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A Look at IC Packaging and Encapsulation Simulation Technologies

April 5 @ 11:30 am

how latest simulation technology can help designers, engineers understand different manufacturing processes

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Details

Date:
April 5
Time:
11:30 am
Event Category:
Website:
https://www.moldex3d.com/events/webinar/webinar-a-look-at-ic-packaging-and-encapsulation-simulation-technologies-est/

Organizer

Moldex3D
Phone:
+886-3-560-0199
Email:
Website:
http://www.moldex3d.com/en/

Venue

Online

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