Category Archives: CAD-CAM-CAE

ANSYS Q2 Results, Conf Call on Aug 5, 8:30AM ET

PITTSBURGH, PA, July 22, 2021 – ANSYS, Inc. announced that the company expects to release its second quarter earnings on Wednesday, August 4, 2021, after the market closes. The Company will hold a conference call conducted by Ajei Gopal, president and chief executive officer and Nicole Anasenes, chief financial officer and senior vice president of finance at 8:30AM Eastern Time on Thursday, August 5, 2021 to discuss second quarter 2021 results and future outlook.

Conference Call Information

What: Ansys Second Quarter 2021 Earnings Conference Call
When: August 5, 2021 at 8:30AM Eastern Time

They encourage participants to pre-register for the conference call using the enclosed link. Callers who pre-register will be given a unique PIN to gain immediate access to the call, bypassing the live operator. Participants may pre-register any time, including up to and after the call start time. You will immediately receive an online confirmation, an email with the dial in number and a calendar invitation for the event.

To pre-register, go to:

You may also register for the conference call by logging in through the investor section of our website at and clicking on Events & Presentations and click on the event or go to Quarterly Results under the Financials section and click on the Webcast link.

The following will be available on the corporate website at or prior to the time of the conference call: a link to the live audio webcast of the call as well as the earnings press release and earnings prepared remarks.

For those who do not have internet access or are unable to pre-register, simply join the call on the day of the event by dialing (855) 239-2942 (US) or (412) 542-4124 (CAN and INT’L). Ask the operator to join you into the Ansys Conference Call.

The call will be recorded with replay available within two hours after the call at or at (877) 344-7529 (US), (855) 669-9658 (toll-free Canada) or (412) 317-0088 (INT’L). Passcode: 10156465.

About Ansys

If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, they help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, PA, USA.

Visit for more information.

Dassault Q2 Results, Conf Call on July 27

VÉLIZY-VILLACOUBLAY, France, July 22, 2021 – Dassault Systèmes, the 3DEXPERIENCE company, world leader in 3D design software, 3D digital mock up and product lifecycle management (PLM) solutions, will publish its operating performance for the second quarter and half year 2021, ended June 30, 2021, on Tuesday, July 27, 2021.

The management of Dassault Systèmes will present the earnings by webcast a webcast at 10.00AM Paris time – 09.00AM London time, and will then host a conference call at 09:00AM New York time – 03:00PM Paris time – 02:00PM London time.

Both the webcast and the conference call will be available live and as replay on Dassault Systèmes’ investor website at

They recommend that you register well ahead for each event and connect at least fifteen minutes before to download, update or install any necessary software. The webcast and conference call will be archived for a year.

About Dassault Systèmes

Dassault Systèmes, the 3DEXPERIENCE company, is a catalyst for human progress. They provide business and people with collaborative virtual environments to imagine sustainable innovations. By creating ‘virtual experience twins’ of the real world with our 3DEXPERIENCE platform and applications, their customers push the boundaries of innovation, learning and production.

Dassault Systèmes’ 20,000 employees are bringing value to more than 290,000 customers of all sizes, in all industries, in more than 140 countries.

For more information, visit

Chaos Czech Releases Corona Renderer 7 for 3ds Max

PRAGUE, Czech Republic, July 22, 2021 – Chaos Czech releases Corona Renderer 7 for 3ds Max, an update designed to enhance the realism of 3D scenes and boost render speeds across the board. From photoreal fabrics to expansive sky effects, Corona Renderer 7 makes it easier for artists to stand out.

3d rendering done in Corona Renderer –

With 35 new presets for glass, metal and fabric, the new physical material makes it simple to set up hyper-realistic scenes in minutes. Though intuitive for beginners, the Physical Material also comes with multiple features for deeper control, including Sheen parameters for creating photoreal fabrics like velvet, and Clearcoat, which allows users to add lacquer to objects like cars without making them look plastic. To maintain compatibility with preexisting scenes, the previous Corona Material will still be available as a legacy option.

In Corona Renderer 7, the Sky Model sees its biggest expansion yet. Artists can now accurately depict a digital sun and weather from any cliff or skyscraper using the new Altitude Parameter, which leverages real-world data to calculate what the sky will look like from any height. Meanwhile, the new Volume Effect improves the look of large-scale scenes by blending distant objects like mountains more naturally with the atmosphere. This effect is not only easier to control than a Global Volume material, it renders faster too.

Faster rendering isn’t just limited to the Volume Effect. Corona Renderer 7 users will also enjoy faster render times, which can be as fast as 50% on scenes heavily using newly optimized features like better transparency processing and faster denoising. This boost even extends to data/scene opening, as files will now open quicker due to the background loading of Corona Bitmaps and Proxies.

Other New Features Include:

  • Glass Material Improvements – Create frosted glass that renders quickly with refractions on thin glass in the Physical Material.
  • Industry-Standard Defaults – Automatically apply Roughness and IOR as material defaults for greater compatibility with industry standards, or switch to Glossiness and Specular when desired.
  • More Control Over Metals – Control metals materials more intuitively using the default Edge Color parameter, or use Complex IOR for physically correct scenes.

To try Corona Renderer 7 for 3ds Max now, please visit the Chaos Czech website.


Corona Renderer 7 is available now for 3ds Max 2014-2022 (64-bit). Pricing is subscription-based, with monthly rates set at $28.50 and yearly rates at $330. A free 45-day commercial trial is also available at:

About Chaos Czech

Chaos Czech is the creator of Corona Renderer, a high-performance photorealistic rendering engine. Chaos Czech is a leader in architectural visualization software, where it offers a simple, yet powerful approach for professional artists. Chaos Czech continues to bring this approach to its development of new tools and technologies for architectural visualization, VFX and broadcast. Chaos Czech, a Chaos company, is headquartered in Prague.

About Chaos

Chaos is a world leader in computer graphics technology, empowering artists and designers to create photorealistic imagery and animation across all creative industries. Chaos develops 3D rendering and simulation software that is used daily by top design studios, architectural firms, advertising agencies, and visual effects companies around the globe. In 2017, the firm’s physically based renderer, V-Ray, was honored with an Academy Award for its role in the widespread adoption of ray-traced rendering for motion pictures. Today, the company’s advancements in ray tracing, cloud rendering, and real-time visualization are shaping the future of design communication and storytelling. Founded in 1997, Chaos is privately owned with offices in Sofia, Prague, Seoul, Tokyo, and Los Angeles.

For more information, visit

Rocket TRUfusion Enterprise v7.9.4.0 Released

WALTHAM, MA, July 21, 2021 – Rocket Software (Rocket), a global technology leader that develops enterprise modernization and optimization solutions for Fortune 500 companies and government agencies, today released enhancements to Rocket TRUfusion Enterprise software, a cost-effective solution that takes the friction out of product design collaboration while dramatically saving time, preventing errors and reducing risk for companies using product lifecycle management (PLM) systems, such as Siemens Teamcenter or PTC Windchill and CAD systems, such as Siemens NX, PTC Creo and Dassault Systèmes CATIA v5.

“Rocket customers provide high-tech consumer products for the global economy,” said P. Gary Gregory, president, Database and Connectivity Business Unit, Rocket Software. “TRUfusion Enterprise enables extremely efficient global collaboration, ensuring that the right high-quality design data is delivered to the right location in the right format at the right time using the right media – delivering dramatic savings in cost and human efficiency. Our sweet spot is helping manufacturers of complex products, including those in automotive and other high-tech industries, rapidly reconfigure their supply chains by delivering mappings between various PLM and CAD systems.”

TRUfusion Enterprise software delivers a complete solution to organizations involved in supply chain collaborative design processes that need a Product Design Data eXchange (PDX) solution due to the volume and complexity of their transactions. Version, available today:

  • Delivers a new PTC Windchill plug-in that enables users to initiate, execute and automate PDX processes for both sending and receiving CAD and related product design data to customers and suppliers from within their familiar Windchill client. Already, Rocket is working with PTC Windchill customers to enable them to benefit from the combination of this leading PLM system and Rocket TRUfusion Enterprise.
  • Includes enhancements to the previously released Siemens Teamcenter Active Workspace client plug-in. Rocket has numerous automotive T1 suppliers and Formula 1 Teams that have benefited from the combination of Teamcenter and Rocket TRUfusion Enterprise for many years and now they are able to use the improved Active Workspace client plug-in as they move away from legacy Teamcenter clients.
  • Brings maintenance updates and UI enhancements for increased functionality and usability.

Now with a new PTC Windchill plug-in and updated Teamcenter Active Workspace client plug-in, Rocket TRUfusion Enterprise software provides an automated, traceable, secure CAD and PLM design data exchange that improves productivity of enterprise product design and engineering staff at every stage of a project – reducing time for PDX by 95% when compared to manual multi-step approaches. With Rocket TRUfusion Enterprise software, teams can track the sharing of high-value product design IP and simplify compliance with customer mandates, regulatory or internal standards, and best practices – preventing costly mistakes, project delays and false starts.

Rocket has partnerships with PTC, Siemens and T-Systems International to enable the development, release and continued maintenance of PLM plug-ins and data export and import management with Windchill, Teamcenter and other PLM systems.

More information about TRUfusion Enterprise is available on the Rocket website.

About Rocket Software

Rocket Software empowers organizations to create legendary impact in the world through innovation in legacy technologies. With deep expertise in IBM Z, IBM Power, and database and connectivity solutions, Rocket provides solutions that power tens of thousands of global businesses, solving real problems and making real-world impact. Rocket is a privately held US corporation headquartered in the Boston area with centers of excellence strategically located throughout North America, Europe, Asia, and Australia. Rocket is a portfolio company of Bain Capital Private Equity.

Arm, Ansys Offer State-Of-The-Art Simulation Solutions

for AWS Graviton2 Processors

PITTSBURGH, PA, July 21, 2021 – Together with Arm, Ansys is providing state-of-the-art simulation solutions for AWS Graviton2 processors — empowering Ansys customers with more affordable access to Amazon Web Services (AWS) cloud computing resources. The collaboration marks the first availability of Ansys’ electronic design automation (EDA) semiconductor simulation solutions on the Arm Neoverse architecture, empowering engineering teams to improve design efficiency and ensure optimum chip performance.

Ansys semiconductors will support AWS Graviton2 processor based on the Arm Neoverse architecture. Photo courtesy of Arm.

Complex simulations harness thousands of cores in the cloud over multiple days, which can be a significant part of product development costs. To achieve better price/performance and increase team-wide efficiency in the cloud, engineers require a cost-effective solution to work faster and more efficiently. Beginning with Ansys’ APL characterization tool, Ansys will offer more of its semiconductor analysis software product suite, supporting the Arm Neoverse architecture that is used by AWS Graviton2-powered Amazon Elastic Compute Cloud (EC2) instances.

Arm engineers use APL and thousands of cores to characterize design libraries and calculate chip power and reliability — substantially enhancing workload efficiency and ensuring chips will work optimally at mandated frequencies.

“We designed Arm Neoverse to deliver the performance and efficiency required for workloads in cloud environments,” said Philippe Moyer, vice president of Design Enablement, Physical Design Group at Arm. “By collaborating with Ansys and AWS to make APL available for the Arm architecture, we are continuing to enable the EDA ecosystem on Arm, ensuring Ansys’ semiconductor tools portfolio runs effectively on optimized hardware.”

The deployment of Ansys’ APL characterization tool on Arm Neoverse affordably expedites the development and verification of technology solutions for Ansys customers on AWS.

“This port makes the Arm architecture and AWS more attractive to chip design customers, empowering them to improve productivity and cost savings across their organizations,” said John Lee, vice president and general manager at Ansys. “Access to cloud computing has become vital to our customers as their chip designs keep getting bigger. By making more of Ansys’ semiconductor simulation portfolio available on this new platform, we give our customers broader access to the cloud.”

The availability of Ansys products on Amazon EC2 provides Arm engineers and AWS customers the option to lower their cloud computing expenses. The Graviton2 processor built on the Arm Neoverse architecture delivers up to 40% better price performance over comparable current generation instances for a wide variety of workloads.

“Our customers are always looking for the best price/performance option to run their applications in the cloud,” said Barry Bolding, director of HPC GTM at AWS. “With AWS Graviton2-powered EC2 instances, we are delivering a powerful solution that’s ideal for compute-intensive, high-performance computing applications, which makes the cloud accessible to more customers.”

About Ansys

If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through their strategy of Pervasive Engineering Simulation, they help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, they help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, PA, USA.

Visit for more information.

Ansys 2021 R2 Released

PITTSBURGH, PA, July 21, 2021 – Improvements in Ansys 2021 R2 products provide the power to explore early stage product design and complex system engineering from the nanometer scale of chip design to the mission level of aerospace and defense operating environments. Ansys’ industry-leading simulation solutions provide an open approach that streamlines engineering via simplified workflows, integrated data management and easy access to high-performance computing (HPC) power via the cloud.

A drum compressor being analyzed with Ansys Mechanical’s multistage analysis
feature to reduce solving time compared against a full 360 degree solve

Engineering exploration via simulation is virtually risk free because engineers are no longer bound to an expensive and time-consuming prototype-test-redesign cycle. New design ideas can be virtually evaluated in hours, not weeks, freeing up time to optimize the best design candidates or develop moonshot ideas that redefine markets. With access to nearly limitless computing via Ansys Cloud, engineers who use Ansys 2021 R2 products have the speed and flexibility to ask the “what-if” questions that lead to innovations in autonomous vehicles, chip design, mission-critical connectivity solutions and more sustainable travel via lightweight materials and electrification.

Speed improvements are woven throughout the latest Ansys products.

  • Productivity enhancements allow engineers to perform optical simulation meshing up to 20X faster and local meshing up to 100X faster.
  • Ansys Mechanical 2021 R2 streamlines cyclic modal and structural analyses using a new multistage cyclic symmetry capability that can ultimately decrease run times by up to 50X when compared against a full 360 degree solve.
  • In semiconductors, 2021 R2 provides 3nm-ready Advanced Power Analytics (APA) and improves voltage-drop fixing efficiency by 3X, using aggressor identification, what-if analysis and links to engineering change order (ECO) tools.
  • Using the cloud for semiconductor simulation delivers at least 4X better cost and core-hour efficiency with Ansys 2021 R2.
  • In fluids, Ansys 2021 R2 provides up to a 5X speed increase for high-speed flows to Mach 30 and above, with improved treatment of reaction sources in the density-based solver.
  • Simplified, reduced-order workflows throughout Ansys 2021 R2 provide quick answers to product design and development problems, allowing engineers to concentrate computing power on the best design candidates.
  • The new Phi Plus mesher meets 3D integrated circuit package challenges by accelerating initial meshing for bondwire package electromagnetics and signal integrity analysis by an average of 6-10x.

“Because of the speed of Ansys HFSS and its ability to solve multiple simulation challenges in different domains, we were able to analyze performance and make design changes more quickly and with better data,” said Doug Stetson, CEO of FreeFall Aerospace. “We were able to build complete models in HFSS which allows us to move directly into the prototyping stage with confidence. Meeting our customer requirements with accuracy and speed is our priority and Ansys HFSS makes that possible.”

In addition to directly speeding up simulation, Ansys 2021 R2 enables engineers to work more efficiently via an open platform that integrates multiple toolsets. For example, Ansys Mechanical users can embed Python programming language scripts directly into their models to automate the flow using industry standard open-source coding.

Bond wire simulation using PHI Plus MESHER in Ansys HFSS

Automation and collaboration are recurring themes in Ansys 2021 R2 because updates enable teams to efficiently work in an ecosystem that connects early design, simulation, system integration and manufacturing. Many products in the new release incorporate single-click, automated integrations that enable users to leverage additional technology to broaden their scope of simulation. Product and process integration also allows a smooth transfer of data between applications, which increases usability and productivity. For instance, Ansys 2021 R2 delivers new Chip-Package-System (CPS) and printed circuit board (PCB) enhanced workflows with automation for IC-on-Package and Multi-Zone PCBs with rigid flex cables, which are popular in modern electronic devices.

“Ansys is a proven leader in simulating mechanical, electromechanical, thermal and radio frequency transmission to predict undesirable multiphysics interactions – noise, vibration, physical interferences, electromagnetic interferences and material fatigue – all leading causes of product failures,” said Craig Brown, executive consultant at CIMdata. “Ansys provides essential expertise across the scale of tomorrow’s cyber-physical products, understanding silicon engineering workflows as well as system engineering workflows and everything in between to create an innovative and profitable electronics systems product.”

Data visibility and reuse via dashboards and dedicated libraries further increase the efficiency of engineers using Ansys 2021 R2. Libraries for common digital twin components, electronic components and materials enable engineers to quickly access trusted data. For example, materials management updates enable customers using restricted substances to access the latest Supplier Data Sheets (SDSs), ensuring products are compliant with global regulations.

Results of a multi-die IC package by Ansys RedHawk-SC Electrothermal showing temperature distribution and mechanical warpage at different temperatures

Compliance, certifications and standards are addressed in many updated products. Ansys 2021 R2 is now a one-stop-shop for embedded software certification across all industries, including the highest safety integrity/assurance levels of DO-178C, ISO 26262, IEC 61508, and EN 50128 standards.

“Simulation is not just about solving advanced multiphysics design problems to us,” said Shane Emswiler, senior vice president of products at Ansys. “It includes considering the entire product workflow and function necessary to enable our customers’ success. From automotive to industrial to aerospace and advanced electronics, Ansys is the leading provider of mission-critical integrated solutions that help customers build their products and systems for success.”

To learn more about Ansys 2021 R2, please visit:

For specific updates on each of Ansys’ product suites, please visit:

About Ansys

If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through their strategy of Pervasive Engineering Simulation, they help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, they help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, PA, USA.

Visit for more information.

High QA Selects HOOPS Native Platform

BEND, OR, July 21, 2021 – Tech Soft 3D, the leading provider of engineering software development toolkits, today announces that High QA, a leading provider of integrated quality management software solutions for industrial manufacturing companies around the world, utilized the advanced toolkits in the HOOPS Native Platform to streamline and improve quality processes. By improving CAD data access and 3D data publishing, High QA empowers their customers to accelerate development of powerful engineering applications with fewer mistakes.While manufacturing quality engineers have traditionally used 2D drawings throughout the planning and inspection process to make sure parts meet specifications and standards, the rise of Industry 4.0 – and related initiatives like Quality 4.0 – has meant that many companies now expect their suppliers to use a 3D model based definition (MBD) workflow.

“Supply chains are becoming more global at the same time that parts are becoming more complex, smaller, and requiring tighter tolerances,” said Sam Golan, founder & CEO of High QA. “Quality assurance is more important than ever. A 3D model is excellent at describing a part, but quality assurance is a process – and quality groups still rely heavily on 2D drawings to inspect, validate, and report on parts. Customers often receive a 3D model and then are forced to manually extract the dimensions in order to create a 2D inspection plan for the part, which is considerable extra work for the end user. Additionally, preparing 2D drawings from MBD datasets during the quality and inspection phase often involves assumptions and interpretations. This can introduce errors and increase risk for the on-time delivery of quality parts that OEMs expect.”

High QA provides integrated quality management software solutions for industrial manufacturing companies around the world. The company serves customers in key industries like aerospace, automotive, defense, heavy machinery, and oil & energy, with an eye towards solving the quality challenges they face. Viewing these challenges, High QA saw an opportunity to bridge the gap between the promise of MBD and the reality of quality processes, and to create a better way for customers to integrate 3D MBD into their manufacturing quality workflows.

Given the importance of working with 3D data to develop an effective solution, High QA turned to the HOOPS Native Platform, a collection of SDKs for desktop and mobile application development, for foundational aspects of its Inspection Manager product.

“We evaluated three different technology providers over a period of several months, and we felt Tech Soft 3D was the best fit,” said Golan. “It’s not just about the quality of the technology components – it’s also about the quality of the people who support the components, which is very important to us as well.”

One of the key development kits in the HOOPS Native Platform is HOOPS Exchange, which provides support for 30+ engineering and visualization formats. In addition to faithfully reproducing product manufacturing information (PMI) for all the major CAD formats, HOOPS Exchange fully supports all predefined views and model configurations stored in the original CAD model. With the single click of a button, Inspection Manager automatically extracts PMI from the native 3D model and creates an auto-ballooned 2D drawing and a bill of characteristics, with no manual effort or interpretation required.

“Quality engineers don’t necessarily need to see every single view or every annotation – a lot of it isn’t relevant to them,” said Golan. “Inspection Manager makes it easy to ‘clean up’ and prepare the model so that it’s easy for the quality team to work with.”

Leveraging HOOPS Publish – an SDK that enables applications to publish 3D data in several ways, including as native 3D PDF, HTML, and in a variety of standard CAD formats like STEP – allows the model to easily be shared downstream as needed, in conjunction with the 2D drawings. Ultimately, the ability to automatically extract accurate 3D model data and deliver it in an easily consumable fashion helps ensure products are delivered within tolerance, comply with all applicable standards, and are made in less time with fewer mistakes.

Golan concluded, “When it comes to quality processes, it’s simply not practical to hand someone a 3D model and tell them ‘Okay, go work with this.’ By combining Tech Soft 3D’s technology with our own innovations around efficiency and automation, we’re allowing companies to make 3D MBD useful for quality processes – and, in the process, to streamline their quality processes and efficiently work in partnership with their entire supply chain.”

About Tech Soft 3D

Tech Soft 3D is the leading global provider of development tools that help software teams deliver successful applications. Established in 1996 and headquartered in Bend, OR, Tech Soft 3D also has offices in California, France, England and Japan. The company’s toolkit products power nearly 500 unique applications running on hundreds of millions of computers worldwide.

For more information, visit