Category Archives: CAD-CAM-CAE

Samsung Foundry Certifies ANSYS Multiphysics Simulation

PITTSBURGH, PA, Oct 18, 2019 – Samsung Foundry certified ANSYS multiphysics simulation solutions for its latest multi-die integration (MDI) advanced two and a half dimensional/three-dimensional integrated circuit (2.5D/3D-IC) packaging technology. The certification empowers mutual customers to achieve higher performance and lower power within a smaller form factor when designing 2.5/3D-ICs for artificial intelligence (AI), 5G, automotive, networking and high-performance computing (HPC) applications.

System-in-Package designs — enabled by Samsung MDI — are highly complex with multiple dies integrated on an interposer in a 2.5D/3D packaging configuration. MDI flow combines analysis, implementation and physical verification in a single canvas and uniquely features early-stage system-level pathfinding and complex multiphysics signoff capabilities. These designs are widely used in AI, 5G, automotive, high-speed networking and HPC applications to achieve extreme system bandwidth, low latency and high performance. ANSYS multiphysics simulation solutions for MDI signoff offer a complete 2.5D/3D-IC methodology for power, signal and thermal integrity and reliability analysis across the broad frequency spectrum of chip, package and board and system design to improve engineering efficiency, achieve simulation accuracy and accelerate time-to-results.

Samsung Foundry certifies ANSYS Icepak and ANSYS RedHawk family of solutions for power, signal and thermal integrity and reliability analyses. The certification allows for detailed modeling of silicon interposer, through silicon vias, microbumps, high-bandwidth memory, high-speed interfaces and different dies, which is critical for accurately simulating power, signal and thermal integrity effects.

“Samsung Foundry and ANSYS’ advanced packaging reference flows for MDI empower our mutual customers to achieve improved power, performance and area requirements, as well as cost and turn-around time reduction through accurate analysis of complex interconnections across the chip, package and board,” said Jung Yun Choi, vice president, foundry design technology team at Samsung Electronics. “ANSYS provides comprehensive chip-package-system co-analysis workflows for addressing complex multiphysics challenges of extraction, power and signal electromigration, thermal-induced stress, signal integrity and reliability in 2.5D/3D-IC packaging technologies.”

“2.5D/3D-ICs for AI, networking, 5G, automotive and HPC applications are extremely complex and require comprehensive multiphysics analysis to maximize performance,” said Vic Kulkarni, vice president, strategy, semiconductor business unit at ANSYS. “Leveraging ANSYS multiphysics solutions for Samsung MDI enables mutual customers to achieve silicon to system success and accelerate time to market, while reducing costs through smaller form factors.”

About ANSYS, Inc.

If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through their strategy of Pervasive Engineering Simulation, they help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, they help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, ANSYS is headquartered south of Pittsburgh, PA, USA.

Visit www.ansys.com for more information.

ANSYS Q3 Results, Conf Call on Nov 7, 8:30AM ET

PITTSBURGH, PA, Oct 18, 2019 – ANSYS, Inc. announced that the company expects to release its third quarter 2019 earnings on Wednesday, November 6, 2019, after market close. The company will hold a conference call conducted by Ajei Gopal, president and chief executive officer, and Maria T. Shields, chief financial officer, at 8:30AM ET on November 7, 2019, to discuss third quarter 2019 results and future outlook.

Conference Call Information

What: ANSYS Third Quarter 2019 Earnings Conference Call
When: November 7, 2019 at 8:30AM ET

We encourage participants to pre-register for the conference call using the enclosed link.  Callers who pre-register will be given a unique PIN to gain immediate access to the call, bypassing the live operator. Participants may pre-register any time, including up to and after the call start time. You will immediately receive an online confirmation, an email with the dial-in number and a calendar invitation for the event.

To pre-register, go to: http://dpregister.com/10135834

You may also reach the pre-registration link by logging in through the investor section of our website at https://investors.ansys.com and clicking on the Audio Webcasts link. Click the event under News & Events.

The following will be accessible at https://investors.ansys.com: a link to the live audio webcast on the day of the conference call, the earnings press release and prepared remarks, as well as the updated quarterly IR Presentation. For those who do not have internet access or are unable to pre-register, simply join the call on the day of the event by dialing (855) 239-2942 (US) or (412) 542-4124 (Canada & INT’L). Ask the operator to join you into the ANSYS Conference Call.

The call will be recorded with replay available within two hours after the call at https://investors.ansys.com or at (877) 344-7529 (US), (855) 669-9658 (toll-free Canada) or (412) 317-0088 (INT’L). Passcode: 10135834

About ANSYS, Inc.

If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through their strategy of Pervasive Engineering Simulation, they help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, they help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, ANSYS is headquartered south of Pittsburgh, PA, USA.

Visit www.ansys.com for more information.

MSC Launches Customer Experience Center in Pune, India

BANGALORE, India, Oct 17, 2019 – MSC Software Corp., a global leader in CAE simulation software and services, announced the launch of its new Customer Experience Center in Pune, India. Visitors will be able to access its Virtual Test Drive simulator – the first to be open to anyone in India – and experience how immersive virtual reality (VR) technology can be used to understand complex simulated phenomena in a more relatable visualization.

Participants experience the Virtual Test Drive (VTD) Simulator and simulation model of a fluid flow analysis via the VR headset.

The centre is split between two experience zones. The first focuses on MSC’s Virtual Test Drive (VTD) solution, which provides a complete toolchain to simulate vehicle driving applications. VTD allows for the creation, configuration, presentation and evaluation of virtual environments for road and rail simulations. It is used for the development of Advanced Drive Assistance Systems (ADAS) and automonomus driving systems, and to create real-world scenarios for vehicle driver training simulators.

The VTD zone will showcase the capabilities of the open and flexible modular platform, from the generation of 3D visualizations to the simulation of complex traffic scenarios and simplified or physical sensor models. Demonstrations will show VTD in use throughout the automotive supply chain for Software in the Loop (SiL), Driver in the Loop (DiL), Vehicle in the Loop (ViL) and Hardware in the Loop (HiL) applications, and coupled with MSC and third party or custom packages for high fidelity co-simulations.

The second zone is a Virtual Reality experience zone showcasing the powerful capabilities of Cradle Computational Fluid Dynaics (CFD) suite, and how it is used to help non-CFD specialists conceptualize design choices. For example, it allows a viewer to virtually fly over skysrapers to understand how wind is channeled, to see air flows inside a room to understand effectiveness of simulated air-conditioning, or to look aroud a graphics card to understand which components are at risk of overheating or thermal fatigue.

Sridhar Dharmarajan, managing director, Indo-Pacific Region, MSC Software commented on the significance of the Center, “Building a driverless car requires that an autonomous system learns to drive as well as a human, its artificial intelligence needs to ‘drive’ a highfidelity representation of the actual vehicle for billions of miles. Our VTD simulator will show customers how they can test all the systems involved to make this complex engineering challenge possible and enable close synchronization of engineering effort throughout the supply chain. Similarly, our VR zone is designed to provide a truly immersive experience that will aid better design and engineering by including stakeholders from the beginning the end of development.”

About Hexagon | About MSC Software

Hexagon is a global leader in sensor, software and autonomous solutions. They are putting data to work to boost efficiency, productivity, and quality across industrial, manufacturing, infrastructure, safety, and mobility applications.

Their technologies are shaping urban and production ecosystems to become increasingly connected and autonomous – ensuring a scalable, sustainable future.

MSC Software, part of Hexagon’s Manufacturing Intelligence division, is one of the ten original software companies and a global leader in helping product manufacturers to advance their engineering methods with simulation software and services. Learn more at www.mscsoftware.com. Hexagon’s Manufacturing Intelligence division provides solutions that utilize data from design and engineering, production and metrology to make manufacturing smarter. For more information, visit hexagonmi.com.

Hexagon has approximately 20,000 employees in 50 countries and net sales of approximately 3.8bn EUR. Learn more at hexagon.com.

flyingshapes Launches Next-Gen VR CAD Application

MAINZ, Germany, Oct 17, 2019 – flyingshapes° has commercially launched a next-generation virtual reality CAD application targeted at streamlining 3D modeling and design for professionals working across industrial design, including product design, automotive, manufacturing, engineering, architecture, 3D printing and related fields. Available today for Oculus Rift and HTC Vive headsets, flyingshapes° innovates traditional design by introducing a VR CAD workflow for 3D spatial modeling in a fully immersive virtual environment, with intuitive haptic controls and interactive tools for sketching, surfacing and collaborating with teams on the cloud. flyingshapes° is targeted at reducing time-consuming iteration cycles during prototyping and early stages of design, with a robust feature set developed to help professionals achieve greater efficiency and accuracy in a 3D workspace than previously possible on a 2D screen.

“We’re leveraging VR technology to solve the challenges and design bottlenecks that hinder traditional CAD workflows,” said Jonas Kunze, co-founder, flyingshapes°. Lengthy iteration cycles, communication inefficiencies and discrepancies between the initial prototype and final model waste resources and can delay time to market for new products. “We’ve engineered flyingshapes° to revolutionize design workflows and help teams maximize time spent perfecting models.”

“Our vision is to make CAD as accessible as an iPhone app,” said Dr. Johannes Mattmann, co-founder, flyingshapes°. “Traditional CAD applications have a steep learning curve and require designers to create 3D models in 2D workspaces. We’re disrupting classic CAD workflows by allowing designers to sketch 3D models to scale in a fully virtual environment, using their hands to build and manipulate objects.”

Powered by Unity real-time rendering on mid- to high-end NVIDIA or AMD GPUs, flyingshapes° is a 3D surface modeling tool that allows users to sketch, shape and refine high-end CAD models within a VR headset. Intuitive haptic controls enable users to mold and position objects with exact lines, curves and surfaces using hand gestures in an immersive 360-degree workspace. Precise measurement tools and positioning aids ensure accuracy, with real-time rendering updating the model in real time. Collaboration tools enable teams to work on projects around the world and share models for review and feedback. Approved, final models can be exported in CAD file formats for 3D printing or use with traditional CAD applications.

flyingshapes° features include:

  • Virtual Design Studio:Develop and experience 3D models in an immersive VR environment, and collaborate with teams within a shared workspace.
  • 3D Sketch Pen Tool:Draw sketches at any scale and view them in an interactive 3D space.
  • Curve and Line Tool: Refine sketches with precise B-spline curves and lines, created with simple gestures in VR.
  • Surface Building Tool: Build digital models out of smooth surfaces, using a gesture-based workflow to shape and refine.
  • Taping Tool: Paint bold lines with precision for design reviews and modeling.
  • Measurement Tools: Accurately measure and define distances, angles and volumes.
  • Diagnostic and Intelligent Modeling Tools: Use parametric tools to manage continuity and verify surface quality in real-time 3D.
  • Positioning Aids:Positional tracking and aids allow controlled movements on a single axis or plane or scaling around the axis within a confined workspace.
  • CAD Import & Export:Seamlessly transfer models into traditional CAD workflows using industry-grade file formats, including STEP, STL and IGES.

flyingshapes° is available on Steam for Oculus Rift and HTC Vive for a monthly subscription starting at 49€. For more information, visit www.flyingshapes.com.

About flyingshapes°

flyingshapes° builds next-generation VR CAD solutions for industrial designers across product design, automotive, manufacturing, engineering, architecture, 3D printing and beyond. Their innovative VR CAD workflow streamlines design for precise 3D modeling, reducing iteration cycles and time between initial concept to final delivery. Available for Oculus Rift and HTC Vive, flyingshapes° combines intuitive haptic controls with an interactive user experience for simple, accurate and efficient 3D modeling in VR with high-quality results.

For more information, visit www.flyingshapes.com.