BARCELONA, Spain, Mar 7, 2024 – Semidynamics, the European RISC-V custom core specialist, has released its new tool called ‘Configurator’ that puts the power of Semidynamics’ full customization of a RISC-V processor core in the hands of the customer. It uses dozens of blocks that have already been verified by Semidynamics so that the final core is therefore also verified. This gives customers an incredible fast time to a workable core design in a matter of a few hours from the thousands of possible variants.

Semidynamics’ unique ‘Open Core Surgery’ allows the customer to tailor the Semidynamics IP to their needs, including adding new instructions, new interfaces and the customer’s ‘secret sauce’ deep inside. This process entails two steps. First step is to configure the base parameters of the architecture, which is what Configurator enables. The second step is to describe the special features required by the customer; the Semidynamics engineering team will take those requests and implement them according to the customer’s requirements. The newly released Configurator helps in both steps. First, it provides an easy way for the customer to specify the configuration parameters for the IP. Second, it allows the customer to describe the additional changes, beyond configuration, required.

Roger Espasa, Semidynamics’ CEO, explained, “We are the only company offering fully customizable RISC-V IP cores so there are many choices to be made by customers when specifying their requirements. Our new Configurator tool makes this process extremely easy for the customer to do on their own computer screen. The tool has a sequential set of options that logically works through the thousands of possible variants. As each one option is selected, the resulting core configuration is immediately displayed on the screen so that the customer can see how the layout of blocks builds. The customer can go back and change any of the options to see the effect on the core layout. Naturally, we are available to help and advise customers in the choices to ensure the best possible core design for their application.

“When the customer has finalized the design, it is sent to us for a PPA and licensing quote. Once this is agreed and the contract signed, the RTL is sent to them immediately and as it is already verified by us they don’t have that time consuming stage to do. The whole aim of Configurator is to empower the customer with an easy-to-use way to have the exact custom core that they need in the shortest possible time so that they are fastest to market with their innovative product.”

Some of the choices offered by the Configurator tool include instruction and data cache sizes, main memory bus size and type, and eight optional extensions. Additional options include Semidynamics’ state-of-the-art Tensor and RISC-V 1.0 compliant Vector Units with a choice of number of cores and data configuration. On top of these, Gazzillion technology that ensures constant data flow from memory.

The Semidynamics Configurator tool is web-based so it can be run on the customer’s own computer system once they have registered which can be done at www.semidynamics.com/configurator.

About Semidynamics

Founded in Barcelona on 2016, Semidynamics is a European supplier of RISC-V IP cores, specialising in high-bandwidth high-performance cores with vector units targeted at machine learning and artificial intelligence applications.

Proud participant in the European Processor Initiative (EPI).

For more information, visit website.

^{with Qt Group Graphics}

MUNICH, Germany, Mar 7, 2024 – In the highly competitive global semiconductor market, manufacturers are constantly striving for shorter time-to-market. At the same time, the demand for fluid and high-resolution graphical displays is increasing. To address these market demands, Infineon Technologies AG announces its strategic collaboration with Qt Group, a global software company providing cross-platform solutions for the entire software development lifecycle. This collaboration brings Qt’s lightweight, high-performance graphics framework to Infineon’s graphics-enabled TRAVEO T2G cluster microcontrollers and represents a paradigm shift in graphical user interface (GUI) development.

TRAVEO T2G cluster

Microcontrollers nowadays offer extensive graphical capabilities that enable compact designs, cost-efficiency, and lower power consumption. With features such as instant boot-up, small footprint and efficient real-time processing, they are widely used in various sectors, including automotive instrument clusters, two-wheelers, construction machinery, industrial and medical applications. Infineon’s TRAVEO T2G MCUs are designed to meet the requirements of these applications, especially the TRAVEO T2G cluster family. This device family provides graphical user interfaces with high refresh rates and up to full HD resolution. By integrating the Qt graphics solution directly into these MCUs, Infineon further optimizes these devices and enables intelligent rendering technology with benefits such as:

• Up to 5x more efficient memory usage compared to the market average.
• Up to 2x faster boot time compared to average boot times in the market.
• Up to 50 percent shorter time to market, from design to production.

“Whether in the automotive industry, healthcare or industrial automation, responsive user interfaces with high-quality graphics are essential,” said Toni Paila, director, Qt for MCUs at Qt Group. “However, the MCUs used for these applications typically lack integrated advanced design and development tools especially for modern user interfaces. We are therefore proud to support Infineon in bridging this gap and enabling device manufacturers to deliver outstanding user interfaces with low memory footprints on their MCUs. This will allow designers to create GUIs that were previously considered impossible due to resource constraints.”

“Qt’s efficient design and development workflow, coupled with over 30 years of production experience in various industries, has accelerated our UI application development,” said Ralf Ködel, Vice President Microcontrollers at Infineon. “By extending this efficiency to our microcontrollers, our customers can significantly shorten the time to market – from product design to production.”

A live demonstration of Qt for MCUs on Infineon`s TRAVEO T2G will be showcased at Qt`s booth at Embedded World 2024 in Nuremberg from April 9 to 11 in Hall 4, Stand 4-258.

Availability

The TRAVEO T2G cluster microcontroller products featuring Qt’s advanced graphical libraries are now available. Further information is available at www.infineon.com/traveocluster.

About Qt Group

Qt Group is a global software company, trusted by industry leaders and over 1.5 million developers worldwide to create applications and smart devices that users love. Their customers are in more than 70 different industries in over 180 countries. Qt Group employs some 800 people, and its net sales in 2023 were 180.7 MEUR.

To learn more, visit www.qt.io .

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September).

Further information is available at www.infineon.com.

PLANO, TX, Mar 6, 2024 – Siemens Digital Industries Software announced that ION Mobility has used the Siemens Xcelerator portfolio of software and services to bring its breakthrough IONM1-S electric motorbike to market, which will help accelerate the electrification of mobility in Southeast Asia.

ION Mobility has used the Siemens Xcelerator portfolio of software and services to bring its breakthrough ION M1-S electric motorbike to market, which will help accelerate the electrification of mobility in Southeast Asia. (Image credit: ION Mobility)

ION Mobility is an auto-tech company on a mission to create and deliver affordable, desirable, and sustainable mobility for everyone. The state-of-the-art design and precision engineered M1-S motorbike is the culmination of three years of rigorous effort, from a dedicated team of designers, engineers, and technologists across four countries to provide a sustainable urban solution, despite the challenges posed by the pandemic. It offers 150 km range, 4.3 kWh capacity with a less than 3-hours recharge time and a top speed of 105 km/h – all with 26 liters of under the seat storage and the compact agility that is demanded for a city bike.

ION Mobility used Siemens’ NX software from the Siemens Xcelerator portfolio for styling, mechanical engineering and electric battery pack development, allowing the team to move from concept, through engineering and into manufacturing readiness. Siemens’ NX software and Teamcenter software for product lifecycle management will also form the basis of supplier collaboration as the ION M1-S moves into a production value chain. In addition, ION Mobility has also adopted Siemens’ Capital software for wire harness design and manufacturing. ION Mobility are supported by Siemens’ sales partner, Dream Technology System Pte Ltd.

“Our design team has been working around the clock and across the globe to get the M1-S ready for production,” said Wu Xianyi, chief operating officer, ION Mobility. “The combination of Siemens’ NX, Teamcenter and Capital will allow us to bring together the disciplines of styling, mechanical engineering and wire harness design and to work cohesively as a team to ensure our products not only look amazing but perform as needed by our demanding target customers. All accomplished amidst the global pandemic.”

The Southeast Asia region is home to over 200 million combustion engine-powered two-wheelers. There is an increased urgency to shift towards electric motorbikes in the present, with more than 80 percent of households in Indonesia, Malaysia, Thailand and Vietnam owning motorcycles putting a burden on urban air quality and the environment.

“We are committed to creating great products and seamless user experiences for our customers. Our products combine advanced hardware and software technology with human-centered design to deliver smart electric motorbikes and energy storage solutions that are for everyone to use,” said James Chan, CEO and founder, ION Mobility. “Our vision is to lead our region’s transition towards a low-carbon economy with electric and electric mobility products for consumers across Southeast Asia. The Siemens Xcelerator portfolio allows us to move rapidly from concept to production-ready product in the timeframe that start-ups require, allowing us to get ahead of the market and define new market categories.”

“ION Mobility’s work to address Southeast Asia’s mobility challenge is testament to how the Siemens Xcelerator portfolio is enabling innovators and pioneers in SMBs to take their ideas from concept to product using the same world-class tools that only much larger organizations previously had access to,” said Alex Teo, vice president & managing director, South East Asia, Siemens Digital Industries Software. “We’re delighted to see how ION Mobility is bringing the ION M1-S to market and how the accessibility of Siemens Xcelerator is enabling true innovation across so many industries.”

To learn more about the Siemens Xcelerator portfolio of industry software, visit https://www.sw.siemens.com/en-US/digital-transformation/

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries.

For more information, visit website.

PLANO, TX, Mar 1, 2024 – Siemens Digital Industries Software announced it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and electronic design automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.

Founded by Arm in 2023 with a mission to help close education and skills gaps in the global semiconductor space, the Semiconductor Education Alliance brings together key stakeholders from across industry, academia, and government, to provide resources that help teachers, researchers, engineers and learners access new, accelerated educational pathways.

“Siemens joining the Semiconductor Education Alliance is a significant step forward in our collective efforts to promote communities of practice in STEM education and research with the involvement of academia and industry partners throughout the EDA industry,” said Mike Ellow, executive vice president, electronic design automation, Siemens Digital Industries Software. “As part of this alliance, we are undertaking specific projects aimed at developing the workforce in the semiconductor industry to benefit all parties involved. Siemens also aims to share resources, capabilities, and expertise in a flexible, federated and open model through a variety of forums.”

“The global semiconductor industry is facing a shortage of skills and talent that requires industry-wide action,” said Khaled Benkrid, senior director, Education and Research at Arm. “The Semiconductor Education Alliance was created to address semiconductor skills challenges and we welcome the capabilities Siemens brings to the alliance as we come together as an industry to nurture the talent pipeline.”

“The semiconductor industry needs more than one million additional skilled workers by 2030 to keep up with global demand, according to Deloitte,” said Dora Smith, senior director of the Global Academic Program, Siemens Digital Industries Software. “Partnering with Arm through the Semiconductor Education Alliance helps us collectively bridge pathways to address both the quality and quantity of talent needed to drive innovation and meet market growth. We look forward to collaborating with this ecosystem of expertise to futureproof the workforce.”

To learn more about how the Semiconductor Education Alliance, visit https://www.arm.com/resources/education.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries.

SAN JOSE, CA, Feb 29, 2024 – Cadence Design Systems, Inc. expanded its Tensilica IP portfolio to address the increasing computational requirements associated with automotive sensor fusion applications. The new high-performance Cadence Tensilica Vision 331 DSP and Vision 341 DSP combine vision, radar, lidar and AI processing in a single DSP for multi-modal, sensor-based system designs, delivering the best energy efficiency in the smallest area. When paired with the new Cadence Tensilica Vision 4DR Accelerator optimized for 4D imaging radar applications, customers can achieve even greater radar performance and higher energy efficiency. A major automotive SoC provider and early access customer has selected the Vision 341 DSP for its next-generation automotive SoC, demonstrating customer demand for these new solutions.

Cadence expanded its Tensilica IP portfolio with two new Vision DSPs and a radar accelerator to address automotive sensor fusion applications. The new high-performance Cadence Tensilica Vision 331 DSP and Vision 341 DSP combine vision, radar, lidar and AI processing in a single DSP for multi-modal, sensor-based system designs, delivering the best energy efficiency in the smallest area.

“Automotive architectures continue to evolve with the current focus on software-defined vehicles and the growing prevalence of driver and occupancy monitoring systems,” said Raphaël Da Silva, technology and market analyst at Yole Group. “With the automotive race towards eyes off, a mix of radars, cameras and Lidars are necessary to ensure optimal safety performance in all conditions. There are more than 40 sensors in a vehicle today, and that number will only continue to grow. Having these capabilities in a single, highly programmable DSP with a broad ecosystem is advantageous, particularly as imaging and 4D radar are expected to grow at a >40% CAGR from 2023 to 2028 and >131% for in-cabin use as noted in the Yole Intelligence Radar for Automotive 2023 report.”

The new Vision 341 DSP and Vision 331 DSPs combine the proven Tensilica ConnX and Vision instruction-set architectures to offer SoC providers for automotive, drone, robotics and autonomous vehicle systems a highly programmable, single-DSP solution for image sensing, radar, lidar and AI workloads. Other features and benefits include:

• The 1024-bit Vision 341 DSP provides 2X multiply-accumulate (MAC) capability compared to the Vision 331 DSP while delivering the best performance and energy efficiency compared to GPUs or CPUs.
• For certain 4D imaging radar workloads, the 512-bit Vision 331 DSP offers up to 4X performance improvement over the Vision 230 DSP in radar boost mode, while the Vision 341 DSP offers up to 6X performance improvement compared to the Vision 230 DSP.
• When paired with the new DSPs for 4D imaging radar applications, the Vision 4DR accelerator offers 3X greater performance and up to 6X greater performance/area advantage compared to a Vision 341 DSP alone and 5X greater performance compared to a Vision 331 DSP alone.
• The new Vision DSPs deliver up to 2X computer vision performance improvements for computer vision filter and NMS algorithms, as well as AI improvements for quantization and depthwise separable convolution.

The Vision 341 and Vision 331 DSPs support the Tensilica Instruction Extension (TIE) language, allowing customers to customize the instruction set. The Cadence NeuroWeave Software Development Kit (SDK) provides neural network support for both DSPs. In addition, the Vision 341 and Vision 331 DSPs support more than 1700 OpenCV-based vision library functions, SLAM Library, Point Cloud Library (PCL), Radar library, Nature DSP library, OpenCL and the Halide compiler for computer vision, imaging, radar and lidar applications. Both cores are automotive ready with ASIL-B hardware random faults and ASIL-D systematic fault certification.

“With the growing prevalence of vision transformers, automotive SoC and systems companies need best-in-class performance for sensor fusion applications. Increasingly, they are seeking a highly flexible single-DSP solution for computer vision, radar and lidar with AI processing,” said David Glasco, VP of R&D for the Silicon Solutions Group at Cadence. “As the leading provider of vision and radar DSP IP, we’re extremely well positioned to capitalize on this growing need by offering our customers the best of both worlds in a single DSP with optional radar acceleration for emerging 4D radar applications.”

Availability

Tensilica Vision DSPs support Cadence’s Intelligent System Design strategy, enabling SoC design excellence. The new Vision 331 DSP and Vision 341 DSP are available now, while the Vision 4DR accelerator will be in general availability in the second quarter of 2024. For more information on the Vision 331 DSP and Vision 341 DSP, please visit https://www.cadence.com/go/vision-331-pr or https://www.cadence.com/go/vision-341-pr. More information on the Vision 4DR accelerator can be found at https://www.cadence.com/go/vision-4dr-accelerator-pr

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For.

Learn more at cadence.com.

SANTA ROSA, CA, Feb 28, 2024 – Keysight Technologies, Inc. introduces QuantumPro, the electronic design automation (EDA) industry’s first integrated electromagnetic (EM) design and simulation tool and workflow tailored for seamless creation of quantum computers based on superconducting qubits. The QuantumPro solution consolidates five essential functionalities encompassing schematic design, layout creation, electromagnetic (EM) analysis, nonlinear circuit simulation, and quantum parameter extraction into the Advanced Design System (ADS) 2024 platform.

EDA industry’s first electromagnetic design environment for the seamless design of superconducting qubits.

Mainstream microwave engineers have been limited in their capability to address quantum design. Superconducting qubit development has typically required lengthy and expensive design cycles, along with the difficulty of navigating multiple point tools.

QuantumPro unites the domains of quantum and microwave engineering by intelligently translating traditional microwave outputs into easily adjustable quantum parameters within the ADS platform. QuantumPro empowers engineers to effortlessly fine-tune their quantum circuits and accelerate time-to-market for their chips and systems.

Key features of the QuantumPro design and simulation solution include:

• Accelerates development of quantum chips using a cost-effective electromagnetic simulation approach based on the method of moments (MOM). The nonlinear circuit solver delivers extensive analysis of the power-dependent performance quantum chips.

• Instead of solving for the electric field in the full volume, MOM solves only for the currents on the metal surface, significantly cutting the computational cost. Enables seamless tuning of qubits and resonators through co-simulation and parametric analysis.

• Simplifies the design of quantum amplifiers, the critical blocks on the output chains of quantum systems that improve readout fidelity, using a nonlinear circuit design environment (harmonic balance and X-parameters). Harmonic balance solver handles amplifier design from just a few Josephson junctions up to thousands, delivering detailed analysis of the amplifier’s performance, including gain profile, gain ripples, mixing products, quantum efficiency, and gain compression. ADS supports examination of how the amplifier performs when cascaded with other blocks such as circulators, allowing for a thorough investigation of its overall functionality.

• Incorporates a library of quantum layout components in ADS encompassing numerous frequently used quantum designs such as transmons and co-planar waveguide (CPW) meanderline resonators. Facilitates the creation of quantum chips from within the ADS layout environment with each geometrical feature of the chip being represented as a parameterized object that can be easily adjusted and optimized. The CPW components within the library have built-in airbridges that play a crucial role in preventing the propagation of the CPW common mode.

Qilimanjaro Quantum Tech, founded in 2019, is an early QuantumPro adopter planning to offer cloud access to its quantum computers. The company develops fast-to-market, application-specific analog quantum computers by co-designing chips and algorithms to bypass the qubit fragility barrier. Qilimanjaro leverages recent technological developments in quantum computing based on superconducting qubits to create an analog quantum processor that unlocks quantum advantage for customers. To deliver its full potential, the analog quantum chips are combined with long-coherence superconducting flux qubits, pure quantum interactions, and dense qubit connectivity, increasing computing power. Qilimanjaro’s quantum approach avoids the high error-correction requirements of gate-based systems. 

Albert Solana, chief business officer, Qilimanjaro, said: “We have been looking for a qubit EDA solution that leverages established principles for microwave engineers. We selected Keysight QuantumPro because it provides a complete workflow from design entry through layout, analysis, and extraction. The tool is easy to use and gives us everything we need to develop our forthcoming chips.”

Chris Mueth, senior director of emerging markets, Keysight EDA, said: “QuantumPro is the EDA industry’s first electromagnetic design environment that delivers a complete workflow for superconducting qubit development. The tool provides high precision through its 3D EM simulators that span both finite element method (FEM) for frequency domain and eigenmode, and MOM for frequency domain analysis. Automated quantum parameter extraction from frequency domain and eigenmode solutions allows easy optimization with built-in Python scripting. QuantumPro also elevates EM workflow for kinetic inductance modeling.”

About Keysight Technologies

At Keysight, they inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product lifecycle. They’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world.

Learn more at www.keysight.com.

IRVINE, CA, Feb 23, 2024 – L-com, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has just introduced new lines of IEC connectors and power entry modules, IEC connector accessories and IEC power distribution units.

LC IEC Connectors

Collectively the products bring reliable and uninterrupted connection of critical equipment to AC power sources. They power equipment such as computers, monitors, printers, server and networking equipment, audio and video gear, industrial machinery, and more.

Faulty power connections can become a thing of the past with the new line of IEC connectors. They present a full range of mains-rated inlets, outlets and connectors. L-com offers them in IEC C13, C14, C15, C16, C18, C19, C20 and 320-2-2. They conform to IEC and EN 60320 specifications and carry UL, CSA, VDE and other approvals.

The IEC connectors have several mounting styles and terminations, including flange fixing, snap-to-panel, and PCB mounting versions, together with 2.8 mm-wide solder tabs, quick-connect fast-on tabs with widths of both 4.8 mm and 6.3 mm, screw terminals, and PC spill versions. Completing the range are insulating boots and safety covers.

L-com’s new mains power entry modules offer adaptable solutions to panel design. They allow combinations of mains inlets and outlets, filtered inlets, switches, fuse-holders, voltage selectors and indicators mounted in bezels ready for quick, snap-fit assembly. There is a flange fixing alternative for designers who prefer the security of screw fixing.

The new PDUs have four, five or six outlets and are rated at 10 amps and 250 volts to suit a variety of uses. Most of the IEC distribution units have shuttered outlets to prevent accidental contact with the electrical contacts inside the outlets when they are not in use. The larger models are available with EMI filtering to ensure the power they supply is clean and free from electrical noise, which is especially important in environments where equipment and communication systems coexist.

The PDUs are protected in rugged thermoplastic ABS housings, and some are designed to be panel-mounted with screws. Many models have integrated fuse-holders and an illuminated switch.

“We’re bringing reliable connection of AC power to critical components with these new IEC connectors, power entry modules, PDUs and accessories,” said product line manager Dan Rebeck. “There are over 100 configurations to choose from, many are UL listed and we’re L-com so we keep them in stock.”

L-com’s new IEC connectors and power entry modules, IEC connector accessories and IEC power distribution units are in stock now and available for immediate shipment.

About L-com

L-com, a leading manufacturer of wired and wireless connectivity products, offers a wide range of solutions and unrivaled customer service for the electronics and data communications industries. The company’s product portfolio includes cable assemblies, connectors, adapters, antennas, enclosures, surge protectors and more. Headquartered in North Andover, MA, L-com is ISO 9001:2015-certified and many of its products are UL recognized. L-com is an Infinite Electronics brand.

About Infinite Electronics:

Infinite Electronics has a global portfolio of leading in-stock connectivity solution brands. The brands help propel the world’s innovators forward by working urgently to provide products, solutions and real-time support for their customers. Backed by Warburg Pincus, Infinite’s brands serve customers across a wide range of industries with a broad inventory selection, same-day shipping and 24/7 customer service.

Learn more at infiniteelectronics.com.

PLANO, TX, Feb 22, 2024 – Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips.

Siemens has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips.

Leveraging the expertise and world class technology of Siemens’ industry leading IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated IC packaging solutions that cover planning and prototyping, all the way to enabling signoff across a broad range of integration technologies including FCBGA, 2.5/3D IC, and others.

“We are providing our customers with highly innovative advanced packaging technology,” said Rahul Goyal, vice president and general manager, product and design ecosystem, Intel Foundry. “Our collaboration with Siemens enables us to define a certified, production ready EMIB technology reference flow that we can deliver to our customers so that they can design efficiently and effectively.”

With this new Intel Foundry workflow, mutual customers can tackle a range of critical tasks including early package assembly prototyping, hierarchical device floorplanning, co-design optimization, verification of the complete detailed implementation, including signal and power integrity analysis, and Package Assembly Design Kit (PADK) driven assembly verification.

The Siemens technologies incorporated in this reference flow include Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx software SI/PI and the Calibre nmPlatform tool including Calibre 3DSTACK software.

“Siemens is pleased to collaborate with Intel Foundry to develop and deliver a certified reference flow for Intel’s innovative EMIB technology,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “As a longtime supplier to Intel, Siemens is honored to be chosen for this project and looks forward to sharing our 3D-IC expertise for the benefit of our mutual customers.”

To learn more about Siemens EDA’s offerings in solutions to support 3D-IC design, visit: https://eda.sw.siemens.com/en-US/

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

SANTA CLARA & SAN JOSE, CA, Feb 21, 2024 – Intel Foundry Services (IFS) and Cadence Design Systems, Inc. announced they have expanded their partnership and entered into a multiyear strategic agreement to jointly develop a portfolio of key customized IP, optimized design flows and techniques for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery. Joint customers will be able to accelerate their SoC project schedules on process nodes from Intel 18A and beyond while optimizing for performance, power, area, bandwidth and latency for demanding AI, HPC and premium mobile applications.

“We furthered our partnership with Intel Foundry Services through a significant strategic multiyear agreement to provide design software and leading IP at multiple Intel advanced nodes, thereby advancing Intel’s IDM 2.0 strategy and accelerating mutual customer success,” said Anirudh Devgan, president and chief executive officer at Cadence.

“We’re very excited to expand our partnership with Cadence to grow the IP ecosystem for IFS and provide choice for customers,” said Stuart Pann, Intel senior vice president and general manager of IFS. “We will leverage Cadence’s world-class portfolio of leading IP and advanced design solutions to enable our customers to deliver high-volume, high-performance and power-efficient SoCs on Intel’s leading-edge process technologies.”

Fast-growing market segments, such as AI/ML, HPC and premium mobile computing, require the latest standards in IP to take advantage of advanced packaging and silicon process technologies. Cadence’s leading-edge implementations of trailblazing standards, such as advanced memory protocols, PCI Express, UCI Express and others for these key segments, enable joint customers to achieve scalable, high-performance designs that accelerate their time to market in IFS’ most advanced silicon technologies and 3D-IC packaging capabilities.

Building a world-class foundry business is key to Intel’s IDM 2.0 strategy, and this agreement strengthens IFS’ offerings by making an additional portfolio of essential design tools, flows and interface IP available for foundry customers. It builds on Intel’s engagement with other industry-leading IP providers as it continues to grow the IP ecosystem for IFS customers.

About Intel

Intel is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, they continuously work to advance the design and manufacturing of semiconductors to help address their customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, they unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to intel.com.

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For.

Learn more at cadence.com.