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High Density Advanced Packaging

October 3, 2018 @ 9:00 am - 2:00 pm

Learn methodologies and solutions for complete IC Package and system level modeling and analysis including electromagnetic and thermal management.

Details

Date:: October 3, 2018
Time:: 9:00 am - 2:00 pm
Event Category:: CAE
Website:: https://www.mentor.com/pcb/events/high-density-advanced-packaging-hdap

Organizer

: Mentor
: View Organizer Website

Venue

: Fremont
: Fremont
Fremont, CA United States + Google Map

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