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February 2023

Implementing DFT in 2.5D/3D Design using Tessent Test Solutions

February 9 @ 9:00 am

how Tessent Multi-die supports IEEE 1838 standard, including how Tessent Streaming Scan Network can be used as Flexible Parallel Port for standard

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March 2023

Utilizing Thermal Transient Testing to Improve Manufacturing

March 1

using thermal transient testing to measure temperature changes in semiconductor packaging, identify potential manufacturing defects

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