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A Look at IC Packaging and Encapsulation Simulation Technologies

Name: A Look at IC Packaging and Encapsulation Simulation Technologies
Start: 2023-04-05T11:30:00-07:00
End: 2023-04-05T11:30:00-07:00
Location: Online

April 5, 2023 @ 11:30 am

how latest simulation technology can help designers, engineers understand different manufacturing processes

Details

Date:: April 5, 2023
Time:: 11:30 am
Event Category:: CAE
Website:: https://www.moldex3d.com/events/webinar/webinar-a-look-at-ic-packaging-and-encapsulation-simulation-technologies-est/

Organizer

: Moldex3D
Phone: +886-3-560-0199
Email: mail@moldex3d.com
: View Organizer Website

Venue

: Online

TenLinks News

CAD, CAM and CAE News

A Look at IC Packaging and Encapsulation Simulation Technologies

April 5, 2023 @ 11:30 am

Details

Organizer

Venue

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