CoreTech Releases Moldex3D 2024

HSINCHU, Taiwan, Mar 13, 2024 – With the pursuit of low-carbon and circular economy as the future development goals, the plastic industry is entering a new era of competition. Compared to traditional metal materials, plastics are more adaptable to industry demands, including lightweight design, energy conservation, environmental protection, low manufacturing costs, design flexibility, and performance standards. Moldex3D 2024 emerges in response to these needs, committed to providing advanced simulation solutions to easily handle various complex processes. With the support of the Moldiverse cloud platform services, optimization of production processes begins at the design stage, making it an essential tool for innovation and efficiency.

The important updates and highlights of Moldex3D 2024 are as follows:

Continuous Improvement of Molding Efficiency to Achieve Energy-Saving and Carbon Reduction Goals

Proper utilization of CAE software allows for the identification of potential design problems and optimal solutions during new product design, achieving advantages in low manufacturing costs, design flexibility, lightweight design, and improved safety. Moldex3D 2024 Compression Molding can accurately simulate the mold temperature changes during the mold movement process, achieving more accurate compression molding results.

The Moldex3D Resin Transfer Molding Module facilitates evaluation and selection of suitable production conditions through filling and curing analysis. It provides intelligent wizard tools and post-processors, supports complete RTM model preprocessing, and facilitates early defect diagnosis and design modifications. Additionally, Moldex3D introduces model comparison, multi-group comparison report functions, and result display lists to optimize result output, save file storage space, and provide a superior user experience.

Addressing Challenges in Electronic Encapsulation Processes to Improve IC Packaging Quality and Performance

In the era of strong development in AI intelligence, IC packaging is heading towards two directions of high reliability and high performance, each with different design and manufacturing requirements. To meet strict product standards, the use of molding analysis can quickly solve production defects and accelerate time-to-market.

Moldex3D 2024 continues to enhance IC packaging simulation capabilities. In addition to basic flow filling and curing process simulations, the newly added wire bonding further expands the application scope. It not only helps improve product quality and effectively prevents potential defects but also optimizes designs through simulation to reduce manufacturing costs and cycle time.

Furthermore, we also launched the industry’s first electronic potting simulation. Using convenient modeling tools and setting interfaces, a variety of process designs can be replicated, providing users with more realistic and detailed visualization of dispensing head paths and feeding. Leveraging complete physical models to simulate surface tension-induced phenomena achieves more comprehensive electronic encapsulation simulation.

Facilitating Plastic Component Design to Enhance Quality and Efficiency

With technological advancements and evolving demands, plastic products have found more innovative applications. In addition to meeting comfort and aesthetic requirements, they must also possess functionality and safety. Moldex3D 2024 enhances the simulation accuracy and speed of large components, assisting users in efficiently obtaining optimal production parameters when designing products such as bumpers, thereby improving quality and increasing production output. The addition of the Dual Nakamura model enables more realistic simulation of warpage, and exporting warpage deformation results as STEP models allows users to consider the degree of warpage for mold compensation adjustments, effectively eliminating the impact of product deformation.

Moldex3D 2024 also continues to enhance insight into the appearance of plastic components, optimizing welding line calculation efficiency, and supporting bilinear isotropic hardening models. We strengthen shrinkage prediction capabilities in injection molding and foam molding, considering the effect of trapped air, thus enabling various defects to be addressed at the design stage, reducing the significant time and cost of mold reworking.

Comprehensive Support for Plastic Molding Cloud Services, Leading the New Trend of Digital Transformation

Moldex3D 2024 continues to improve its various support services in plastic molding. The Moldex3D iSLM data management platform introduces Personal Mode for individual use and Server Mode for cross-team collaboration, providing more flexible usage modes. It also enhances IC-related data organization, optimizes model comparison functions, supports more CAD file types, and provides carbon footprint calculation functions to assist users in meeting the strictest carbon emission standards.

Moldex3D 2024 also brings more innovative services through the Moldiverse cloud platform, including the MHC Material Cloud, iMolding Hub, and University. With these services, users can quickly evaluate and select various plastic materials, acquire and establish in-house machine databases, and access the latest plastic industry information and selected seminars anytime, anywhere. With highly flexible and convenient services, product performance can be verified at the design stage, expanding the support scope of Moldex3D.

For more information about the new features of Moldex3D 2024, please visit:

About CoreTech System (Moldex3D)

CoreTech System Co., Ltd. (Moldex3D) has been providing the professional CAE analysis solution ‘Moldex’ series for the plastic injection molding industry since 1995, and the current product ‘Moldex3D’ is marketed worldwide. Committed to providing advanced technologies and solutions to meet industrial demands, CoreTech System has extended its sales and service network to provide local, immediate, and professional service. CoreTech System presents innovative technology, which helps customers troubleshoot from product design to development, optimize design patterns, shorten time-to-market, and maximize product return on investment (ROI).

More information can be found at Moldex3D Website.

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