Synchronized lighting technology delivers capabilities. 9 cameras per side, with both heads inspecting the PCB at the same time, deliver inspection times but without the high power lighting system of each head affecting the other inspection taking place. The elimination of flipping removes potential for stress on the assembly and improves solder joints.
The GTAz based bottom side inspection head has a clearance of 30mm from the PCB surface. An additional Z axis allows the head to be adjusted by 30mm to allow flexibility for inspection inside solder frames and the correct adjustment of side cameras to further enhance defect identification capabilities. The 18.75u resolution of the main optics and the 13u resolution of the side cameras also give the option for 01005” (0402mm) SMD inspection including height verification of objects like pins and packages, as well as 3D chip height measurement.
For more information, visit Mek website.