Category Archives: CAD-CAM-CAE

PTC Q2 Results, Conf Call on Apr 27, 5PM ET

BOSTON, MA, Apr 11, 2022 – PTC will release its fiscal 2022 second quarter results on Wednesday, April 27 after the stock market closes. Senior management will host a live webcast and conference call to review the results on Wednesday, April 27 at 5PM Eastern Time. The earnings press release, accompanying earnings presentation, and financial data tables will be accessible prior to the conference call and webcast on the Investor Relations section of the Company’s website at PTC Investor Relations.

What:           PTC Fiscal Q2’22 Conference Call and Webcast

When:          Wednesday, April 27 at 5PM (ET)

Webcast:     Register Here

Replay:        To access the replay via webcast, please visit this page.

About PTC

PTC enables global manufacturers to realize double-digit impact with software solutions that enable them to accelerate product and service innovation, improve operational efficiency, and increase workforce productivity. In combination with an extensive partner network, PTC provides customers flexibility in how its technology can be deployed to drive digital transformation – on premises, in the cloud, or via its pure SaaS platform

For more information, please visit www.ptc.com.

Procore Partners with Building Transparency

CARPINTERIA, CA, Apr 8, 2022 – Procore Technologies, Inc., a leading global provider of construction management software, announced a new integration with Building Transparency, a nonprofit organization with the mission to enable broad and swift action to address the construction industry’s role in climate change. The integration enables Procore users to leverage the Embodied Carbon in Construction Calculator (EC3) in an effort to drive sustainability across the global construction industry.

Between 2015 and 2050 worldwide, two trillion square feet of buildings are expected to be built or renovated, and the World Green Building Council estimates that construction materials account for approximately 11 percent of global carbon emissions. In order to address Environmental, Social and Governance (ESG) and sustainable building practices, the EC3 tool is a free database that calculates the embodied carbon emissions associated with design and material procurement, ultimately helping specialty contractors, general contractors and owners reduce embodied carbon emissions in construction. The EC3 calculator was co-conceived and developed by Skanska and C Change Labs; it was jointly seed-funded by Skanska and Microsoft.

The EC3 integration provides Procore users the opportunity to reduce construction waste and rework, accounting for nearly $500 billion annually across the globe according to the 2018 FMI Report. By giving construction professionals the tools to benchmark and assess their carbon footprint, the tool actively helps companies realize their sustainability targets and reduce carbon emissions.

“We are thrilled to provide our customers around the globe access to the Embodied Carbon in Construction (EC3) tool,” said Tooey Courtemanche, Procore founder and CEO. “As a dedicated partner to the construction industry, it is our responsibility to support the growing need for sustainable building. Our partnership with Building Transparency and the new EC3 integration reinforces our vision of improving the lives of everyone in construction and the communities we serve.”

“Our partnership with Procore is a great step forward in educating our industry on the importance of reducing embodied carbon emissions and the tools already available to do so,” said Stacy Smedley, executive director of Building Transparency. “EC3 enables the industry to measure and understand the carbon footprint of their projects and set reduction targets to begin to address our collective impact on climate change.”

To learn more about how Procore is partnering with Building Transparency to support greener construction practices, register for Procore’s global Innovation Summit taking place April 19.

About Procore

Procore is a leading global provider of construction management software. Over 1 million projects and more than $1 trillion USD in construction volume have run on Procore’s platform. Procore’s platform connects key project stakeholders to solutions Procore has built specifically for the construction industry—for the owner, the general contractor, and the specialty contractor. Procore’s App Marketplace has a multitude of partner solutions that integrate seamlessly with Procore’s platform, giving construction professionals the freedom to connect with what works best for them. Headquartered in Carpinteria, CA, Procore has offices around the globe.

Learn more at Procore.com.

BricsCAD AX3000 MEP Suite Added to CITF’s Pre-Approved BIM List

GHENT, Belgium, Apr 5, 2022 – Global software developer Bricsys, part of Hexagon, announced that BricsCAD AX3000 MEP Suite has been admitted to the Construction Innovation and Technology Fund’s (CITF) Pre-approved BIM Software List.

The decision enables eligible applicants in Hong Kong’s construction industry to benefit from government-subsidized discounts on BricsCAD AX3000 MEP Suite – a solution for building mechanical, electrical and plumbing engineering – through its Construction & Innovation Technology Fund (CITF).

The newly-approved BIM solution leverages specialised AX3000 modules that interact seamlessly with each other and BricsCAD to cover all aspects of building services engineering: ventilation, heating, sanitation, electrical, residential ventilation and fire safety and sprinkler systems.

Pat Williams, vice-president of sales, APAC at Bricsys comments: “We are delighted that eligible users across Hong Kong will enjoy access to this market-leading solution at a reduced price through the CITF. We believe the admission of our solution to the CITF Pre-approved BIM Software List is an endorsement of the powerful combination that AX3000 and BricsCAD represents as the construction industry continues to digitize.”

BricsCAD and AX3000 MEP are built on a familiar DWG file format. This enables engineers to seamlessly bring their 2D CAD drawings into the platform, rather than re-building them from scratch in a new environment. It is also based on an openBIM architecture, accelerates time to value and reduces hours lost to training.

Williams continues: “Some software packages require engineers to spend between nine and 18 months getting up to speed on their technology, UX and UI. In today’s fast paced business world, we recognise the need to shorten that learning curve and as a result of its familiar DWG environment, training on BricsCAD AX3000 MEP Suite typically takes between 10 weeks and three months.”

In addition, all IFC (Industry Foundation Classes) data created in BricsCAD is fully certified to openBIM industry standards and can be shared across different software platforms, facilitating the exchange of digital building models and extraction of required engineered drawings

About Bricsys

Bricsys, part of Hexagon, is the global technology company that creates the BricsCAD family of CAD products and the Bricsys® 24/7 project collaboration platform. They are relentlessly committed to the success of customers by offering cost-effective, mission-critical CAD software with industry-leading product support. Established in Belgium in 2002, Bricsys NV has approximately 300 employees around the world, partners in more than 80 countries and 1,200 registered application developers.

For more information, visit www.bricsys.com.

Bentley Education Announces Digital Twin Design Challenge

EXTON, PA, Mar 25, 2022 – Bentley Systems, Inc., the infrastructure engineering software company, announced Bentley Education’s Digital Twin Design Challenge—a student contest that provides an opportunity to reimagine a real-world location with a structure designed with the popular Minecraft video game. Digital twin technology is set to be the next powerful tool for future engineers, and this contest is a unique opportunity for students to explore it in a creative way.

Through the Digital Twin Design Challenge, students have the chance to combine their imagination and creativity by exploring infrastructure digital twins. Students will use Minecraft to take a real-world location and design a new structure within it. In addition to gaining recognition from Bentley Education, the top 20 finalists will receive USD 500 each. The winner chosen by expert judges will receive a prize of USD 5,000, and the winner from the popular vote category will win a prize of USD 2,000.

The challenge is open to students aged between 12 years and 25 years from secondary schools, high schools, community colleges/schools, polytechnics, technical institutes, and universities. Students can design structures that address issues like environmental sustainability, architectural aesthetics, and population growth, or solve a specific engineering challenge. These designs can be in the form of any superstructure, such as a building, bridge, monument, park, train station, or airport.

With the world and its infrastructure facing many growing challenges, future engineers will turn to digital twin technology to manage them. Because digital twins are virtual representations of the real world, they can help combine and visualize data to optimize decision-making and enable effective planning and action.

Katriona Lord-Levins, chief success officer, Bentley Systems, said, “This challenge is continuing Bentley Education’s mission of nurturing future professionals for careers in engineering, design, and architecture. We want students to show their creativity using Minecraft and explore the potential of Bentley’s iTwin technology to tackle a challenge facing the world’s infrastructure. And, along the way, we want to inspire and encourage students to learn about infrastructure engineering as a possible career and expose them to the opportunities that lie ahead, with infrastructure going digital.”

When their design is ready, students will export the structure as a 3D model and place it within the real-world location using the Bentley iTwin platform. Students will also need to submit a short essay describing the concept behind their design. To participate in the challenge, students must register and submit their projects before March 31, 2022. To register and to learn more about the submissions, judging criteria, and other information, click here.

About Bentley Education

Bentley Education program encourages the development of future infrastructure professionals for careers in engineering, design, and architecture by providing student and educator learning licenses of popular Bentley applications at no cost through the new Bentley Education portal. The program is designed to create world-class talent that can rise to the challenges of improving quality of life and positively changing the world using Bentley infrastructure engineering software applications and proven learnings. The Bentley Education program will also help students develop digital skills that are critical for a qualified talent pipeline to support infrastructure growth and resilience worldwide.

About Bentley Systems

Bentley Systems is the infrastructure engineering software company. They provide innovative software to advance the world’s infrastructure – sustaining both the global economy and environment. Their industry-leading software solutions are used by professionals, and organizations of every size, for the design, construction, and operations of roads and bridges, rail and transit, water and wastewater, public works and utilities, buildings and campuses, mining, and industrial facilities. Their offerings include MicroStation-based applications for modeling and simulation, ProjectWise for project delivery, AssetWise for asset and network performance, Seequent’s leading geoprofessional software portfolio, and the iTwin platform for infrastructure digital twins. Bentley Systems employs more than 4,500 colleagues and generates annual revenues of approximately $1 billion in 186 countries.

For more information, visit www.bentley.com.

Autodesk to Acquire The Wild

SAN FRANCISCO, CA, Mar 25, 2022 – Autodesk, Inc. has announced it has signed a definitive agreement to acquire The Wild, a cloud-connected, extended reality (XR) platform, which includes its namesake solutions, The Wild, and IrisVR. The Wild enables architecture, engineering, and construction (AEC) professionals to present, collaborate and review projects together in immersive and interactive experiences, from anywhere and at any time. This acquisition enables Autodesk to meet increasing needs for augmented reality (AR) and virtual reality (VR) technology advancements within the AEC industry and further support AEC customers throughout the project delivery lifecycle.

Serving more than 700 customers worldwide across its two platforms, The Wild’s XR technologies offer affordable, on-demand and in-context opportunities for deeper team collaboration. Its virtual format empowers remote workforces amid a rapidly evolving work landscape and offers an immersive environment for real-time ideation and decision making.

“Our acquisition of The Wild reflects the rapid transformation taking place in the building industry, from the complexity of projects to the geographic diversity of teams who design, construct, and operate them,” said Andrew Anagnost, CEO and president, Autodesk. “XR is a must-have business imperative for today and an important part of Autodesk’s Forge platform vision.”

The Wild’s virtual platform allows teams to work together inside digital project models to explore, interact, and make changes to the model directly in the cloud. This leads to better decisions and project outcomes at a fraction of the time and cost for in-person collaboration methods.

“The Wild and Autodesk share a common mission of encouraging a more productive and collaborative AEC industry, and in this case, one where teams can resolve issues in minutes from their desks rather than the traditional miles of costly travel,” said Gabe Paez, founder and CEO of The Wild. “The Wild’s customers understand the value from the get-go, building consensus as a team in the virtual world with the ability to make changes to their designs at the speed of thought.”

Black & Veatch is a global leader in engineering, construction and procurement with more than $3 billion in annual revenue. Black and Veatch’s Technology Innovation Lead, Brian Melton, indicates The Wild’s IrisVR and a wide range of Autodesk solutions, including Autodesk design software and Autodesk Construction Cloud, enables many of their teams to successfully deliver projects around the world. The Black & Veatch team uses Autodesk solutions and The Wild’s IrisVR to connect its project professionals, clients, and partners with digital workflows and enhanced collaboration capabilities. IrisVR enables distributed work groups to increase engagement and improve collaboration between stakeholders by leveraging immersive virtual meetings. This leads to an enhanced awareness regarding safety, access and maintenance, and an overall better understanding of the project, leading to better decisions and better outcomes.

“As remote collaboration continues to become the new normal for many professionals across industries and market sectors, the capabilities of systems like Autodesk Construction Cloud and The Wild’s IrisVR platform help Black & Veatch deliver world-class projects regardless of our professionals’ physical location,” said Brian Melton, technology innovation lead, Black & Veatch. “This type of spatial real-scale immersive experience is a game-changer for our professionals by allowing us to meet virtually within the project design environment, to talk about the design, conduct reviews and coordinate activities, document potential issues and collect comments aimed at accelerating execution and improving safety. Autodesk’s acquisition of The Wild could create an even more seamless integration of VR into the platforms we use, leading to wider adoption, more capabilities and a shift from what was once sci-fi to a daily activity.”

Why XR now?

“A convergence of events makes this the right time for Autodesk’s acquisition of The Wild’s talent and technology as the foundation of Autodesk’s XR journey,” said Nic Fonta, general manager of XR at Autodesk. “Accessibility, affordability, as well as the future of digital twins and metaverse, create the right environment and business rationale for advancing XR technology within the AEC industry.”

  • Resiliency – The need for greater workforce resiliency and remote collaboration has increased significantly amid the global pandemic. With physical distancing and ever-evolving travel restrictions, XR solutions offer a way to virtually keep teams together and projects moving with minimal interruption.
  • Accessibility and Affordability – Until recently, the cost of professional grade Virtual Reality (VR) and Augmented Reality (AR) equipment was unattainable for many. Now, headsets cost a few hundred dollars instead of thousands, and most smart phones support AR – putting the power of XR into the hands of anyone, anywhere, at any time.
  • Sustainability – In-person collaboration often requires costly travel and unnecessarily contributes to harmful carbon emissions – and, when teams cannot meet to work through design issues together, expensive rework and significant material waste are often a consequence. Offering streamlined, instantaneous, and immersive cloud collaboration allows teams to save time, money, and materials.

The Wild and IrisVR draw data from various AEC technologies into their respective XR collaborative experiences to perform design review and model coordination. Cumulatively, existing integrations include Autodesk Construction Cloud (Autodesk BIM 360, Autodesk Build), Autodesk Revit, Autodesk Navisworks, as well as other non-Autodesk technologies, Rhinoceros and Trimble SketchUp. For more information about integrations, please visit The Wild and IrisVR.

About Autodesk 

Autodesk is changing how the world is designed and made. Their technology spans architecture, engineering, construction, product design, manufacturing, media and entertainment, empowering innovators everywhere to solve challenges big and small. From greener buildings to smarter products to more mesmerizing blockbusters, Autodesk software helps their customers to design and make a better world for all.

For more information, visit autodesk.com.

Empower Launches Quad-Output Step-Down Converters Series

HOUSTON, TX, Mar 22, 2022 – Empower Semiconductor, Inc., the world leader in integrated voltage regulators (IVRs), has announced a series of quad-output step-down converters that combine the industry’s highest current density and efficiency, the fastest dynamic voltage scaling (DVS) and transient response, and extensive fault protection. As with previous members of Empower’s IVR family, the new digitally configurable EP71xx series can deliver complete voltage regulation and protection functionality without the need for external discrete components. Furthermore, the EP71xx series can eliminate other system components that increase cost and area by integrating those system functions.

Empower’s IVRs are high-performance power management chips designed to provide efficiency, size, and cost benefits to energy-hungry, data-intensive, electronics applications by replacing traditional power management integrated circuits (PMICs) with a single tiny IC. IVRs monolithically integrate the voltage regulator semiconductor and all the necessary discrete components into a single device. Such integration simplifies the design and implementation of voltage regulation circuitry, improves efficiency by eliminating connection losses, reduces susceptibility to EMI, minimizes the bill of materials, enhances overall reliability and reduces PCB footprint.

The EP71xx series delivers an impressive 12A of continuous current with up to 4 voltage regulators in a single FcCSP package that measures just 5mm x 7mm and only 0.7mm in height! Maximum efficiencies can be achieved, minimizing losses across the widest possible range of operating conditions. Ultra-fast transient response supports regulation through a load step and the programmable ‘ExpressV’ DVS-on-demand is capable of up to 6mV/ns. This feature is more than 1000x faster than other competing technologies and enables rapid, lossless, processor state changes that can significantly reduce processor power.

Commenting on the launch of the new IVR series, Mukund Krishna, Empower’s senior product marketing manager states: “Conventional power management solutions do not offer the power density, simplicity and flexibility demanded by rapidly evolving data-intensive applications. With the addition of the new quad-output devices to our IVR family, we are giving system designers the opportunity to reduce PCB power management area and components by ten times or more, drive down system power losses by as much as 50%, and greatly simplify system design.”

The new IVRs operate from a single 3.3V input and offer output current options up to 12A. The EP71xx family comprises a variety of devices that can provide the available 12A from one to four independent outputs. Output voltages are programmable from 0.5V to 2.5V and output voltage set-point accuracy is +/- 1.0%. Built-in fault protection and warning capabilities cover OVLO, UVLO, OVP, OCP and short-circuits.

The EP71XX devices pack a full suite of telemetry functionality to report voltage, current and die-temperature, and continue to feature programmable soft-start and DVS ramp rates via the digital interface. Enhancements to the EP71xx include advanced features such as user-programmable power-up/power-down sequencing, user-configurable logic levels and programmable GPIOs to enable customized system functionality. All configurations and diagnostics are available through a standard I2C interface.

Target applications for the new series will include optical transceivers, active cables, memory modules and storage devices, networking equipment such as GPON and Photonic Service Switches, PoL power for CPUs, GPUs, accelerators and AI processors and 5G systems.

Tim Phillips, CEO, president and founder of Empower, adds: “Our mission is to minimize the energy footprint of the digital economy by providing high-performance, ultra-efficient technologies that allow designers and system architects to quickly implement power management solutions that keep power consumption to a minimum. The new quad-output IVR series is further evidence of how we are delivering on that promise.”

About Empower Semiconductor

The exponential increase in the amount of data being communicated and processed around the globe is driving the energy consumption of data centers and communications networks to 17% of total electricity demand worldwide by 2030(1), dramatically increasing pollution, carbon emissions and cost. Empower Semiconductor was founded with the mission to “minimize the energy footprint of the digital economy” by developing novel fully integrated power management solutions that both increase the performance and reduce the power consumption of energy-hungry, data-intensive applications.

Traditional power solutions require dozens of discrete components with big footprints, complex designs and deliver power inefficiently with poor response times and inaccuracies. Empower Semiconductor’s patented IVR technology integrates dozens of components into a single IC increasing efficiency, shrinking footprints by 10x and delivering power with unprecedented simplicity, speed & accuracy and with zero discrete components. The Empower IVR™ technology solves the power density challenge to address a wide range of applications including mobile, wearables, 5G, AI, and data centers. In 2020 the capacitor technology platform was added to further address power density. E-CAP revolutionized the capacitor industry as the world’s smallest, highest performing, and incredibly reliable capacitor for wearables, mobile, and SoC applications. The company is based in Silicon Valley, CA and is led by a team of highly experienced power experts and executives.

(1) Nature, “How to stop data centres from gobbling up the world’s electricity,” September 2018

Braskem Expands Additive Manufacturing Portfolio

PHILADELPHIA, PA, Mar 22, 2022 – Braskem, the largest polyolefins producer in the Americas, as well as a market leader and pioneer producer of biopolymers on an industrial scale, announces today the expansion of its 3D printing product portfolio to include polyethylene (PE) and glass fiber reinforced polypropylene (PP) filaments. Braskem’s PE and glass fiber reinforced PP filaments are easier to print, have less warpage, minimal shrinkage, and better interlayer adhesion than other comparable products on the market.

Jason Vagnozzi, Braskem commercial director of additive manufacturing, stated, “Braskem continues to evolve its product portfolio for the rapidly growing 3D printing market. Braskem’s polypropylene and polyethylene products have superior printing capabilities with minimum warpage and are the ideal solution for 3D printing. Unlike other materials on the market, Braskem’s PE is perfect for packaging and consumer applications and can be used anywhere HDPE would normally be used, while our new glass fiber reinforced polypropylene has added strength and durability which makes it a great solution for automotive, aerospace, medical, robotic, and industrial applications. At Braskem, our team strives every day to innovate and expand our portfolio of additive manufacturing products to facilitate the growth of our clients.”

Glass Fiber Reinforced PP 3D Printing Filament (FL500PP-GF)

FL500PP-GF glass fiber reinforced polypropylene filament is a specially formulated co-polymer for additive manufacturing, containing glass fiber for added strength and durability.  This formulation is designed to maximize printability, dimensional stability, and surface finish, while minimizing warpage and bed adhesion issues.

Applications

  • Automotive, aerospace, medical, robotic, and industrial applications
  • Rapid prototyping and mass-customization
  • Lightweight and rigid part design
  • Compatible with Ultimaker, Creality, and similar equipment

Features

  • High strength and stiffness
  • Low density and lightweight
  • Excellent surface finish
  • Low warpage and high dimensional stability
  • Available color:  black
  • Available diameters: 2.85mm, 1.75 mm

Benefits

  • No drying required
  • High chemical resistance
  • Heated chamber not required
  • Excellent bed adhesion
  • Print profiles available on Ultimaker Cura Marketplace

Glass fiber reinforced polypropylene filaments have a lower density than other plastics making it up to 30% lighter than traditional PLA and up to three times stiffer than ABS.  In addition, polypropylene filaments do not require any drying prior to printing, unlike other materials such as nylon, making it more efficient to work with.  These properties, combined with the recyclability of polypropylene, make it an attractive material for a wide range of 3D printing and additive manufacturing applications.  Braskem filaments are designed with the end user in mind, making them a great choice for automotive, aerospace, medical, packaging, and other consumer applications.

Polyethylene 3D Printing Filament (FL300PE)

FL300PE is a 100% polyethylene filament designed to be easy to print, lightweight, highly moisture and chemical resistant. This filament is ideal for packaging, prototyping, as well as industrial and consumer goods applications. FL300PE is an excellent solution anywhere traditional HDPE resins are typically required.

Applications

  • Packaging, consumer, and industrial applications
  • Rapid prototyping and mass-customization
  • Compatible with Ultimaker, Creality and similar equipment

Features

  • Low density and lightweight
  • Excellent surface finish
  • Low warpage and high dimensional stability
  • Available color:  White
  • Available diameters: 2.85mm, 1.75 mm

Benefits

  • No drying required
  • High chemical resistance
  • Heated chamber not required
  • Excellent bed adhesion
  • Print profiles available on Ultimaker Cura Marketplace

Polyethylene filaments have historically been difficult to print, prone to warpage and shrinkage.  Braskem has taken a fresh look at polyethylene and developed a 100% HDPE filament that has been specifically engineered for 3D printing applications. Braskem’s PE filaments are designed to be easy to print, lightweight, recyclable, highly moisture and chemical resistant. This filament is ideal for packaging, rapid prototyping, as well as industrial and consumer goods applications.

To learn more about Braskem’s expanding portfolio for 3D printing and additive manufacturing, visit https://www.braskem.com/usa/3d-printing. Visit Braskem in person at North America’s largest Additive Manufacturing event, Rapid + TCT, May 17-19 in Detroit. Braskem’s booth # is 3813.

About Braskem

With a global vision of the future oriented towards people and sustainability, Braskem is committed to contributing to the value chain for strengthening the Circular Economy. The petrochemical company’s almost 8,000 team members dedicate themselves every day to improve people’s lives through sustainable chemicals and plastics solutions. Braskem has an innovative DNA and a comprehensive portfolio of plastic resins and chemical products for diverse segments, such as food packaging, construction, manufacturing, automotive, agribusiness, healthcare, and hygiene, among others. With 41 industrial units in Brazil, the United States, Mexico and Germany, Braskem exports its products to clients in more than 80 countries.

Braskem America, Inc. is an indirect wholly owned subsidiary of Braskem S.A. headquartered in Philadelphia. The company is the leading producer of polypropylene in the United States, with six production plants located in Texas, Pennsylvania and West Virginia, an Innovation and Technology Center in Pittsburgh, and operations in Boston focused on leveraging groundbreaking developments in biotechnology and advanced materials.

For more information, visit www.braskem.com/usa.

Balluff Announces BOS R81K Series Photoelectric Sensors

Balluff’s new BOS R81K series photoelectric sensors deliver reliable detection in a wide range of industrial applications.

These sensors are available in retroreflective, diffuse, diffuse with background suppression and through-beam versions, each with PNP and NPN options.

The bright LED red light-beam in the retroreflective, diffuse and background suppression versions enables sensing ranges up to 3 m and gives accurate results even in dirty and dusty industrial atmosphere. The through-beam version uses infrared light and delivers a sensing range up to an impressive 20 m.

With an 18mm threaded bullnose housing style, each sensor provides an easy mounting option in addition to the mounting holes on the sensor body. They are quick and easy to connect with either a 2-meter cable-out or an M12 connector. And the ABS housings are well suited to tough industrial areas. Adjustment is quickly carried out by means of a top-mounted potentiometer.

Whether using as a through-beam sensor, a retroreflective sensor or a diffuse sensor, with or without background suppression, the BOS R81K series is ideally suited for controlling and monitoring conveyor systems and error proofing in assembly.

About Balluff Inc.

Balluff Inc., the US subsidiary of Balluff GmbH, Neuhausen, Germany, is a manufacturer of inductive, photoelectric, vision, capacitive and magnetic sensors as well as linear position transducers, RFID systems, and networking products. Balluff products for OEM and factory floor solutions are used to control, regulate, automate, assemble, position, and monitor manufacturing, assembly, and packaging sequences for industries including metalworking, automotive, plastics, material handling, wood processing, aerospace, alternative energy, medical, electrical, and electronics.

For more information, visit Balluff website.