Category Archives: Simulation

Altair Releases HPCWorks 2024

TROY, MI, Nov 21, 2023 – Altair, a global leader in computational science and artificial intelligence (AI), announced significant upgrades to Altair HPCWorks, its high-performance computing (HPC) and cloud platform. New tools and integrations include an AI-enhanced user portal, next-generation technology for distributed workflows, advanced HPC monitoring and reporting, and easier-than-ever cloud scaling.

HPCWorks 2024

“Altair HPCWorks advances Altair’s HPC capabilities and helps organizations accelerate innovation by simplifying their resource management, workload management, workflow management, and reporting,” said Sam Mahalingam, chief technology officer, Altair. “Our goal is to make it effortless for users to leverage today’s technology, so they can focus on mission-critical work rather than the tools they use.”

Boost User Productivity and Throughput with AI

Altair Access, an AI-powered job submission and monitoring tool available in Altair HPCWorks, uses historical data analysis, job inputs, and input file mining to predict job behavior and estimate memory and walltime requirements. It also regularly retrains itself based on new data. Altair Access provides walltime estimates to Altair PBS Professional to optimize scheduling, resulting in significant job throughput gains of 10-15% for real workloads.

Frictionless Multi-Cluster HPC Scheduling

Also included in Altair HPCWorks is Altair Liquid Scheduling for PBS Professional, which deploys across multiple existing scheduling domains to deliver a scalability leap for the next generation of supercomputers. Liquid Scheduling is a powerful, flexible HPC feature that meets the demands of the latest distributed workflows. It ensures that workloads run in the most efficient manner by connecting multiple clusters and sites, eliminating silos, and providing global visibility into resource utilization. The National Supercomputing Centre (NSCC) Singapore is a key development partner for Liquid Scheduling and plans to deploy the solution in 2024 as a critical component of its future infrastructure.

Fast, Intuitive Reporting for HPC

Altair HPCWorks’ new reporting solution, Altair InsightPro, simplifies and streamlines HPC and cloud reporting. With its user-friendly interface and pre-built reports, InsightPro makes data-driven decision-making easier than ever. It provides broad, detailed visibility into HPC and cloud environments, enabling organizations to separate mission-critical data and reporting from day-to-day metrics. This gives administrators the information they need to make quick decisions that improve utilization and efficiency. Open database access makes it easy to connect InsightPro to sophisticated data analytics solutions such as Altair Panopticon and Altair RapidMiner for advanced AI analysis.

Take Control of the Cloud

Altair’s industry-leading PBS Professional workload manager now includes direct access to Altair NavOps, which helps enterprises migrate compute-intensive technical HPC workloads to the cloud and provides complete visibility into HPC cloud resources. Budget-aware spend management lets users monitor and control costs to minimize cloud expenses.

NavOps provides a single interface for dynamically scaling resources in the most popular public clouds. This enables users to leverage cloud HPC to expedite high-priority workloads, enable peak-time resource shifts, and control operational budgets. NavOps in PBS Professional offers an easy-to-use GUI for day-to-day operations, as well as an extensive command-line interface (CLI) for IT management, including installation and configuration.

Explore HPC with Altair One

Altair One, Altair’s cloud innovation gateway powered by Altair HPCWorks, enables teams to seamlessly explore HPC in the cloud and on-premises. Users can now easily create private clusters using their own cloud subscriptions, fully configured with Altair applications and HPC tools, and leveraging cutting-edge CPU and GPU hardware. Additionally, Altair Drive gives teams control of their data in the cloud with a seamless and intuitive workflow, integrated 2D/3D viewer, and intelligent, content-aware submission to Altair HPCWorks clusters.

About Altair

Altair is a global leader in computational science and artificial intelligence (AI) that provides software and cloud solutions in simulation, high-performance computing (HPC), data analytics, and AI. Altair enables organizations across all industries to compete more effectively and drive smarter decisions in an increasingly connected world – all while creating a greener, more sustainable future.

For more information, visit www.altair.com.

Altair Signs MoU with Universiti Malaysia Perlis

TROY, MI, Nov 20, 2023 – Altair, a global leader in computational science and artificial intelligence (AI), has signed a memorandum of understanding (MOU) with the Universiti Malaysia Perlis (UniMAP) to drive knowledge, innovation, and sustainable technological progress in Malaysia. The agreement is focused on bridging the gap between technology and education by providing students with knowledge and skills in AI-driven manufacturing applications, industry engagement opportunities, and encourage collaborative design and industrial project work. This MOU aligns with Malaysia’s vision of Industry Revolution 4.0, as well as technical and vocational education and training (TVET) specifically focused on data analytics, AI, and cloud solutions.

“Today marks a significant milestone for both Altair and UniMAP. As Malaysia continues taking steps towards becoming a technologically advanced, digitally enabled nation, technological education is a top demand,” said Srirangam Srirangarajan, managing director of ASEAN and ANZ, Altair. “Education and technology go hand in hand, and by bridging the knowledge gap between the two, we enable students to remain competitive in this digitalized world. Together, we aim to shape the future of technological education in Malaysia.”

The focus of this collaboration is to establish an automated 3D printing SMART manufacturing teaching factory at UniMAP TVET Centre, a first-of-its-kind facility in Malaysia. The facility will boast an array of cutting-edge technologies, including more than 20 3D printers, robotic arms for pick-and-place operations, and the utilization of Altair’s software to optimize and simulate manufacturing processes. Data and AI will be employed for predictive maintenance, process monitoring, and enhancing productivity and efficiency throughout the factory.

A unique aspect of the partnership is the establishment of a full-scale 3D printing farm within a factory setting, underpinned by state-of-the-art software and AI. This innovation promises to set new benchmarks in the field of technological education.

“UniMAP’s unwavering commitment and primary objective have consistently revolved around the integration of cutting-edge technologies like AI and data analytics into our curriculum and programs. This dedication is rooted in our mission and vision, which prioritize staying abreast of industry requirements and demands,” said Professor Ir. Dr. Mohd Shukry bin Abdul Majid, deputy vice chancellor academic and international, UniMAP. “This collaboration holds the promise of equipping students with essential knowledge and competencies in AI-driven manufacturing applications, a field closely aligned with the principles of Technical and Vocational Education Training and the Industry 4.0 paradigm,” he added.

Ranked as one of Malaysia’s top 15 universities in 2024 by the Times Higher Education, UniMAP is committed to producing exceptional individuals to the nation’s development and industrial competitiveness agenda in line with its vision in becoming an internationally competitive technical university.

This partnership will benefit students, researchers, and the broader community by nurturing a highly skilled workforce capable of contributing to Malaysia’s technological growth. The collaboration holds the potential for long-term impacts, driving innovation in the nation’s technological landscape.

The partnership with UniMAP adds to Altair’s ever-growing list of collaborations with higher education institutions across Malaysia and the ASEAN region, including Universiti Teknologi Mara, Universiti Teknologi Petronas, University of the Visayas (The Philippines), and Van Lang University (Vietnam), with various activities and programs aimed at enhancing technological education.

About Altair

Altair is a global leader in computational science and artificial intelligence (AI) that provides software and cloud solutions in simulation, high-performance computing (HPC), data analytics, and AI. Altair enables organizations across all industries to compete more effectively and drive smarter decisions in an increasingly connected world – all while creating a greener, more sustainable future.

For more information, visit www.altair.com.

Ansys Partners with TSMC, Microsoft

PITTSBURGH, PA, Nov 17, 2023 – Ansys has collaborated with TSMC and Microsoft  to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC’s 3DFabric advanced packaging technologies. This collaborative solution gives customers added confidence to address novel multiphysics requirements that improve the functional reliability of advanced designs using TSMC’s 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.

The Ansys, TSMC, and Microsoft collaboration improves 3D-IC reliability

Ansys Mechanical is the industry-leading finite element analysis software used to simulate mechanical stresses caused by thermal gradients in 3D-ICs. The solution flow has been proven to run efficiently on Microsoft Azure, helping to ensure fast turn-around times with today’s very large and complex 2.5D/3D-IC systems.

3D-IC systems often have large temperature gradients that lead to intense mechanical stresses between components due to differential thermal expansion. These stresses can lead to cracking or shearing of the connections between various elements and reduce the reliable lifespan of a 3D-IC assembly. As the size and complexity of semiconductor systems grow it becomes more difficult to analyze them efficiently. Ansys Mechanical, running on Azure’s purpose-built HPC infrastructure, is instrumental in scaling up computationally demanding stress simulations while maintaining predictive accuracy. By automating highly complex thermo-mechanical stress simulations, Ansys Mechanical can simulate massive models due to a highly efficient hybrid parallel solver that supports cost-effective computing by using on-demand cloud computing resources like Azure.

“In face of the design challenges brought by the growing size and complexity of semiconductor systems, the accurate analysis results become critical for the 3D IC design using TSMC’s latest 3DFabric technologies,” said James Chen, director of 3D IC integration division, TSMC. “Our latest collaboration with Ansys and Microsoft will benefit designer with Ansys Mechanical on Microsoft Azure, performing simulations faster without sacrificing accuracy to ensure high-quality 3D IC designs for the next generation AI, HPC, mobile and networking applications.”

“With this valuable collaboration between Ansys, Microsoft, and TSMC, our innovative solutions address novel multiphysics challenges and accelerate time-to-market, while mitigating the risk of costly field failures in 3D-ICs due to thermo-mechanical stresses,” said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Our joint customers and partners see increased value in Ansys’ open ecosystem approach, ensuring they can choose the best-in-class solutions and take advantage of our cloud-ready solvers with ease.”

“Microsoft and Ansys have collaborated to provide optimized cloud solutions for some of the biggest semiconductor design challenges with Microsoft Azure’s cloud resources and on-demand elastic compute capabilities,” said Merrie Williamson, corporate vice president, Azure infrastructure and digital & application innovation, Microsoft. “And with this close collaboration with TSMC, we have been able to create a leading-edge solution flow that is made possible by cloud technology.”

About Ansys

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

For more information, visit www.ansys.com.