TROY, MI, June 18, 2024 – Altair, a global leader in computational intelligence, announced that Altair One, Altair’s cloud innovation gateway, is now available on Google Cloud Marketplace, opening up a world of possibilities for users seeking seamless access to powerful simulation, data analytics, and high-performance computing (HPC) capabilities.

Altair One is designed for collaborative engineering, data engineering, and analytical application development. Built on a robust HPC backbone, Altair One provides seamless, unified access to tools, data, and computing resources while unleashing the power of artificial intelligence (AI) across every step of the product development life cycle.

Google Cloud Marketplace customers can now leverage Bring Your Own Cloud (BYOC) functionality to run Altair simulation, AI, and data analytics applications.

“The integration of Altair One with the Google Cloud Marketplace empowers Google Cloud users to effortlessly unlock a world of innovative solutions. This collaboration will fuel engineering breakthroughs with the power of Google Cloud’s adaptable, flexible, and scalable cloud infrastructure,” said Sam Mahalingam, chief technology officer, Altair. “This integration aligns perfectly with our core mission of equipping businesses for digital success and making powerful software solutions readily accessible to users.”

“Bringing Altair One to Google Cloud Marketplace will help customers quickly deploy, manage, and grow the platform on Google Cloud’s trusted, global infrastructure,” said Dai Vu, managing director, Marketplace and ISV GTM Programs, Google Cloud. “Altair can continue to securely scale and support customers on their digital transformation journeys.”

Altair One is the gateway that empowers organizations to mature into digital enterprises by breaking down data silos, connecting virtual models, optimizing their compute infrastructure, and digitizing key processes. It provides all the tools to create a “One Total Twin” of a product throughout its lifecycle, “One Traceable Thread” connecting all data stages, and a “Single Source of Truth” for all models and data. This all-in-one platform automates data capture, empowers better decision-making, enhances performance management, and ultimately accelerates engineering processes for a seamless digital experience.

To learn more, visit https://console.cloud.google.com/marketplace/product/altair/altair-one-private?hl=en&project=altair-public.

About Altair

Altair is a global leader in computational intelligence that provides software and cloud solutions in simulation, high-performance computing (HPC), data analytics, and AI. Altair enables organizations across all industries to compete more effectively and drive smarter decisions in an increasingly connected world – all while creating a greener, more sustainable future.

To learn more, please visit www.altair.com.

SEATTLE, WA (CVPR), June 18, 2024 – NVIDIA announced NVIDIA Omniverse Cloud Sensor RTX, a set of microservices that enable physically accurate sensor simulation to accelerate the development of fully autonomous machines of every kind.

Sensors, which comprise a growing, multibillion-dollar industry, provide autonomous vehicles, humanoids, industrial manipulators, mobile robots and smart spaces with the data needed to comprehend the physical world and make informed decisions. With NVIDIA Omniverse Cloud Sensor RTX, developers can test sensor perception and associated AI software at scale in physically accurate, realistic virtual environments before real-world deployment — enhancing safety while saving time and costs.

“Developing safe and reliable autonomous machines powered by generative physical AI requires training and testing in physically based virtual worlds,” said Rev Lebaredian, vice president of Omniverse and simulation technology at NVIDIA. “NVIDIA Omniverse Cloud Sensor RTX microservices will enable developers to easily build large-scale digital twins of factories, cities and even Earth — helping accelerate the next wave of AI.”

Supercharging Simulation at Scale

Built on the OpenUSD framework and powered by NVIDIA RTX ray-tracing and neural-rendering technologies, Omniverse Cloud Sensor RTX accelerates the creation of simulated environments by combining real-world data from videos, cameras, radar and lidar with synthetic data.

Even for scenarios with limited real-world data, the microservices can be used to simulate a broad range of activities, such as whether a robotic arm is operating correctly, an airport luggage carousel is functional, a tree branch is blocking a roadway, a factory conveyor belt is in motion, or a robot or person is nearby.

Research Wins Drive Real-World Deployment

The Omniverse Cloud Sensor RTX announcement comes at the same time as NVIDIA’s first-place win at the Computer Vision and Pattern Recognition conference’s Autonomous Grand Challenge for End-to-End Driving at Scale.

NVIDIA researchers’ winning workflow can be replicated in high-fidelity simulated environments with Omniverse Cloud Sensor RTX — giving autonomous vehicle (AV) simulation developers the ability to test self-driving scenarios in physically accurate environments before deploying AVs in the real world.

Ecosystem Access and Availability

Foretellix and MathWorks are among the first software developers to which NVIDIA is providing Omniverse Cloud Sensor RTX access for AV development.

Omniverse Cloud Sensor RTX will also enable sensor manufacturers to validate and integrate digital twins of their sensors in virtual environments, reducing the time needed for physical prototyping.

Sign up for early access to Omniverse Cloud Sensor RTX, which will be available later this year.

About NVIDIA

NVIDIA is the world leader in accelerated computing. For more information, visit www.nvidia.com.

LOS ANGELES, CA, June 13, 2024 – Dyndrite, providers of the GPU-accelerated computation engine used to create next-generation digital manufacturing hardware and software, along with Materials Consortium members Constellium, Elementum3D, and Sandvik announced the selection of MIMO Technik and ASTRO Mechanical Testing Laboratory as lead fabrication and testing partner for developing open Laser Powder Bed Fusion (LPBF) parameter sets for consortium member materials in the USA. The consortium will leverage the company’s MASTRO method and Dyndrite software to speed development and delivery.

The AM Materials Consortium, founded by Dyndrite, along with Constellium, a global leader in the development and manufacturing of high value-added aluminum products and solutions, including Aheadd Aluminum Powders such as CP1 for Additive Manufacturing, Elementum 3D, providers of innovative gas atomized aluminum alloy additive manufacturing feedstock powders, and Sandvik a global, high-tech engineering group providing solutions that enhance productivity, profitability and sustainability for the manufacturing, mining and infrastructure industries, is charted with making common (LPBF) powder parameters and related testing data freely available to end users – enabling increased knowledge sharing, better outcomes, and faster adoption of AM machines, materials and techniques.

The Materials Consortium will hold its first public event the day before the start of RapidTCT on June 24, 2024 from 6 PM to 9 PM at MIMO Technik’s headquarters in Los Angeles, CA. Parties interested in attending can request an invitation here.

MIMO Technik and ASTRO has spent the last two years developing the “MASTRO AM-MCQP-2024: Additive Material Characterization and Qualification Protocol for Production Readiness”, a process for streamlining qualification efforts for the additive industry. The hyperfast qualification process involves iterative experiments to determine values for all variables that influence the metal printing process. These parameters are then stored in Dyndrite Build Recipes for usage. The platform consists of standardized and shareable MASTRO Dyndrite build recipes, which are used for parameter development and the ASTRO testing process. MASTRO-qualified materials are now in production for fracture-critical hardware such as landing gear, propulsion systems, payload structures, and defense applications. The MASTRO Dyndrite process is the foundation of this protocol and can be explored here: www.mastro.vision.

Historically, materials and process development has been a long, costly, and labor-intensive process. The Consortium aims to disrupt this tradition and provide for a more streamlined and cost-effective future for qualifying additive manufacturing materials and processes for LPBF machines.

“A lack of known, well-tested, and flexible printing parameter sets is slowing adoption of additive manufacturing,” said Ravi Shahani PhD, additive manufacturing chief engineer, Constellium. “Metal 3D users are either limited by materials offered by their OEM, or waste an inordinate amount of time and resources developing, and requalifying parameter sets, often starting from scratch each time. Working with Dyndrite and MASTRO users can now leverage the transparency of publicly available, tested parameter sets, upon which to build.”

“The team at Elementum 3D has appreciated Dyndrite’s partnership in co-developing parameter sets for our robust material set.  We believe that the partnership that we have with Dyndrite and the rest of the AM Materials Consortium members will lead to continued success of developing faster, more reliable parameter sets for materials of the future with production success in mind.”

“Sandvik has been producing metal powders for 45 years and LPBF powders for over 20 years, offering the widest selection of alloy powders,” said Luke Harris, sales director for Sandvik’s metal powder business. “Working with our consortium partners, we can democratize AM knowledge, accelerate technology adoption, and drive industry innovatIon.”

Dyndrite LPBF Pro, a GPU-powered 3D application brings tremendous power and control to the additive CAM and materials and process development process. Engineers can now develop sophisticated and repeatable toolpathing and manufacturing processes. It offers advanced tools for process development, including 3D geometric queries to detect and optimize print parameters for difficult to print geometric features such as domes, cantilevers, and thin walls. Users can also speed build rates, expand available materials, improve part quality, and deploy support-free print strategies. The software supports 3D metal printers, including Aconity 3D, EOS, NikonSLM, Renishaw, and more.

“We’ve enjoyed working with MimoTechnik and Astro Testing in applying Dyndrite LPBF Pro to the previously manual and laborious world of parameter development,” said Steve Walton, head of product at Dyndrite. “In powering the MASTRO process we speed the delivery of public metal 3D printing parameter sets to market, opening new opportunities for companies leveraging metal 3D printing for rocketry, aerospace, automotive and numerous other uses. We look forward to working with our materials partners to bring many open parameter sets to market.”

“Dyndrite has been the perfect partner to address the complexities of collecting significant data for understanding manufacturing with novel superalloys,” said Jonathan Cohen, CEO & co-founder of Mimo Technik. “The journey of bringing a new material into the AM process is fraught with challenges. Recognizing this, our teams embarked on demystifying the process, ensuring that the standardization of testing and data collection, following the development of parameter sets, is straightforward and unambiguous.”

“Our goal was clear from the outset: to streamline the process for organizations to onboard new materials and become production-ready on their machines sooner,” said Humna Khan, CEO and co-founder of Astro. “We aim to reduce the iterative process traditionally associated with material qualification, lowering both the time to market and the cost of introducing new parts. By establishing a clear, standardized framework for material characterization and qualification, we are not just facilitating a smoother entry to market but also fostering confidence in the parts produced through AM.”

About Dyndrite

Dyndrite’s mission is to fundamentally change how geometry is created, transformed and transmitted on a computer. Their Accelerated Computation Engine (ACE) is the world’s first (geometry agnostic), multi-threaded, GPU-accelerated Geometry Engine. We create and license tools that give companies the power, freedom and control necessary to deliver on the potential of digital manufacturing.

Dyndrite products include, Dyndrite LPBF Pro, a powerful software solution designed to enhance the capabilities of Laser Powder Bed Fusion (LPBF) for metal 3D printing. It provides users with previously unattainable part printing capabilities, accelerated build rates, and unprecedented productivity. Dyndrite LPBF Pro is compatible with a wide range of metal 3D printing machines, including brands such as Aconity3D, EOS, Renishaw, NikonSLM, among others.

Investors include Gradient Ventures, Google’s AI-focused Investment Fund and former Autodesk CEO Carl Bass. The company was founded in 2015 and is headquartered in Seattle, WA. Dyndrite was named a World Economic Forum Technology Pioneer for 2021.

For more information, visit www.dyndrite.com.

About MIMO Technik

MIMO Technik develops manufacturing solutions in the AM space for aerospace, rocketry, energy, defense and motorsport clients. With a deep investment in the latest technology, software, processes, and parameter development, MIMO offers specialized solutions and supports critical programs, with a team of experts. MIMO’s AM-Center: PRINT METAL in southern California has been built to accelerate series production needs. With the MASTRO process, MIMO has qualified materials for industry primes such as Boeing, Lockheed Martin, and Northrop Grumman.

For more information, visit www.mimotechnik.com.

About Astro Mechanical Testing Laboratory

ASTRO serves as the preferred test laboratory for prominent aerospace primes and advanced space enterprises at the forefront of embracing advanced materials and engineering. ASTRO’s efforts with AM industry leaders involve a close examination of the characteristics of cutting-edge alloys and composites. Through testing partnerships, ASTRO drives advancements in design and manufacturing processes, seamlessly integrating future technologies into the aerospace landscape.

For more information, visit www.astrotestlab.com.

SEATTLE, WA, June 11, 2024 – Dyndrite, providers of the GPU-accelerated computation engine used to create next-generation digital manufacturing hardware and software announced it has been selected by AFWERX for an AFVentures Open Topic 24.D Phase I cohort award. The Dyndrite selection will focus on defining and commercializing a Software Defined Process Qualification (SDP Qual) Process for Laser Powder Bed Fusion (LPBF) to address the most pressing 3D metal printing qualification/ requalification challenges in the Department of the Air Force (DAF).

Metal additive manufacturing (AM) offers unparalleled opportunities for both the U.S. Air Force (USAF) and the commercial manufacturing sectors. However, the full potential of these benefits is hindered by the significant time and cost involved using today’s means and methods for developing AM parts, materials, and machines, along with the extensive testing and analysis needed for qualification and requalification. Consequently, compromising the agility of the USAF’s AM processes.

A rigorous qualification process is essential to ensure that all standards for quality and safety are consistently met. Dyndrite addresses these needs by incorporating scriptable workflows into qualification and requalification, dynamically automating the entire build layout process. Automating laborious manual tasks like, part import, positioning, supporting, toolpath parameters, laser parameter, labeling, traceable reporting will contribute significantly to reductions in the time and resources associated with qualification.

Dyndrite’s fundamentally new SDP Qual approach enables users to easily adapt to technological advancements and shifts in the supply chain without undergoing costly, time-consuming, manual, qualification processes. Using Dyndrite’s solution, the Air Force will save considerable time and costs by rapidly conducting efficient qualification workflows to ensure their AM production is repeatable and predictable.

“We are proud of the recognition by AFRL of the value of Dyndrite’s modern approach to additive manufacturing qualification,” said, Steve Walton, head of product for Dyndrite. “Our agile software-based process is a core ingredient to making AM a reliable, repeatable and cost effective serial production process.”

To learn more about Dyndrite within the defense industry please visit here.

The views expressed are those of the author and do not necessarily reflect the official policy or position of the Department of the Air Force, the Department of Defense, or the US government.

About Dyndrite

Dyndrite’s mission is to fundamentally change how geometry is created, transformed and transmitted on a computer. Their Accelerated Computation Engine (ACE) is the world’s first (geometry agnostic), multi-threaded, GPU-accelerated Geometry Engine. They create and license tools that give companies the power, freedom and control necessary to deliver on the unprecedented potential of digital manufacturing.

Dyndrite products include, Dyndrite LPBF Pro, a powerful software solution designed to enhance the capabilities of Laser Powder Bed Fusion (LPBF) for metal 3D printing. It provides users with previously unattainable part printing capabilities, accelerated build rates, and unprecedented productivity. Dyndrite LPBF Pro is compatible with a wide range of metal 3D printing machines, including brands such as Aconity3D, EOS, Renishaw, NikonSLM, among others.

Investors include Gradient Ventures, Google’s AI-focused Investment Fund and former Autodesk CEO Carl Bass. The company was founded in 2015 and is headquartered in Seattle, WA. Dyndrite was named a World Economic Forum Technology Pioneer for 2021.

For more information, visit www.dyndrite.com.

About AFRL

The Air Force Research Laboratory is the primary scientific research and development center for the Department of the Air Force. AFRL plays an integral role in leading the discovery, development, and integration of affordable warfighting technologies for our air, space and cyberspace force. With a workforce of more than 12,500 across nine technology areas and 40 other operations across the globe, AFRL provides a diverse portfolio of science and technology ranging from fundamental to advanced research and technology development.

For more information, visit afresearchlab.com.

About AFWERX

As the innovation arm of the DAF and a directorate within the Air Force Research Laboratory, AFWERX brings cutting-edge American ingenuity from small businesses and start-ups to address the most pressing challenges of the DAF. AFWERX employs approximately 325 military, civilian and contractor personnel at six hubs and sites executing an annual $1.4 billion budget. Since 2019, AFWERX has executed 4,697 contracts worth more than $2.6 billion to strengthen the US defense industrial base and drive faster technology transition to operational capability.

For more information, visit: afwerx.com.

DOVER, DE and TAIPEI, Taiwan, June 10, 2024 – Gideon, a robotics and AI company specializing in autonomous mobile robots (AMRs) powered by proprietary spatial AI and 3D vision technology, announced it is collaborating with NVIDIA to accelerate supply chain automation with the power of AI.

Trey autonomous forklift in action

Gideon, a first-mover in automating trailer loading and unloading processes and an early adopter of the NVIDIA Isaac robotics platform, is further optimizing material handling processes  in the supply chain by teaming up with NVIDIA to leverage the potential of NVIDIA Isaac Perceptor across AMR space.

“Gideon’s collaboration with NVIDIA will help address unsolved complex robotics and automation challenges in the supply chain, by combining Gideon’s AI-powered AMR technology and NVIDIA’s accelerated computing.” says Josip Cesic, CEO at Gideon.

Automated solutions are transforming warehouses, driving efficiency and cost-effectiveness.

Over $150 billion is spent yearly on trailer loading and unloading in the US, a workflow still essentially untouched by automation. By implementing automated truck loading and unloading solutions, companies reduce heavy lifting, achieve significant savings, and enhance safety.

Integrating Gideon’s autonomous AI-powered forklift TREY into loading and unloading processes transforms supply chain operations, streamlining workflows and achieving remarkable efficiency gains while reducing workplace injuries. The key enabling technology is an AI and 3D visual perception stack that allows the robot to understand the world in 3D with detailed semantics and dense geometry, making it easy to operate consistently, reliably, and safely in dynamic environments, side by side with people.

“Autonomous mobile robot solutions have the potential to transform the supply chain, warehousing, and logistics,” said Deepu Talla, vice president of robotics and edge AI at NVIDIA. “The integration of NVIDIA Isaac Perceptor modular libraries and AI models into Gideon’s technology stacks helps bring AI acceleration to the logistics sector.”

About Gideon

With entities in North America and Croatia, EU, the robotics and AI solutions company specializes in automating material handling processes for logistics, manufacturing, and retail businesses. Its autonomous mobile robots are powered by proprietary spatial AI and 3D vision technology, enabling businesses to automate the most complex warehouse and manufacturing operations and orchestrate workflows of humans, robots, and other equipment supported by real-time data.

For more information, visit www.gideon.ai.

^{Designed for Cloud-Native Solutions}

SAN JOSE, CA and TAIPEI, Taiwan, June 7, 2024 – Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is introducing a ready-to-deploy liquid-cooled AI data center, designed for cloud-native solutions that accelerate generative AI adoption for enterprises across industries with its SuperClusters, optimized for the NVIDIA AI Enterprise software platform for the development and deployment of generative AI. With Supermicro’s 4U liquid-cooled, NVIDIA recently introduced Blackwell GPUs can fully unleash 20 PetaFLOPS on a single GPU of AI performance and demonstrate 4X better AI training and 30X better inference performance than the previous GPUs with additional cost savings. Aligned with its first-to-market strategy, Supermicro recently announced a complete line of NVIDIA Blackwell architecture-based products for the new NVIDIA HGX B100, B200, and GB200 Grace Blackwell Superchip.

Plug-and-Play Liquid-Cooled AI SuperCluster

“Supermicro continues to lead the industry in creating and deploying AI solutions with rack-scale liquid-cooling,” said Charles Liang, president and CEO of Supermicro. “Data centers with liquid-cooling can be virtually free and provide a bonus value for customers, with the ongoing reduction in electricity usage. Our solutions are optimized with NVIDIA AI Enterprise software for customers across industries, and we deliver global manufacturing capacity with world-class efficiency. The result is that we can reduce the time to delivery of our liquid-cooled or air-cooled turnkey clusters with NVIDIA HGX H100 and H200, as well as the upcoming B100, B200, and GB200 solutions. From cold plates to CDUs to cooling towers, our rack-scale total liquid cooling solutions can reduce ongoing data center power usage by up to 40%.”

Visit www.supermicro.com/ai for more information.

At COMPUTEX 2024, Supermicro is revealing its upcoming systems optimized for the NVIDIA Blackwell GPU, including a 10U air-cooled and a 4U liquid-cooled NVIDIA HGX B200-based system. In addition, Supermicro will be offering an 8U air-cooled NVIDIA HGX B100 system and Supermicro’s NVIDIA GB200 NVL72 rack containing 72 interconnected GPUs with NVIDIA NVLink Switches, as well as the new NVIDIA MGX systems supporting NVIDIA H200 NVL PCIe GPUs and the newly announced NVIDIA GB200 NVL2 architecture.

“Generative AI is driving a reset of the entire computing stack — new data centers will be GPU-accelerated and optimized for AI,” said Jensen Huang, founder and CEO of NVIDIA. “Supermicro has designed cutting-edge NVIDIA accelerated computing and networking solutions, enabling the trillion-dollar global data centers to be optimized for the era of AI.”

The rapid development of large language models and the continuous new introductions of open-source models such as Meta’s Llama-3 and Mistral’s Mixtral 8x22B make today’s state-of-the-art AI models more accessible for enterprises. The need to simplify the AI infrastructure and provide accessibility in the most cost-efficient way is paramount to supporting the current breakneck speed of the AI revolution. The Supermicro cloud-native AI SuperCluster bridges the gap between cloud convenience of instant access and portability, leveraging the NVIDIA AI Enterprise, allowing moving AI projects from pilot to production seamlessly at any scale. This provides the flexibility to run anywhere with securely managed data, including self-hosted systems or on-premises large data centers.

With enterprises across industries rapidly experimenting with generative AI use cases, Supermicro collaborates closely with NVIDIA to ensure a seamless and flexible transition from experimentation and piloting AI applications to production deployment and large-scale data center AI. This result is achieved through rack and cluster-level optimization with the NVIDIA AI Enterprise software platform, enabling a smooth journey from initial exploration to scalable AI implementation.

Managed services compromise infrastructure choices, data sharing, and generative AI strategy control. NVIDIA NIM microservices, part of NVIDIA AI Enterprise, offer managed generative AI and open-source deployment benefits without drawbacks. Its versatile inference runtime with microservices accelerates generative AI deployment across a wide range of models, from open-source to NVIDIA’s foundation models. In addition, NVIDIA NeMo enables custom model development with data curation, advanced customization, and retrieval-augmented generation (RAG) for enterprise-ready solutions. Combined with Supermicro’s NVIDIA AI Enterprise ready SuperClusters, NVIDIA NIM provides the fastest path to scalable, accelerated Generative AI production deployments.

Supermicro’s current generative AI SuperCluster offerings include:

• Liquid-cooled Supermicro NVIDIA HGX H100/H200 SuperCluster with 256 H100/H200 GPUs as a scalable unit of compute in 5 racks (including 1 dedicated networking rack)
• Air-cooled Supermicro NVIDIA HGX H100/H200 SuperCluster with 256 HGX H100/H200 GPUs as a scalable unit of compute in 9 racks (including 1 dedicated networking rack)
• Supermicro NVIDIA MGX GH200 SuperCluster with 256 GH200 Grace Hopper Superchips as a scalable unit of compute in 9 racks (including 1 dedicated networking rack)

Supermicro SuperClusters are NVIDIA AI Enterprise ready with NVIDIA NIM microservices and NVIDIA NeMo platform for end-to-end generative AI customization and optimized for NVIDIA Quantum-2 InfiniBand as well as the new NVIDIA Spectrum-X Ethernet platform with 400Gb/s of networking speed per GPU for scaling out to a large cluster with tens of thousands of GPUs.

Supermicro’s upcoming SuperCluster offerings include:

• Supermicro NVIDIA HGX B200 SuperCluster, liquid-cooled
• Supermicro NVIDIA HGX B100/B200 SuperCluster, air-cooled
• Supermicro NVIDIA GB200 NVL72 or NVL36 SuperCluster, liquid-cooled

Supermicro’s SuperCluster solutions are optimized for LLM training, deep learning, and high volume and batch size inference. Supermicro’s L11 and L12 validation testing and on-site deployment service provide customers with a seamless experience. Customers receive plug-and-play scalable units for easy deployment in a data center and faster time to results.

About Super Micro Computer, Inc.

Supermicro (is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, CA, Supermicro is committed to delivering first-to-market innovation for enterprise, cloud, AI, and 5G Telco/Edge IT infrastructure. They are a Total IT Solutions manufacturer with server, AI, storage, IoT, switch systems, software, and support services. Supermicro’s motherboard, power, and chassis design expertise further enable our development and production, enabling next-generation innovation from cloud to edge for our global customers. Their products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).

For more information, visit www.supermicro.com.

SEATTLE, WA, June 6, 2024 – Dyndrite, providers of the GPU-accelerated computation engine used to create next-generation digital manufacturing hardware and software, announced support for HP’s Multi-jet Fusion (MJF) and Metal Jet line of 3D printers. The forthcoming 3D print preparation software will bring powerful new serial production features to direct and contract manufacturers, including automated build preparation from multi-gigabyte mesh files, or native CAD, fully controllable 2D & 3D advanced labeling, and more. The company is currently accepting new beta users via its Early Adopter Program.

Through Dyndrite for MJF users can perform blazing fast 2D & 3D nesting operations. Finely configuring densely packed interlocking elements.

“From the outset Dyndrite’s goal has been to usher in a new era of serial production in AM,” said Stephen Anderson, strategic relations, Dyndrite. “Our direct support for HP Multi Jet Fusion and Metal Jet now avails the most production oriented users in AM with software capable of accelerating their production capabilities and throughput. We look forward to working with Multi Jet and Metal Jet users to solve their toughest serial production challenges.”

Dyndrite for MJF, built upon Dyndrite’s Accelerated Computation Engine (ACE) gives HP direct and contract manufacturers unprecedented power, freedom and control over the MJF manufacturing process. It provides long awaited enterprise features that directly helps industrial users speed production, increase repeatability, and improve traceability. Users can now work with large multi-gigabyte files, leverage native CAD files and their associated metadata to enable automation, finely tune advanced 2D and 3D nesting, part serialization and QR code labels and script automated build prep that eliminates human error.  Using Dyndrite users enjoy native machine connectivity, and full HP file plug in support. Additionally, Dyndrite’s native Python APIs enable data integration with a wide range of databases and 3rd party apps, including AMFG, to improve part ordering, job submission, and reporting.

“HP is excited that Dyndrite has announced support for HP’s 3D printing ecosystem for both polymers and metals,” said Arvind Rangarajan, global head software and data, Personalization and 3D Printing at HP Inc. “HP 3D printing customers will now have the option of using Dyndrite to create and submit print jobs.“

Early Adopter Program

HP 3D printer customers interested in experiencing Dyndrite for MJF can join the Dyndrite Early Adopter Program to receive advance information and early access to software for testing and production use. Interested parties can sign up here.

About Dyndrite

Dyndrite’s mission is to fundamentally change how geometry is created, transformed and transmitted on a computer. Their Accelerated Computation Engine (ACE) is the world’s first (geometry agnostic), multi-threaded, GPU-accelerated Geometry Engine. They create and license tools that give companies the power, freedom and control necessary to deliver on the unprecedented potential of digital manufacturing.

Dyndrite products include, Dyndrite LPBF Pro, a powerful software solution designed to enhance the capabilities of Laser Powder Bed Fusion (LPBF) for metal 3D printing. It provides users with previously unattainable part printing capabilities, accelerated build rates, and unprecedented productivity. Dyndrite LPBF Pro is compatible with a wide range of metal 3D printing machines, including brands such as Aconity3D, EOS, Renishaw, NikonSLM, among others.

Investors include Gradient Ventures, Google’s AI-focused Investment Fund and former Autodesk CEO Carl Bass. The company was founded in 2015 and is headquartered in Seattle, WA. Dyndrite was named a World Economic Forum Technology Pioneer for 2021.

For more information, visit www.dyndrite.com.

TAIPEI, Taiwan, June 5, 2024 – As industry leaders and innovators gather at Computex 2024, ASUS is excited to unveil its latest computing technologies for work. This year’s highlight is the debut of the all-new ASUS Expert P series, specifically designed for entrepreneurs, prosumers and home offices, marking a significant expansion in ASUS offerings for business. Leading this series is the flagship model ExpertBook P5 (P5405), the first ASUS AI PC designed for work, powered by Intel Core Ultra processors with the Lunar Lake architecture. It boasts more than 45 TOPS NPU, delivering over 100 platform TOPS and approximately triple the AI performance of the first-generation Intel Core Ultra processor, ensuring quieter and cooler operations.

Work evolution with AI PCs: Unveiling ExpertBook P5

At Computex 2024, ASUS proudly unveils ExpertBook P5 , a model that merges advanced AI capabilities with a precision-crafted yet robust design to redefine technology for modern professionals. Designed for ambitious prosumers, small office workers and those with an entrepreneurial spirit, ExpertBook P5 ensures that professionals at every level, including startups and home offices, have access to the latest advancements.

Equipped with Intel Core Ultra processors with the Lunar Lake architecture, ExpertBook P5 enhances productivity through a scalable, seamless experience tailored to diverse professional needs. It enhances workflows with smart, AI-driven features like AI meetings, AI assistants and AI creativity, significantly simplifying complex tasks and enhancing efficiency and teamwork. The AI-driven file search allows for quick document retrieval using natural language, streamlining file management with just a click. Exceptional audio and video quality, powered by AI-voiceprint technology, isolates the user’s voice and reduces background noise during global meetings, crucial for collaborative document creation. Furthermore, real-time co-editing and generative meeting notes support seamless teamwork, while the meeting transcript feature offers multilingual support, ensuring clear communication across different languages.

Fortified business security: Commercial-grade BIOS and Intel hardware-based security

For professionals with limited IT support, ExpertBook P5 ensures that focus remains on productivity, not maintenance or security. It is secured with a Windows 11 Secured-core PC framework, commercial-grade BIOS meeting NIST-155 standards, and an optional discrete TPM 2.0, forming a robust security barrier that protects data and privacy comprehensively. Additionally, its military-grade durability, advanced cooling systems and robust build with reinforced hinges and drop-resistant design guarantee enduring reliability. Backed by a three-year warranty, ExpertBook P5 allows professionals to trust in their device’s sustained performance and security, making it a vital asset in today’s demanding work environments.

Its sleek design is highlighted by a 14-inch 16:10 2.5K display optimized for comfort and superior visual. ExpertBook P5 revolutionizes productivity with advanced AI capabilities that transform routine to complex tasks with unprecedented efficiency. More details about ExpertBook P5 will be available at its Q3 launch.

Durability and sustainability: Engineering resilience for tomorrow’s business climate

This year, ASUS has increased the use of sustainable materials. All plastic models now incorporate over 20% post-consumer recycled (PCR) content, with ExpertBook B3 series featuring BioPCR and the ExpertBook B9 OLED incorporating 60% post-industrial recycled (PIR) materials. Furthermore, every current ExpertBook model uses post-consumer recycled packaging and is designed for 40% greater energy efficiency than ENERGY STAR requirements. ASUS expects the entire 2024 lineup of ExpertBook and Chromebook laptops to be registered as EPEAT Gold with Climate+ and TCO 9.0 certification. This commitment is supported by initiatives like ASUS Carbon Partner Services, which assists businesses in enhancing their sustainability efforts.

ASUS environmental goals, validated by SBTi, commit to reducing greenhouse gas emissions by 50% by 2030 and achieving 100% renewable energy by 2035. In these ways, ASUS PCs meet the highest sustainability standards.

Availability & Pricing

The ASUS ExpertBook P5 (P5405) will be presented in more details during its launch in Q3, 2024, and should be available in Canada by Q4 2024. Please contact your local ASUS representative for further information.

About ASUS

ASUS is a global technology leader that provides the world’s most innovative and intuitive devices, components, and solutions to deliver incredible experiences that enhance the lives of people everywhere. With its team of 5,000 in-house R&D experts, ASUS is world-renowned for continuously reimagining today’s technologies for tomorrow, garners more than 11 awards every day for quality, innovation, and design, and is ranked among Fortune’s World’s Most Admired Companies.

For more information, visit www.asus.com.

MONTREAL, Canada, June 5, 2024 – Vention, the company behind the cloud-based Manufacturing Automation Platform (MAP), announced a collaboration with NVIDIA to bring industrial automation technology to small and medium manufacturers by using NVIDIA AI and accelerated computing to advance cloud robotics. This announcement marks a year of collaborative efforts to leverage artificial intelligence to simplify the realization of industrial automation and robotic projects, from the design of equipment up to their operations.

Vention’s cloud-first MAP is inherently AI-enabled, drawing on a proprietary dataset of several hundred thousand robot cell designs created since the company’s founding. Vention intends to leverage this unique asset to simplify the user experience on the cloud and on the edge. The collaboration with NVIDIA focused on using AI to create near-accurate digital twins significantly faster and more efficiently so manufacturers can test their projects before they invest. Areas of development include generative designs for robot cells, co-pilot programming, physics-based simulation, and autonomous robots.

Combined with Vention’s modular hardware and plug-and-play motion control technology, the collaboration with NVIDIA will bring cutting-edge AI to the forefront of manufacturing aiming to widen access to industrial automation technology for small and medium manufacturers. Already known for its user-friendly software products and interface, Vention aims to continue bringing solutions to small and medium manufacturers, enabling them to adopt automation faster and more efficiently.

A number of new Vention products resulting from this collaboration are expected to be announced in Q3 of 2024.

“The Vention ecosystem with NVIDIA’s robotics technology and AI expertise will help bring pivotal innovation to the manufacturing renaissance and overall industry. Now, even the most complex use cases can become achievable for small and medium manufacturers.” says Etienne Lacroix, founder and chief executive officer, Vention.

“Vention’s cloud-based robotics platform, powered by NVIDIA AI, will empower industrial equipment manufacturing companies everywhere to seamlessly design, deploy, and operate robot cells, helping drive the industry forward.” says Deepu Talla, vice president of robotics and edge computing, NVIDIA.

About Vention

Vention helps some of the most innovative manufacturers automate their production floors in just a few days through a democratized user experience. Vention’s digital manufacturing automation platform allows clients to design, automate, deploy and operate automated equipment directly from their web browsers. Headquartered in Montreal, Canada, with offices in Berlin, Vention’s 300 employees serve 4,000+ customers on five continents and 25 manufacturing industries.

For more information, visit vention.com.

^{at Computex 2024}

TAIPEI, Taiwan, June 4, 2024 – ASUS ushered in a new era of Copilot+ PCs — featuring advanced AI capability with 45+ TOPS NPU AI engines — during its Always Incredible virtual event at Computex 2024, with the launch of brand-new models across its ProArt, Zenbook and Vivobook portfolios.

The new products presented included an impressive lineup of ProArt creator laptops including the ProArt P16 clamshell, PX13 convertible and PZ13 detachable. It also includes the stunning thin and light Zenbook S 16 with brand new patented Ceraluminum coating. It also includes an update with the latest AMD Ryzen AI 300 Series processors of the 2024 Vivobook S 14, S 15 and S 16. These laptops come to accompany the recently announced Vivobook S 15 with Qualcomm Snapdragon X Elite, making it an impressive complete AI PC lineup.  Most laptops will be available during Q3, 2024, more information is available below.

The new Windows AI features, such as Recall and Cocreator in Paint, will be coming to ASUS Vivobook S 15 on June 18, with the rest of the models receiving a free update to Copilot+ PC experiences when available. All ProArt laptops include a free three-month Adobe Creative Suite subscription and a free six-month CapCut Pro subscription.
AI for creators: ASUS ProArt P16 / ProArt PX13 / ProArt PZ13

The new ASUS ProArt AI laptop lineup is designed to empower every creator — whether they are everyday users, outdoor content creators, or professionals — to transform their precious life moments into enduring stories. The lightweight, durable and powerful laptops allow users to create anywhere, create faster, and create smarter.

All three new models are Copilot+ PCs and feature the ASUS-exclusive StoryCube and MuseTree apps to enable smarter and more streamlined creative workflows, made possible by the power of fully-local AI. StoryCube is a smart, convenient, and powerful digital asset-management tool with AI assistance for scene categorization and clip generation, allowing users to effortlessly manage and export the contents of their file library. MuseTree transforms inspiration into imagery swiftly thanks to Stable Diffusion , allowing users to generate more creativity through simple graphical interactions, while intelligently storing and managing their ideas at all times. The devices also include a dedicated Copilot key for quick access to your everyday AI companion.

The 16-inch ProArt P16 laptop delivers unparalleled creative on-the-go experiences anywhere, boasting cutting-edge components within its premium-feel black chassis that’s just 14.9 mm thin and 1.85 kg light. It comes equipped with a stunning 4K OLED touchscreen display offering impressive visuals. Powered by a 50 TOPS NPU integrated into the AMD Ryzen AI 9 HX 370 processor, and NVIDIA GeForce RTX 4070 Laptop GPU that can deliver up to 321 TOPS, making it the first AI PC of its kind built for advanced AI workflows across creativity, gaming, productivity and more. Its GeForce RTX 4070 Laptop GPU provides creatives with RTX AI acceleration in top 2D, 3D, video editing and streaming apps. RTX GPUs breeze through video editing tasks 2.5x faster with DaVinci Resolve. Adobe Premiere Pro’s AI Speech Enhance runs 4.5x faster. 3D is accelerated by as much as 6x in Autodesk Arnold. And ProArt P16 has access to exclusive NVIDIA AI software like NVIDIA Broadcast, RTX Video, and the ChatRTX tech demo.

For increased portability, the 1.38 kg 13-inch ProArt PX13 convertible laptop is designed to excel in any user scenario, with a 360° hinge that allows seamless flipping between laptop, tent, stand or tablet modes. Whether creating on-the-go or working from home, its high-resolution 3K touchscreen ASUS Lumina OLED display ensures lifelike visuals that captivate and inspire. Powered by AMD Ryzen AI 9 HX 370 processor, ProArt PX13 is an NVIDIA Studio-validated laptop, with up to a GeForce RTX 4070 Laptop GPU that delivers over 300 TOPS for an advanced AI PC experience, enabling creators to unlock unique AI capabilities and dive into AI-accelerated workflows, from textures to lighting effects to AI-generated imagery. Along with ultrafast WiFi 7 connectivity, there are extensive I/O ports including twin 40 Gbps USB4 for fast charging and external displays, HDMI 2.1 FRL, and a UHS-II MicroSD card reader for quick action-cam transfers.

Finally, the ultracompact and ultraportable ProArt PZ13 detachable laptop enables users to experience the ultimate portability without sacrificing performance. Weighing just 0.85 kg, this device packs a punch with its AI-enabled Snapdragon processor, 3K touchscreen ASUS Lumina OLED screen and Copilot+ PC AI capabilities. Whether working on the go or enjoying multimedia content, the lifelike visuals provided by the world-leading display ensure an immersive experience. PZ13 has dual functionality as a tablet or a laptop, thanks to its magnetically-attached full-size detachable keyboard. The long-lasting 70 Wh battery, IP52-rated durability for dust and water resistance, and an SD slot with a microSD adapter all combine to make this device the perfect choice for ultimate creative mobility.

ASUS and CapCut have partnered to give users an exclusive free six-month CapCut membership program that provides access to premium features and thousands of assets, giving them the benefits of a flexible editing workflow, magical AI tools, and a stock library.

AI for the highly mobile: ASUS Zenbook S 16 (UM5606)

A stunning fusion of art and technology, the premium ASUS Zenbook S 16 is a sleek and lightweight ultraportable, measuring just 1.1 cm slim and weighing 1.5 kg. It’s a masterpiece of craftsmanship that, despite its ultra-sleek design, can deliver up to 28 W TDP and 50 TOPS from the NPU in its formidable AMD Ryzen AI 9 HX 370 processor, aided by an advanced 3D vapor-chamber cooling system that’s unique in such a slim device, and which is capable of ultra-quiet <25 dB cooling. In the CNC-machined keyboard area, a novel geometric grille design ensures maximum airflow while reducing dust ingress.

The all-metal chassis features an outer lid made of Ceraluminum — their exclusive new material that blends the beauty and feel of ceramic with the strength of aluminum. Ceraluminum is durable and has a pleasantly warm and tactile feel compared to aluminum. The device is available in elegant Scandinavian White or sophisticated Zumaia Gray.

Equipped with a highly efficient 78 Wh battery, and a full array of I/O ports — including two USB4, USB 3.2 Type-A, HDMI, an audio jack, and an SD card reader — on-the-go connectivity is seamless.

Users can prepare to enjoy lightning-fast responsiveness with up to 2 TB PCIe 4.0 x4 SSD and up to 32 GB LPDDR5x RAM. The immersive 16-inch 3K 16:10 panel with a 120 Hz refresh rate, NanoEdge bezels, and a 90% screen-to-body ratio offers stunning home theater-grade visuals. With the six-speaker sound system — unprecedented in such a compact device — the laptop delivers cinematic sound, and AI Noise Cancelation for enhanced conference calls makes sure that calls are clear and undisturbed by the world around. The FHD AiSense IR camera supports AI effects, while Dolby Atmos provides multi-dimensional sound. With a 40%-larger 16:10 touchpad supporting smart gestures for easy navigation and control, the user experience is further elevated.

Zenbook S 16 also includes enhanced privacy features. Inside, the Microsoft Pluton security processor creates a protective boundary around critical components to safeguard them from external threats. Outside, the FHD AiSense IR camera supports Windows Hello, Adaptive Lock and Dimming, Windows passkeys. It enables users to log in to apps and accounts with just their face.

AI for all: ASUS Vivobook S series

ASUS Vivobook S 15 (S5507) is at the vanguard of the new-era ASUS AI PCs, kickstarting the new paradigm at its recent dedicated launch event. This 1.47 cm-thin, 1.42 kg-light 15.6-inch ultraportable laptop was the company’s first Copilot+ PC to launch, harnessing the AI power of the Snapdragon X Elite Platform with its hardware-accelerated AI functions and a powerful battery that delivers up to 18 hours of seamless productivity or entertainment. Leveraging this powerful hardware, ASUS Vivobook S 15  integrates advanced features such as Windows Studio Effects, which adjusts lighting and offers new creative filters to enhance call collaboration, and ASUS AiSense Camera with AI-powered Security, enabling the adaptive lock feature to auto-lock when the users walks away and auto-unlock upon their return, as well as auto-dimming when the user looks away.

Furthermore, it incorporates Live Captions that turns any audio that passes through the PC into a single, English-language caption experience, in real time on screen across all apps consistently; and Cocreator, which empowers users to transform sketches into finished artworks using natural language to describe what they want to create. These innovative technologies not only enhance security and privacy but also elevate the audiovisual experience and unlock creativity. The expansive 3K 120 Hz ASUS Lumina OLED display and immersive Harman Kardon-certified Dolby Atmos audio system are encased in a premium all-metal 1.47 cm-thin, 1.42 kg-light body that’s built for effortless mobility. The mood-setting single-zone RGB keyboard features a dedicated Copilot key for quick AI assistance that will revolutionize work and play.

ASUS Vivobook S 15 also offers incredible on-the-go connectivity with WiFi 7 and a full set of I/O ports — including two full-function USB4, two USB 3.2 Gen 1 Type-A, HDMI 2.1, a microSD card reader, and an audio combo jack.

In order to provide the latest AI capabilities to the widest range of users, the existing ASUS Vivobook S lineup has been refreshed to feature the AMD Ryzen AI 300 Series processors. The 14-inch ASUS Vivobook S14 (M5406), the 15.6-inch ASUS Vivobook S 15 (M5506), and the 16-inch ASUS Vivobook S (M5606) have all been reimagined for 2024 with even slimmer and lighter designs. Sporting elegant all-metal chassis, these laptops start at a mere 1.39 cm in thickness and weigh as little as 1.3 kg. Alongside their exceptional portability and minimalist aesthetics, they boast uncompromising performance powered by the latest AMD Radeon graphics, up to 32 GB LPDDR5X memory, and lightning-fast up to 1 TB PCIe 4.0 SSD storage. Enhanced cooling is ensured by the ASUS IceCool thermal technology, now featuring two heat pipes, two 97-blade IceBlade fans, and two air vents.

Availability & Pricing

The ASUS ProArt P16 boasting the latest 12-core AMD Ryzen AI 9 HX 370 processor, an NVIDIA GeForce RTX 4060, 32 Gb of RAM and 1 TB of storage will be available early Q3, 2024 starting from CA$2,699 on the ASUS Store and selected retailers. Another version boasting an RTX 4070 GPU, 64 GB of RAM and 2 TB of storage will be available for CA$3,599 in exclusivity on Best Buy and the ASUS Store.

The ASUS ProArt PX13 with the latest 10-core AMD Ryzen AI 9 365 processor, an NVIDIA GeForce RTX 4050, 24 Gb of RAM and 1 TB of storage will be available early Q3, 2024 starting from CA$2,349 on the ASUS Store and selected retailers. Another version boasting the latest 12-core AMD Ryzen AI 9 HX 370 processor, an RTX 4060, and 1 TB of storage and 32 GB of RAM will be available for CA$2,899 in exclusivity on Best Buy and the ASUS Store. Both configurations come bundled with an ASUS Pen 2.0.

The ASUS ProArt PZ13 with the latest Qualcomm Snapdragon X series, 16 Gb of RAM and 1 TB of storage will be available Q3 2024 starting from CA$1,649 in exclusivity on Best Buy and the ASUS Store, and comes bundled with an ASUS Pen 2.0.

The ASUS Zenbook S 16 (UM5606) with the latest 12-core AMD Ryzen AI 9 HX 370 processor, 32 Gb of RAM and 1 TB of storage will be available early Q3, 2024 starting from CA$2,199 in exclusivity on Best Buy and the ASUS Store.

The Vivobook S 15 (S5507) with the latest Qualcomm Snapdragon X Elite is available for preorder on Costco , Staples and Best Buy in three configurations starting from CA$1,599. All three configurations are available on the ASUS Store. with laptops expected to ship later on June 18. Additional configurations are planned for early Q3, 2024.

The Vivobook S 14 (M5406) with the latest AMD Ryzen AI 300 Series processors, 24 Gb of RAM and 512 GB of storage will be available early Q3, 2024 starting from CA$1,599 in exclusivity on Best Buy and the ASUS Store.

Both the Vivobook S 15 (M5506) and Vivobook S 16 (M5606) aren’t currently planned in Canada.

About ASUS

ASUS is a global technology leader that provides the world’s most innovative and intuitive devices, components, and solutions to deliver incredible experiences that enhance the lives of people everywhere. With its team of 5,000 in-house R&D experts, ASUS is world-renowned for continuously reimagining today’s technologies for tomorrow, garners more than 11 awards every day for quality, innovation, and design, and is ranked among Fortune’s World’s Most Admired Companies.