Dassault, UMass Lowell Partner to Open 3DEXPERIENCE Center

WALTHAM, MA, June 22, 2018 – Dassault Systèmes and UMass Lowell, a nationally ranked public research institution located in Lowell, Massachusetts, announced they will open a digital learning center designed to let engineering students get hands-on experience in designing and creating products for the Experience Economy.

The new 3DEXPERIENCE Center, targeted to open in 2019, will provide students with access to Dassault Systèmes’ 3DEXPERIENCE platform and its design and collaboration applications, including the company’s industry-leading SOLIDWORKS CAD software. Students at the center will learn how to design products using Augmented Reality/Virtual Reality environments, how to incorporate new technologies like the Internet of Things (IoT) and Artificial Intelligence into their product designs, and how to bring their designs to life using Robotics and Additive Manufacturing/3D Printing.

The center is part of Dassault Systèmes’ strategy to partner with companies and academic institutions to create the workforce of the future. Plans for the new 3DEXPERIENCE Center at UMass Lowell were announced during the 3DEXPERIENCE Forum being held in Boston this week. This new facility expands Dassault Systèmes’ existing relationship with UMass Lowell, which currently includes membership in PERC, the Printed Electronics Research Center, as well as support for the school’s Senior Capstone Project. Dassault Systèmes will support the new 3DEXPERIENCE Center through financial contributions as well as software licenses.

“Technology is fueling a new generation of customers that demand web-connected, customizable, sustainably-produced products, and the product designers of tomorrow will need the knowledge and skills to deliver on these expectations,” said Dean Marsh, managing director, North America, Dassault Systèmes. “We’re thrilled that the students of UMass Lowell will get real-world experience with the tools and technologies that will shape the industries of tomorrow, and put them in the best position to hit the ground running on Day 1 of their careers.”

“For more than 120 years, UMass Lowell’s Francis College of Engineering has educated students for careers in key industries through excellence in academics and research, and an emphasis on hands-on, experiential learning. Incorporating new technologies like 3D design, digital simulation and 3D printing into our curriculum is essential for preparing our students for careers in the 21st century,” said Joseph Hartman, the university’s dean of engineering. “As a major educator of New England’s future business leaders, this partnership with Dassault Systèmes will help us attract the best and brightest and prepare them for success after graduation while also accelerating our efforts to meet critical workforce needs.”

For more information about, Dassault Systèmes’ 3DEXPERIENCE platform, 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, visit www.3ds.com.

About Dassault Systèmes

Dassault Systèmes, the 3DEXPERIENCE Company, provides business and people with virtual universes to imagine sustainable innovations. Its world-leading solutions transform the way products are designed, produced, and supported. Dassault Systèmes’ collaborative solutions foster social innovation, expanding possibilities for the virtual world to improve the real world. The group brings value to over 220,000 customers of all sizes, in all industries, in more than 140 countries.

For more information, visit www.3ds.com.

PRO DESIGN Partners with Missing Link Electronics

MUNICH, Germany, June 22, 2018 – PRO DESIGN, a leading supplier of high-end FPGA systems, announced today that Missing Link Electronics (MLE) will be its new partner for IP and systems design. Together, PRO DESIGN and MLE offer FPGA turnkey solutions consisting of hardware and software for various applications such as Data Center, High Performance Computing, Autonomous Driving and others. Those applications can be based on PRO DESIGN’s proFPGA product family or on dedicated and customized FPGA platforms, designed and manufactured by PRO DESIGN.

“MLE has incredible know-how and experience in FPGA and systems design – we design and manufacture outstanding FPGA hardware. This is a great combination that allows us to offer state-of-the-art FPGA turnkey solutions for various applications,” said Philipp Ampletzer, director sales and business development at PRO DESIGN.

”FPGAs can provide significant compute acceleration. As an FPGA design service provider, we largely depend on a rich ecosystem offering FPGA hardware. In PRO DESIGN we have found a dependable partner to collaborate with on next-generation HPC and datacenter acceleration,” says Endric Schubert, co-founder and CTO of MLE.

At ISC-HPC in Frankfurt from June 25 to 27, 2018 at booth # L-416, both companies are introducing jointly developed solutions and concepts.

About Missing Link Electronics

MLE was founded in 2010 by a group of business and technology veterans in the semiconductor and embedded systems domain and, since then, has established a reputation for delivering robust solutions in a timely manner. MLE has a sales and R&D office located in Germany and is headquartered in Silicon Valley.

For more information, please visit www.missinglinkelectronics.com.


The privately held company was founded in 1982 and has around 100 employees, with various facilities in Germany, France and USA. PRO DESIGN has more than 35 years of experience in the EDA and E²MS markets. It has built extensive knowledge in the areas of FPGA board development, electronic engineering, FPGA design, high-performance PCB design, mechanical construction, production, assembly and testing.

For more information, please visit www.prodesign-europe.com/start.

About proFPGA

The proFPGA product family is a scalable high-performance (multi-)FPGA solution, which meets highest requirements in the areas of FPGA-based prototyping, pre-silicon software development and FPGA-based computing. The modular concept of the proFPGA system – using different motherboards, single tile FPGA modules, FPGA interconnects, interface and memory daughter cards – allows the user to basically create any type of hardware configuration which is still reconfigurable and can therefore be adjusted to multiple applications.

For more information, please visit www.profpga.com.

Anaglyph Releases Laminate Tools v4.8

Anaglyph has released Laminate Tools version 4.8. It introduces a substantial number of new features in the design, analysis, check and mnufacture modules. A new option for ply Forming will address a longstanding user request. A new mesher for CAD import delivers better and faster results. Functions to manipulate the mesh, plies and layup have been improved. Other additions include H3D FEA results import, as well as support for Rhino v6 and Abaqus 2018. Across the board, modules have been enriched with features based almost exclusively on user input.

Laminate Tools is a stand-alone Windows application that addresses the entire geometry import-design-analysis-check-manufacture process of composites structural design. It links the various disciplines, communicates original data between all involved in the process and saves valuable team time. Laminate tools interfaces with most CAD and FEA applications, allowing for a flexible work flow. It is used by composite structures designers and stress analysts in automotive, aerospace, marine, energy and leisure.

For more information, visit Anaglyph website.

Tungaloy Updates TungCut Grooving Tool Series

Tungaloy is expanding TungCut multi-functional grooving tool series to include AH7025, a universal PVD grade and the high-performing, –DTM style chipbreaker.

TungCut incorporates a unique insert clamping mechanism to enhance insert rigidity during machining, providing long insert life and stability in a wide range of grooving applications from Swiss-type machines to CNC lathes.

AH7025 is Tungaloy’s first-choice grade for grooving applications. The grade features a high aluminum-content nano-multilayered PVD coating with strong coating adhesion to a dedicated carbide substrate to create superior fracture toughness, which ensures high efficiency and reliability in grooving steel, alloy steel, stainless steel, and heat-resistant superalloys.

Double-edged left-/right-handed insert lines are also enhanced in this expansion with AH7025 to offer stability in parting applications.

The new –DTM style chipbreaker is a multi-functional geometry, designed to create a smooth chip flow in grooving and turning. The combination of –DTM and AH7025 provides machining stability and efficiency. This expansion enhances productivity in not only grooving and turning applications but also parting-off processes.

At a Glance:

  • High Al-content nano-multilayer coating, featuring high hardness and coating-substrate adhesion providing superior resistance to wear and chipping
  • Covers a variety of materials ranging from steel, alloy steel, stainless steel, to heat-resistant superalloys
  • The new –DTM chipbreaker on double-edged inserts
  • Ideal for grooving, groove-turning, and parting-off applications
  • Total of 22 items to be added

For more information, visit Tungaloy website.

Zuken Updates E3.HarnessAnalyzer

MUNICH, Germany and WESTFORD, MA, June 22, 2018 – Zuken’s wire harness visualization and analysis software, E3.HarnessAnalyzer, has been enhanced and extended to support the latest industry standard data formats, visualize harness data in 3D, and automatically compile schematic drawings for the displayed modules.

E3.HarnessAnalyzer 2018 supports the import of industry harness data standard formats KBL, VEC and PLMXML, visualizes them in 2D and 3D, and automatically compiles schematic drawings.

With these capabilities, E3.HarnessAnalyzer enables OEMs and suppliers to open, inspect and collaborate on previously proprietary harness design data generated by different authoring tools used in the industry.

E3.HarnessAnalyzer leverages 3D coordinates from in KBL, VEC or PLMXML data and generates a dynamic 3D representation that is directly coupled to the KBL data model.

E3.HarnessAnalyzer 2018 is available for general release in June 2018, at the same time as E3.series 2018.

Barrier-free collaboration

“E3.HarnessAnalyzer has gained industry-wide recognition as a de-facto standard for the exchange of wire harness design and manufacturing information between automotive OEMs and suppliers,” says Reinhold Blank, Zuken business director automotive. “With its coverage of the latest industry standard data formats such as KBL and HCV, Zuken paves the way for barrier-free communication between OEMs and suppliers in a discipline that has been locked in by proprietary toolsets and data formats.”

E3.HarnessAnalyzer 2018 generates schematic diagrams applying user defined filter criteria. In this way, users who have no access to the original schematics data can investigate and analyze all details of a harness design.

Supporting the latest industry data formats

The range of supported import formats has been extended to include native PLMXML and DSI capabilities. In addition, E3.HarnessAnalyzer now supports the import of data in the latest VEC (Vehicle Electric Container) industry standard format, thereby enabling review and inspection capabilities for comprehensive 150% wire harness designs, including their full range of options and variants.

3D Visualization

In addition to 2D drawings, E3.HarnessAnalyzer 2018 supports the display of wire harnesses as 3D structures. The new capability is based on 3D coordinates that are specified in KBL, VEC or PLMXML structures. Leveraging these coordinates, E3.HarnessAnalyzer generates a dynamic 3D representation that is directly coupled to the KBL data model, enabling bi-directional highlighting of selected objects, as well as representation of bundle diameters based on the individual selection of KSK modules to be considered.

Schematic browsing

In addition to topological information, KBL, VEC and PLMXML data also contain connectivity information of wire harnesses and their components. Leveraging this information, E3.HarnessAnalyzer 2018 can generate schematic views applying user-defined filter criteria. The schematic is then automatically compiled in a fraction of a second. The generated diagram is fully linked to the 2D and 3D view. This capability enables users who have no access to the original schematics data to investigate and analyze details of the harness connectivity.

For more information, see www.zuken.com/harnessanalyzer.

About Zuken

Since its establishment in 1976, Zuken has been a world-leading electronic design automation (EDA) company providing software solutions that maximize the efficiency of the design and manufacturing processes for many of the largest electronics companies around the world. Today, Zuken’s product offerings include PCB design, CAE, wire harness and cable design, and engineering data management solutions.

Innovation is a way of life at Zuken. The company has more than 375 software specialists at its development centers in Japan, Europe and the US. As a result, customers benefit from the work of the largest PCB- and wiring-focused R&D teams of their kind. This driving force of innovation keeps Zuken at the forefront of technological advancement.

Allied Machine & Engineering Available on MachiningCloud

Allied Machine & Engineering is now available on MachiningCloud. Over 6,000 of Allied Machine’s holemaking products can now be found on MachiningCloud. Included in this release are the GEN3SYS, GEN3SYS XT, GEN2 T-A, Original T-A, and Structural T-A replaceable insert drilling product lines. Allied Machine & Engineering Corp. is a global manufacturer of cutting tools designed specifically for holemaking and hole finishing. MachiningCloud is a product data provider for cutting tools, CNC machines and workholding.

The Allied MachiningCloud partnership utilizes the convenience of cloud-based technology, which enables customers to optimize the way they gather information for their manufacturing operations by effortlessly searching for the cutting tool that best fits their specific application without searching through catalogs or multiple websites.

Furthermore, Allied’s customers are now able to increase productivity and achieve greater accuracy by easily downloading descriptive, usage and geometric information directly into their shop floor software, such as CAM, simulation, and tool management systems.

About Allied Machine & Engineering Corp.

Allied Machine & Engineering Corp is a manufacturer of holemaking and finishing tooling systems. Allied devotes its advanced engineering and manufacturing capabilities to create the widest selection of value-added tooling available to metal-cutting industries around the world. Their tooling solutions deliver the lowest cost-per-hole in a wide range of drilling, boring, reaming, threading, and burnishing applications.

Located in Dover, Ohio, Allied’s precision holemaking technologies provide end users worldwide with the highest level of drill performance. Precision engineering and expert application support make Allied the first and best choice for solving complex metal-cutting challenges.

For more information, visit www.alliedmachine.com.

About MachiningCloud 

MachiningCloud is dedicated to leading a digital shift within the discrete manufacturing industry to deliver a new level of operational efficiency. Cloud-based applications, resources, services, knowledge, and digital product data from the world’s leading manufacturers of cutting tools, machine tools, workholding and specialty products are providing efficiency improvements by facilitating the flow of data to and from today’s data-intensive shop-floor.

For cutting tool manufacturers and their customers, the MachiningCloud app is an Industry 4.0 solution delivering up-to-date cutting tool manufacturers’ product knowledge and data, fast-tracking cutting tool selection, CNC programming, simulation and shop floor operations. By providing data from the world’s leading suppliers, MachiningCloud eliminates the hassles of searching through printed catalogs, telephone calls and multiple websites to find optimal tooling, while also removing the burden of manually typing tooling data into CAD/CAM software.

For more information about MachiningCloud, Smart Manufacturing and Industry 4.0 solutions, please visit www.machiningcloud.com.

Bimba Announces Collaborative Robot Vacuum Tool

Bimba announced the launch of the Collaborative Robot Vacuum Tool (CRVT). This device offers a plug-and-play end effector option for collaborative robots.

Developed to meet the versatile nature of collaborative robots, Bimba’s CRVT comes off-the-shelf as a solution with no external valve required. Although designed to support a variety of applications with minimal configuration, Bimba offers an array of pump options to enable users to meet the vacuum requirements of their application.

As part of Universal Robots’ UR+ program, the CRVT is tested and approved to integrate directly with UR robots, ensuring set-up, programming, and operation can all be accomplished. Compatibility with additional robotics manufacturers will be available in the future.

The CRVT comes standard with venturi vacuum pump, valve, vacuum switch, muffler and cups integrated in an end effector.

For more information, visit Bimba website.

ams Announces CMV50000 CMOS Image Sensor

ams, a supplier of sensor solutions, announced its CMV50000, a 48Mpixel global shutter CMOS image sensor for demanding machine vision applications, has gone into mass production.

The CMV50000 features a 35mm-format 7920 x 6004 array of 4.6µm-sized pixels based on a eight-transistor pixel architecture. It operates at 30 frames/s with 12-bit pixel depth at full resolution or a binned 4K and 8K modes, and even faster – up to 60 frames/s – with pixel sub-sampling at 4K resolution.

The CMV50000 is designed to provide the detailed views of a large surface area that are required in factory automation applications such as automated optical inspection (AOI) equipment and systems for the inspection of displays of mobile phones, tablets, laptops and TVs.

The ams pixel architecture offers electronic shutter efficiency, and the global shutter operation produces images of fast-moving objects. The sensor offers 64dB optical dynamic range at full resolution and up to 68dB in binned 4K mode. The image sensor implements on-chip noise-reduction circuitry such as black-level clamping, enabling it to capture images in low-light conditions.

Both the monochrome and color versions of the CMV50000 are available in production volumes now.

For more information, visit ams website.

Canon Launches Océ Touchstone Dimensional Printing Software

MELVILLE, NY, June 21, 2018 – Realizing the appeal that dimensional printing can have in the graphics market, Canon USA, Inc. a leader in digital imaging solutions, announced the launch of Océ Touchstone dimensional printing software, positioned for large format print solutions to streamline dimensional printing on the company’s industry-leading Océ Arizona Series UV flatbed printers. Until now, creating these dimensional prints tended to be a laborious process involving significant file manipulation and iterative testing performed by the print provider. As a result, few end users are aware that this is even possible, let alone request this type of printing. To simplify this labor-intensive workflow, Canon has tailored specific solutions to meet the needs of the two parties involved in the process: the designer who creates the files and the print provider that prints them.

Utilizing the highly accurate ink drop placement and repetition provided by Océ Arizona UV curable flatbed printers, resourceful print providers have been able to print multiple layers of ink and produce dimensional effects ranging from common textures such as woodgrain to special effects such as varnish highlights, embossed type and logos, or even braille.

“Our commitment to our customers and the drive to expand our large format capabilities, has led to the development of the Océ Touchstone Dimensional Printing Software,” said Toyotsugu Kuwamura, executive vice president and general manager, Business Imaging Solutions Group, Canon USA, Inc. “We are thrilled to introduce this simple solution that will help print providers improve their workflow and create new possibilities for both their organizations and their customers.”

Through Canon-created Adobe CC Photoshop and Illustrator extensions, graphic designers can build the dimensional effects quickly and easily, preview and refine these effects on screen, and then export the file as a single PDF file that can be sent to an Océ Touchstone enabled print provider for final print production.

To help streamline the process on the print production side, Canon worked closely with graphics RIP provider ONYX, a Canon group company, to marry the patented Océ ALPS (Advanced Layer Printing System) technology with a special ONYX Thrive printer driver so that the RIP could now interpret the height map contained within the PDF, convert that data into separate print layers and send it to the Océ Arizona printer as a single batch file containing all the layers in the correct print sequence. This provides the print provider with a familiar print workflow where they can print the entire job essentially with one push of the print button. Carriage height adjustment is automated and the multiple layers can be left to print unattended, thus enabling print providers to make additional revenue after business hours.


The commercially licensed Océ Touchstone software is offered exclusively by Canon Solutions America and available now. The software requires ONYX Thrive 12.2 or a newer edition and an Océ Arizona 1260, 1280, or 2200 series printer to use. The Adobe CC Océ Extensions are available for both Microsoft Windows and Mac OS operating systems.

For more information, please visit www.usa.canon.com.

About Canon U.S.A., Inc.

Canon USA, Inc., is a leading provider of consumer, business-to-business, and industrial digital imaging solutions to the United States and to Latin America and the Caribbean markets. With approximately $36 billion in global revenue, its parent company, Canon Inc., ranks third overall in US patents granted in 2017† and is one of Fortune Magazine’s World’s Most Admired Companies in 2018. Canon USA is committed to the highest level of customer satisfaction and loyalty, providing 100 percent US-based service and support for all of the products it distributes in the United States. Canon USA is dedicated to its Kyosei philosophy of social and environmental responsibility. In 2014, the Canon Americas Headquarters secured LEED Gold certification, a recognition for the design, construction, operations and maintenance of high-performance green buildings.

For more information, visit www.usa.canon.com.