« All Events This event has passed. Utilizing Thermal Transient Testing to Improve Manufacturing March 1, 2023 « Data Management Beyond Engineering with SOLIDWORKS PDM Best Practice: Getting the Most out of Moldex3D » using thermal transient testing to measure temperature changes in semiconductor packaging, identify potential manufacturing defects Add to calendar Google Calendar iCalendar Outlook 365 Outlook Live Details Date: March 1, 2023 Event Category: CAM Website: https://webinars.sw.siemens.com/en-US/simcenter-semiconductor-die-attach-thermal-testing Organizer Siemens View Organizer Website Venue Online