities Periodic Table with a structured approach and integration of new capabilities like responsibility and search,” said Dan Isaacs, GM & CTO, DTC. “We’re already working on V2 of the CPT, with plans to increase interoperability with AI, better incorporate geospatial and related spatial computing topics, and provide more guidance on aligning use cases.”

V1.1 of the CPT includes the following enhancements:

  • Responsibility as a Core Capability – Responsibility is introduced as a trustworthiness capability in Version 1.1, emphasizing ethical considerations. This encapsulates ethics, ESG criteria, AI explainability, and fairness, underscoring the need for responsible and trustworthy digital twin operations.
  • Search Capability – One of the new capabilities in Version 1.1 is ‘Search.’ Far from being just a feature within the table, it’s a fundamental capability for digital twins to navigate and manage complex datasets within their environments efficiently.
  • Consolidated and Refined Capabilities – Extended Reality (XR): They’ve consolidated augmented reality (AR) and virtual reality (VR) into Extended Reality (XR), reflecting the convergence of these technologies and supporting an integrated approach to immersive experiences.
  • Domain Specific Data Management – They’ve reclassified temporal data stores under “Domain Specific Data Management,” acknowledging the variety of domain-specific data types, such as geospatial data, essential for digital twins.
  • Structured Abbreviations – Moving beyond sequential numbering, version 1.1 adopts structured abbreviations for each capability. This change facilitates quicker reference and aligns with our goal of making the CPT more intuitive and accessible.
  • Capability Mapping – To ease the transition from the initial framework, we provide a detailed mapping from the 1.0 to 1.1 capabilities. This guide ensures that existing users can adapt to the updated version with minimal disruption.

Download CPT V1.1

About Digital Twin Consortium

Digital Twin Consortium is The Authority in Digital Twin. It coalesces industry, government, and academia to drive consistency in vocabulary, architecture, security, and interoperability of digital twin technology. It advances digital twin technology in many industries, from aerospace to natural resources.

For more information about Digital Twin Consortium, please visit www.digitaltwinconsortium.org.

Kalray Joins Arm Total Design

GRENOBLE, France, Apr 24, 2024 – Kalray, a leading provider of hardware and software solutions to accelerate data intensive workflows from Cloud to Edge, announced that it has extended its collaboration with Arm by joining Arm Total Design. Through a deeper connection to industry leaders who are leveraging Arm Neoverse Compute Subsystems (CSS), Kalray can help more companies integrate its unique AI and data acceleration technology and help Arm ecosystem partners commercialize AI-based solutions in a fraction of the time and cost usually needed.

Arm Total Design helps accelerate and simplify the delivery of custom silicon based on Arm Neoverse CSS and has grown to more than 20 partners, including the top three leading foundries, ASIC design houses, IP vendors, EDA tool providers, and firmware developers who are driving leading-edge innovation.

Kalray is already working to integrate Arm Coherent Mesh Network (CMN) technology to help easily connect Kalray’s advanced AI and data processing acceleration solution to Arm Neoverse CSS.

As a member of the Arm Total Design ecosystem, Kalray can move swiftly with the latest Arm technologies and thus ease the access to Kalray’s advanced AI and data processing capabilities to adopters of Arm Neoverse technology – and in doing so, facilitate their rollout of AI across numerous use cases and industries.

“The proliferation of AI has led to an unprecedented demand for more compute power and flexibility, which is a driving force behind the momentum of Arm Neoverse in the data center and beyond,” said Eddie Ramirez, vice president of go-to-market, Infrastructure Line of Business, Arm. “Kalray is bringing its expertise in AI acceleration and efficient data processing to the Arm Total Design ecosystem, enabling partners to more easily integrate these capabilities as they build custom silicon solutions to maximize performance and efficiency.”

“AI workloads are exerting profound changes in the semi-conductor industry with their insatiable demand for data processing,” said Eric Baissus, Kalray CEO. “Kalray is proud to be among the best of the best in the industry as part of the Arm Total Design ecosystem. We look forward to helping more technology players to use the AI and data acceleration capabilities of Kalray’s DPU technology so they can deliver innovative AI processing solutions across the industry.”

About Kalray

Kalray is a technology innovator specializing in software and hardware solutions to accelerate data-intensive workflows in media & entertainment, high-performance computing, and artificial intelligence. Their comprehensive product range features ngenea, a leading data acceleration platform, as well as accelerated data processing cards for storage and compute.

With Kalray solutions, customers can scale their infrastructures to efficiently meet the performance and capacity needs of data-intensive tasks, all without being tied to specific data formats or vendors.

Founded in 2008 as a spin-off from the French CEA research lab, Kalray has corporate and financial backing from notable investors such as Alliance Venture (Renault-Nissan-Mitsubishi), NXP Semiconductors, and Bpifrance.

For more information, visit www.kalrayinc.com.

Akamai Announces Cloud Infrastructure, Services by NVIDIA

LAS VEGAS, NV, Apr 17, 2024 – Akamai Technologies, Inc., the cloud company that powers and protects life online, added a new media-optimized offering based on NVIDIA GPUs to its growing cloud portfolio. With the NVIDIA RTX 4000 Ada Generation GPU, the new cloud-based service provides better productivity and economics for companies in the media and entertainment industry that are challenged with processing video content faster and more efficiently.

Internal benchmarking conducted by Akamai demonstrated that GPU-based encoding using the NVIDIA RTX 4000 processes frames per second (FPS) 25x faster than traditional CPU-based encoding and transcoding methods, which presents a significant advancement in the way streaming service providers address their typical workload challenges.

Using Akamai’s offering, media and entertainment companies can build scalable, resilient architectures and deploy workloads that will be faster, more reliable, and portable, while taking advantage of the world’s most distributed cloud platform and integrated content delivery and security services.

“Media companies need low-latency, reliable compute resources that maintain the portability of the workloads they create,” said Shawn Michels, vice president of cloud products at Akamai. “NVIDIA GPUs provide superior price performance when deployed on Akamai’s global edge platform. Together with our Qualified Compute Partners and open platform, we give our customers the capability to architect their next-gen workloads to be cloud agnostic and support multicloud architectures.”

The need for industry optimized GPUs

In a market hyper-focused on using NVIDIA GPUs to support large language modeling, Akamai’s media-tailored GPU service homes in on an industry underserved by current industry offerings, which can be expensive. Building on its rich heritage and deep experience in the space, Akamai fine-tuned its new GPU offering to meet the demanding and specific requirements of the media and entertainment industry.

Use cases

The NVIDIA RTX 4000 GPU achieves the speed and power efficiency necessary to tackle demanding creative, design, and engineering workflows for digital content creation, 3D modeling, rendering, inferencing, and video content and streaming. Media-specific use cases include:

  • Video transcoding and live video streaming: GPUs can perform faster-than-real-time transcoding of live video streams, improving the streaming experience by reducing buffering and even playback, while GPU-based encoding improves efficiency and reduces processing times compared with traditional CPU-based transcoding. The NVIDIA RTX 4000 GPU is equipped with the latest-generation NVIDIA NVENC and NVDEC hardware, which enables additional capacity for simultaneous encoding and decoding tasks. This is critical for applications requiring high-throughput video processing, such as live streaming. The eighth-generation NVENC engines provide support for the latest video codecs, including the highly efficient AV1 codec, which enables higher-quality video at lower bitrates.
  • Virtual reality (VR) and augmented reality (AR) content: VR and AR applications require the rendering of 3D graphics and multimedia content in real time. GPUs are ideal for processing such content.

While Akamai optimized the new solution for the media market, the new offering also has applicability for developers and companies looking to build apps tied to several other industry use cases, including:

  • Generative artificial intelligence and machine learning (Gen AI/ML): One of the primary applications of GPU cloud computing is in generative AI/ML. GPUs are well-suited for tasks such as training and inference with neural networks, as they can perform many calculations in parallel, which allows faster and more efficient training of new models, which can lead to better accuracy and performance. The NVIDIA RTX 4000 GPU harnesses the NVIDIA Ada Lovelace architecture to deliver exceptional performance in inferencing tasks. A total of 192 fourth-generation Tensor Cores accelerate more data types and include a new Fine-Grained Structured Sparsity feature for up to 4x the throughput for tensor matrix operations when compared with the previous generation. The inclusion of 20 GB of GDDR6 memory provides extensive capacity for large models and datasets.
  • Data analysis and scientific computing: GPU cloud computing is also commonly used in data analysis and scientific computing because of the nature of its tasks, which often involve processing large amounts of data. These tasks are time-consuming and computationally intensive. GPUs can help accelerate these tasks by processing large amounts of data in parallel, which enables faster and more efficient analysis and simulation.
  • Gaming and graphics rendering: GPUs are widely used in the gaming industry, mainly for graphics rendering and other tasks related to video game development. This is because GPUs are designed to handle complex graphics processing and can provide fast, high-quality rendering of 3D graphics.
  • High-performance computing: GPU-enabled cloud computing is commonly used for high-performance computing applications, such as modeling and simulation, that require fast and efficient processing of large amounts of data. GPUs can also be used to accelerate simulations, calculations, and other computationally intensive tasks, which leads to faster results and better performance.

“In order to support a wide range of workloads, you need a wide array of compute instances,” continued Michels. “What we’re doing with industry-optimized GPUs is one of many steps we’re taking for our customers to increase instance diversity across the entire continuum of compute to drive and power edge native applications.”

About Akamai

Akamai powers and protects life online. Leading companies worldwide choose Akamai to build, deliver, and secure their digital experiences — helping billions of people live, work, and play every day. Akamai Connected Cloud, a massively distributed edge and cloud platform, puts apps and experiences closer to users and keeps threats farther away.

Learn more about Akamai’s cloud computing, security, and content delivery solutions at akamai.com.

AMD Announces Versal Series Gen 2

NUREMBERG, Germany, Apr 11, 2024 – AMD announced the expansion of the AMD Versal adaptive system on chip (SoC) portfolio with the new Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 adaptive SoCs, which bring preprocessing, AI inference, and postprocessing together in a single device for end-to-end acceleration of AI-driven embedded systems.

These initial devices in the Versal Series Gen 2 portfolio build on the first generation with powerful new AI Engines expected to deliver up to 3x higher TOPs-per-watt than first generation Versal AI Edge Series devicesi, while new high-performance integrated Arm CPUs are expected to offer up to 10x more scalar compute than first gen Versal AI Edge and Prime series devicesii.

“The demand for AI-enabled embedded applications is exploding and driving the need for single-chip solutions for the most efficient end-to-end acceleration within the power and area constraints of embedded systems,” said Salil Raje, senior vice president and general manager, Adaptive and Embedded Computing Group, AMD. “Backed by over 40 years of adaptive computing leadership, these latest generation Versal devices bring together multiple compute engines on a single architecture offering high compute efficiency and performance with scalability from the low-end to high-end.”

Balancing performance, power, area, together with advanced functional safety and security, Versal Series Gen 2 devices deliver new capabilities and features that enable the design of high-performance, edge-optimized products for the automotive, aerospace and defense, industrial, vision, healthcare, broadcast and pro AV markets.

Powering Subaru’s Next-Gen ADAS Vision System

Subaru Corporation has selected Versal AI Edge Series Gen 2 devices for the company’s next-generation advanced driver-assistance system (ADAS) vision system, known as EyeSight. The EyeSight system is integrated into select Subaru car models to enable advanced safety features, including adaptive cruise control, lane-keep assist, and pre-collision braking. Subaru is using AMD adaptive SoC technology in current EyeSight-equipped vehicles.

“Subaru has selected Versal AI Edge Series Gen 2 to deliver the next generation of automotive AI performance and safety for future EyeSight-equipped vehicles,” said Satoshi Katahira, general manager, Advanced Integration System Department & ADAS Development Department, Engineering Division, Subaru Corp. “Versal AI Edge Gen 2 devices are designed to provide the AI inference performance, ultra-low latency, and functional safety capabilities required to put cutting-edge AI-based safety features in the hands of drivers.”

Versal AI Edge Series Gen 2

To meet the complex processing needs of real-world systems, AMD Versal AI Edge Series Gen 2 devices incorporate an optimal mix of processors for all three phases of AI-driven embedded system acceleration:

  • Preprocessing: FPGA programmable logic for real-time preprocessing with unparalleled flexibility to connect to a wide range of sensors and implement high-throughput, low-latency data-processing pipelines
  • AI Inference: An array of vector processors in the form of next-gen AI Engines for efficient AI inference
  • Postprocessing: Arm CPU cores providing the postprocessing power needed for complex decision-making and control for safety-critical applications.

This single-chip intelligence can eliminate the need to build multi-chip processing solutions, resulting in smaller, more efficient embedded AI systems with the potential for shorter time-to-market.

Versal Prime Series Gen 2

The AMD Versal Prime Series Gen 2 provides end-to-end acceleration for traditional, non-AI-based embedded systems by combining programmable logic for sensor processing with high-performance embedded Arm CPUs. Designed to offer up to 10x more scalar compute compared to the first generation, these devices can efficiently handle sensor processing and complex scalar workloads.

With new hard IP for high-throughput video processing, including up to 8K multi-channel workflows, Versal Prime Gen 2 devices are ideally suited for applications such as ultra-high-definition (UHD) video streaming and recording, industrial PCs, and flight computers.

Broad and Scalable Portfolio

The Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 portfolios provide scalability from edge sensors to centralized compute for AI-driven systems. They feature a range of devices with increasing amounts of AI and adaptive compute to allow customers to select the performance, power, and area footprints to efficiently achieve application performance and safety targets.

Streamlined Design Cycles

The AMD Vivado Design Suite tools and libraries help boost productivity and streamline design cycles for embedded hardware system developers, offering fast compile times and enhanced quality of results. For embedded software developers, the AMD Vitis Unified Software Platform enables embedded software, signal processing, and AI design development at users’ preferred levels of abstraction, with no FPGA experience needed.

Designers can get started with AMD Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 early access documentation and first-generation Versal evaluation kits and design tools available today. AMD expects availability of Versal Series Gen 2 silicon samples in the first half of 2025, followed by evaluation kits and System-on-Modules samples in mid-2025, and production silicon expected in late 2025.

About AMD

For more than 50 years AMD has driven innovation in high-performance computing, graphics, and visualization technologies. Billions of people, leading Fortune 500 businesses, and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work, and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible.

For more information, visit AMD website.

ASUS Announces Zenbook 14 OLED (UM3406)

FREMONT, CA, Apr 10, 2024 – ASUS has announced the all-new Zenbook 14 OLED (UM3406) , a sleek and sophisticated ultraportable laptop. Its thin-and-light chassis houses the power of the latest AI-enabled AMD Ryzen 7 8840HS processor along with AMD Radeon graphics, allowing users to amplify their efficiency.

Premium ultraportable design

Zenbook 14 OLED (UM3406) delivers uncompromising mobility with its sleek, lightweight, and sturdy all-metal design and enhanced-lifespan 75 Wh battery. At just over half an inch thin and weighing only 2.8 lbs. [i], the elegant chassis is around 10% more compact than the previous generation. The specially designed battery supports up to 20% more charging cycles compared to previous models, protecting the user’s investment, and helping to increase the laptop’s longevity. It also offers long-lifespan of unplugged operation for all-day productivity. Additionally, USB-C Easy Charge makes it simple to recharge from any suitable USB-C adapter, power outlet, or power bank.

Premium performance

Built around the latest AI-powered AMD Ryzen 7 8840HS processor with AMD Radeon graphics, Zenbook 14 OLED (UM3406) packs a powerful punch. Its ultrafast up to 1 TB SSD storage, 16 GB RAM and WiFi 6E (802.11ax) allow users to wait less and work faster, wherever they are.
The AMD Ryzen 7 8840HS processor features the integrated AMD Ryzen AI Accelerator which, combined with intelligent workload optimization, frees up CPU and GPU resources for optimal performance. Beyond performance and power efficiency, Ryzen AI unlocks new possibilities – it accelerates multitasking, enhances real-time video quality, boosts productivity, fosters collaboration, and paves the way for future advancements. For added convenience, Zenbook 14 OLED [ii] has a dedicated Copilot key that allows users to effortlessly dive into Windows 11’s AI-powered tools with just one press.

The vivid WUXGA (1920X1200) ASUS Lumina OLED 60 Hz display makes every moment incredible with its 500-nit peak brightness, web-friendly 16:10 aspect ratio, and 87% screen-to-body ratio. Additionally, adaptive sync automatically adjusts the refresh rate for always-smooth visuals.

Despite its ultra-compact form factor, Zenbook 14 OLED (UM3406) includes a comprehensive set of full-size high-speed I/O ports – including USB 4.0 Gen 3 Type-C, USB 3.2 Gen 2 Type-C, USB 3.2 Gen 1 Type-A, HDMI 2.1 (TMDS) and a convenient 3.5 mm audio jack – so users don’t need to carry dongles or adapters around with them.

Premium user experience

Zenbook 14 OLED (UM3406) is designed with the user firmly in mind, incorporating a range of advanced features to enhance their on-the-go lifestyle. Whatever the user is listening to, the powerful, crystal-clear sound delivered by new super-linear speakers, smart amplifier, and ASUS Audio Booster in the Harman Kardon-certified audio system will give their ears a treat with the multidimensional Dolby Atmos sound.
When late-night deadlines approach, the new quiet ASUS ErgoSense keyboard reduces aural distractions to a minimum while offering a supremely comfortable typing experience – thanks to the fine-tuned key pitch, dished key caps, and ergonomic key travel.
To guard the user’s privacy, the FHD IR camera has a physical shutter. Additionally, an exceptional video conferencing experience is assured by the AI noise cancelation and built-in camera enhancements for crystal-clear audio and crisp video.

Made for the Earth

ASUS is committed to do more with less through Zenbook. Zenbook 14 OLED (UM3406) aims to minimize its environmental impact across the entire product lifecycle – from material use and manufacturing, through assembly, use, and end of life. We have mitigated its carbon footprint by incorporating up to 50% post-consumer-recycled (PCR) materials and designing eco-conscious packaging that is 100% recyclable. To maximize the lifespan of the laptop – and therefore improve sustainability – strict US military-grade testing under a stringent test regime ensures outstanding durability.

Availability & Pricing

ASUS Zenbook 14 OLED (UM3406) is now available starting MSRP $849.99 on the ASUS Store and Walmart. Please contact your local ASUS representative for further information.

Specifications[Iii]

ASUS ZenBook 14 OLED (UM3406)
CPU AMD Ryzen 7 8840HS processor
Display 14″ 16:10 WUXGA (1920 x 1200) Touch ASUS Lumina OLED NanoEdge display with 87% screen-to-body ratio, 500 nits HDR peak brightness, 100% DCI-P3 color gamut, DisplayHDR True Black 500, UV, VESA, 60Hz refresh rate
Operating system Windows 11 Home
Graphics AMD Radeon graphics
Main memory 16 GB LPDDR5x 7500 MHz RAM
Storage 1 TB PCIe Gen 4 SSD
512 GB PCIe Gen 4 SSD
Connectivity WiFi 6E (802.11ax)
Bluetooth 5.3
Camera FHD IR / 3DNR / ACS camera
I/O ports 1 x USB 4 Gen 3 Type-C
1 x USB 3.2 Gen 2 Type-C
1 x USB 3.2 Gen 1 Type-A
1 x HDMI 2.1 (TMDS)
1 x Audio jack
Touchpad 5.1 x 2.9 inch ASUS ErgoSense touchpad
Audio Built-in speakers
Smart amplifier technology
Built-in microphone
Harman Kardon certified
Dolby Atmos certified
Battery 75 Wh
AC adapter 65 W adapter
Adapter Output: 5V~20V, 65 W
Adapter Input: 100~240 V AC, 50 / 60 Hz universal
Dimensions 12.30 x 8.67 x 0.59 inches
Weight 2.82 lbs.

 

About ASUS

ASUS is a global technology leader that provides the world’s most innovative and intuitive devices, components and solutions to deliver incredible experiences that enhance the lives of people everywhere. With its team of 5,000 in-house R&D experts, ASUS is world-renowned for continuously reimagining today’s technologies for tomorrow, garners more than 11 awards every day for quality, innovation and design, and is ranked among Fortune’s World’s Most Admired Companies.

[i] Weight may vary according to specifications. 

[ii] This feature is exclusive to Zenbook 14 OLED (UM3406). 

[iii] Specifications, content, and product availability are all subject to change without notice and may differ from country to country. Actual performance may vary depending on applications, usage, environment, and other factors. Full specifications are available at http://www.asus.com.