This event has passed.

Enhancing Thermo-Mechanical Analysis Workflow of Electronic Devices

Name: Enhancing Thermo-Mechanical Analysis Workflow of Electronic Devices
Start: 2021-06-30T00:00:00-07:00
End: 2021-06-30T23:59:59-07:00
Location: Online

June 30, 2021

Learn how to create a detailed electronic cooling CFD model using MCAD and ECAD data.

Details

Date:: June 30, 2021
Event Category:: PLM
Website:: https://www.plm.automation.siemens.com/global/en/webinar/thermo-mechanical-analysis-of-electronics-with-cfd-and-fea/98378

Organizer

: Siemens PLM Software
Phone: +91-124-4092244
Email: indiamarketing.plm@siemens.com
: View Organizer Website

Venue

: Online

CAD, CAM and CAE News

Enhancing Thermo-Mechanical Analysis Workflow of Electronic Devices

June 30, 2021

Details

Organizer

Venue

Leave a Reply Cancel reply