Announces $3M in Seed Funding
CUPERTINO, CA, Mar 1, 2018 – Emerging from stealth today, OnScale announces $3 million in strategic seed funding and unveils the industry’s first Solver-as-a-Service platform that gives engineers the power to accelerate innovation in the $40 billion 5G, Biomedical, Internet of Things (IoT), and Driverless Car markets.
OnScale was co-founded by CEO Ian Campbell, VP of Product Development Dr. Robbie Banks, and VP of Engineering Dr. Gerry Harvey as a spin-off company from Thornton Tomasetti. Thornton Tomasetti, a global leader in science and engineering consulting services, led the seed round with participation from Silicon Valley investors like Michael Lehman, former CFO of Arista Networks, Palo Alto Networks, and Sun Microsystems, and CampbellKlein, an early stage high-tech venture fund.
Introducing the OnScale Solver-as-a-Service Platform
OnScale has built the world’s first Solver-as-a-Service platform with advanced computer-aided engineering (CAE) multi-physics solvers that are seamlessly integrated with a scalable Cloud High Performance Computing (HPC) platform. OnScale’s solvers have been carefully architected and maintained by the same expert team over decades. Combined with the limitless HPC resources available on the cloud, OnScale’s platform breaks cost and performance barriers for engineers solving tomorrow’s toughest engineering challenges.
“The CAE/HPC space is ripe for disruption because yesterday’s systems are too expensive and cumbersome to solve tomorrow’sengineering problems,” said Ian Campbell, CEO, OnScale. “Our platform eliminates the risk associated with sequential trial-and-error physical prototyping, reduces design cycles from months to weeks or even days, and delivers unequaled computing performance that easily scales to meet ever-changing CAE workloads.”
OnScale is initially targeting underserved market verticals, worth $4 billion, with heavy demand for advanced CAE and HPC. OnScale will initially focus on the following market segments:
- 5G – RF Filters and RF switches for 5G smartphones and base stations.
- Internet of Things (IoT) and Industrial Internet of Things (IIoT) – Microphone arrays for Alexa-style IoT devices, motion and gesture sensors, biometric and fingerprint sensors and industrial sensor systems.
- BioMed – Advanced therapies, targeted treatment planning and consumer ultrasound.
- Driverless Car Systems – Driverless car sensing technologies like 3D ultrasound for object classification, driver and passenger monitoring.
OnScale’s platform gives individual engineers, boutique engineering design teams, and multinational engineering firms cost effective computational power, agility, and scalability through a flexible Software-as-a-Service (SaaS) pay-as-you-go subscription model. Engineers using OnScale no longer have to worry about buying expensive new CAE software licenses, paying for maintenance and support, procuring expensive HPC hardware, or waiting for IT to deploy and maintain CAE systems.
OnScale has partnered with Amazon Web Services (AWS). A trusted name in cloud, AWS provides best-in-class cloud HPC hardware, security, and availability.
The OnScale Solver-as-a-Service will be commercially available in Q2 2018.
Tom Scarangello, CEO and chairman of Thornton Tomasetti, comments: “OnScale will help engineers deliver on the promise of future technologies like 5G and IoT that we’re all waiting for. Initiatives like 5G can only succeed through rapid innovation, and innovation happens only when engineers are unconstrained. OnScale has huge market potential because it makes world-class CAE solvers with unlimited Cloud HPC resources available to every engineer.”
Michael Palma, research director, Enabling Technologies and Semiconductors, IDC, says: “Engineers continue to design and build technology that will underpin the future of IoT, however design costs and the length of design cycles can hinder innovation in autonomous vehicles, biomedical devices and 5G. One possible solution to these design challenges is combining CAE and cloud based high performance computing (HPC).”
Mo Zarkan, USM development engineering manager, Emerson Automation Solutions, comments: “Our engineering design cycles come in bursts throughout the year. OnScale’s SaaS model helps us to best utilize our R&D expenses as demand for CAE and HPC fluctuates.”
Dr. Michael Weaver, CEO & founder, Cenofex Innovations, says: “OnScale’s SaaS pricing model gives us access to CAE and HPC resources that would traditionally only be available to large companies with massive R&D budgets. OnScale gives our startup a competitive edge against giants in our industry.”
OnScale Board Members
- Ian Campbell, CEO of OnScale
- Tom Scarangello, CEO of Thornton Tomasetti
- Ray Daddazio, President of Thornton Tomasetti
- Grant McCullagh, Board Member of Thornton Tomasetti
- K.P. Reddy, Venture-backed entrepreneur
OnScale, the global leader in CAE and Cloud HPC, empowers engineers to accelerate innovation for next-generation products such as 5G smartphones, internet of things (IoT) and biomedical devices, and driverless car products. The company emerged from stealth in 2018 with $3 million in Seed funding to deploy the first and only Solver-as-a-Service platform. The OnScale Solver-as-a-Service Platform combines sophisticated CAE multiphysics solvers with the limitless power of cloud high performance computing (HPC) to remove performance and cost constraints of legacy CAE/HPC, reduce design cycles from months to weeks or even days, and deliver unequaled solver performance that easily scales to meet ever-changing CAE workloads. The OnScale leadership team includes successful entrepreneurs and award-winning experts in MEMS, semiconductors, CAE, Cloud HPC, biomedical and 5G RF technologies.
For More Information, visit http://onscale.com/.