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Improve Your Thermal Management Strategy for Electronic Components During the Design Phase

March 16, 2017 @ 9:00 am - 9:30 am

How to use Flow Simulation’s Electronic cooling module to accurately model materials and simulate electronic packages.

Details

Date:
March 16, 2017
Time:
9:00 am - 9:30 am
Event Category:
Website:
https://attendee.gotowebinar.com/register/6584432359995655427

Organizer

CADimensions, Inc.
Phone
+1 315-434-9787
View Organizer Website

Venue

Online

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