^{to Accelerate Secure ASIC, IP Projects for Edge Devices}

CHESEAUX-SUR-LAUSANNE, Switzerland, PHOENIX, AZ and Grenoble, France, Mar 25, 2024 – Kudelski IoT, a division of the Kudelski Group, a global leader in digital security and IoT solutions, together with DOLPHIN DESIGN, announce a collaboration aiming to simplify the development of highly secure ASIC and IP solutions for Edge devices, addressing the significant challenges of securing artificial intelligence (AI) at the Edge. Traditional microcontroller unit (MCU) designs are inadequate for the advanced data processing and security demands of AI models. The partnership introduces a paradigm shift in MCU design, essential for smart devices to improve performance by 1,000 times without increasing energy consumption.

DOLPHIN DESIGN’s CHAMELEON platform, a versatile and pre-verified event-based MCU subsystem, now integrates Kudelski IoT’s Secure Enclave IP (KSE3). This integration offers a robust security layer, ensuring secure boot, firmware updates, identity management, and data protection. Additionally, the collaboration extends to Kudelski IoT’s KeySTREAM platform, providing a scalable “PKI as a Service” for secure lifecycle management of certificates and devices via a cloud-based application.

This comprehensive solution enables customer designs to achieve SESIP L3 certification, catering to the automotive, industrial, and medical industries’ stringent security requirements. Kudelski IoT offers extensive support, including threat assessment, design consulting, and security reviews, making it a comprehensive security partner to these industries.

“We have a very successful history of collaboration with DOLPHIN DESIGN and are delighted to now announce the pre-integration of our respective IP and solutions to cover all of the security requirements now being requested in our important target markets” said Hardy Schmidbauer, SVP of Kudelski IoT. “The combined solution provides robust end-to-end security in Edge designs by relying on a separated security enclave and the Kudelski IoT KeySTREAM platform to protect the customer ASICs and designs while making it very simple to provision these on the production line and manage their security lifecycle.”‍

“Security is an integral part of ensuring new designs comply with regulations such as ISO21434 and IEC62443 in the automotive and industrial sectors,” said Hakim Jaafar, VP of marketing and application lab at DOLPHIN DESIGN. “By collaborating with Kudelski IoT, we provide a one-stop shop for manufacturers to meet these requirements and achieve compliance in an accelerated timeframe by using our combined solutions and services.”‍

Kudelski Group companies have worked with device manufacturers to enable and protect their devices and associated services for more than 30 years. Kudelski is a pioneer in pay media and has been protecting digital cable, satellite, terrestrial set-top boxes, and streaming services since their inception, providing a wide range of security technologies and services with a strong focus on device security and certification. The company has provided certificates, keys, and credentials to more than over 500 million devices.‍

About Kudelski IoT

Kudelski IoT is the Internet of Things division of Kudelski Group and provides end-to-end IoT solutions, IoT product design, and full-lifecycle services to IoT device manufacturers, ecosystem creators, and end-user companies. These solutions and services leverage the group’s 30+ years of innovation in digital business model creation; hardware, software and ecosystem design and testing; state-of-the-art security lifecycle management technologies and services and managed operation of complex systems.

For more information about Kudelski IOT, please visit www.kudelski-iot.com.

About Kudelski Group

The Kudelski Group is a world leader in digital business enablement technologies that encompass digital content security, public access, cybersecurity, and IoT.

NAGRA provides end-to-end convergent media solutions to the digital entertainment industry including services and applications requiring access control and rights management to secure the revenue in digital television, internet, mobile and interactive applications.

SKIDATA is the world market leader in public access and visitor management with over 10,000 installations in over 100 countries, providing fast and safe access for people and vehicles.

Kudelski Security is an innovative, independent provider of tailored cybersecurity solutions to help enterprises and public sector institutions assess risks and vulnerabilities and protect their data and systems.

Kudelski IoT provides end-to-end solutions, IoT product design, and full-lifecycle services to IoT device manufacturers, ecosystem creators and end-user companies.

The Kudelski Group is headquartered in Cheseaux-sur-Lausanne, Switzerland and Phoenix (AZ), USA with offices in 32 countries around the world. For more information, please visit www.nagra.com.

TOKYO, Japan, Mar 25, 2023 – Renesas Electronics Corp., a premier supplier of advanced semiconductor solutions, introduced the RA2A2 microcontroller (MCU) Group based on the Arm Cortex-M23 processor. The new, low-power devices offer a 24-bit Sigma-Delta analog-to-digital converter (SDADC), and an innovative dual-bank code flash and bank swap function that make it easy to implement firmware over-the-air (FOTA) updates for smart energy management, building automation, medical devices, consumer electronics and other IoT applications that can benefit from firmware updates.

The RA2A2 devices offer multiple power structures and voltage detection hardware to realize energy-efficient, ultra-low power operation as low as 100 µA/MHz in active mode and 0.40µA in software standby mode. An independent power supply real-time clock extends battery life for applications requiring long lifetime management in extreme conditions. The new MCUs also offer AES hardware acceleration, a high-precision (±1.0%), high-speed on-chip oscillator, a temperature sensor, and a wide operating voltage range from 1.6V to 5.5V.

Feature Set Optimized for Smart Energy Management

RA2A2 MCUs contribute to the digitalization of conventional systems with key features including high-level analog sensing, FOTA support, 8KHz/4KHz hybrid sampling, and AES hardware accelerator functions. When the end-systems are digitalized, it is possible to analyze individual systems status seamlessly for further energy-efficient, streamlining system operation. For example, next generation smart electricity meters with Non-Intrusive Load Management (NILM) technology enable energy consumption monitoring based on detailed analysis of the current and voltage of the total load. The adoption of smart meters with NILM is the most cost-effective and scalable solution for increasing energy efficiency and lowering energy consumption.

“Renesas has worked closely with our customers to understand their requirements for next-generation systems that can support critical energy conservation goals,” said Akihiro Kuroda, vice president of the Embedded Processing 2nd Division at Renesas. “The RA2A2 Group MCUs are the result of that collaboration coupled with our world-leading technical expertise. We are proud to provide this solution that will enable significant energy savings in a wide array of systems.”

Key Features of the RA2A2 Group MCUs

• Core: 48MHz Arm Cortex-M23
• Memory: 512KB integrated, dual-bank Flash memory and 48KB SRAM
• Analog Peripherals: 24-bit Sigma Delta ADC with digital filter, 12-bit ADC, and temperature sensor.
• Packages: 100-, 80- and 64-pin LFQFP

The new RA2A2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA2A2 designs to larger RA devices if customers wish to do so.

Winning Combinations

Renesas has combined the new RA2A2 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including the 3-Phase Smart Electric Meter. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

Availability

The RA2A2 Group MCUs are available now, along with the FSP software and the RA2A2 Evaluation Kit. Samples and kits can be ordered either on the Renesas website or through distributors. More information on the new MCUs is available at renesas.com/RA2A2.

Renesas MCU Leadership

The world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.

About Renesas Electronics Corp.

Renesas Electronics Corp. empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines their expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.

Learn more at renesas.com.

NOVI, MI, Mar 15, 2024 – Stoneridge, Inc. announced the appointment of Troy Cooprider to the position of chief technology officer. Cooprider will set the company’s strategic technology and product roadmaps and support future innovation and growth through oversight of the global engineering function.

Troy Cooprider

“We have a clear strategy for the future, and with Troy’s proven track record in bringing advanced technologies to market, we will continue to redefine the standards of safe and efficient mobility,” said Jim Zizelman, president and CEO, Stoneridge. Cooprider brings more than 30 years of industry experience in automotive electronics to Stoneridge. Most recently, he was vice president of global technology at Stoneridge, responsible for leading product innovation, advanced engineering, and technology strategy. He joined Stoneridge in 2020 as vice president of advanced engineering and engineering excellence to lead the development and execution of its next-generation electronics systems.  Before that, he served as executive director of engineering at Aptiv, where he had oversight for global product development and launch activities for a broad range of electronics and safety products.

Cooprider earned a bachelor’s degree in electrical and electronics engineering from Rose-Hulman Institute of Technology. Stoneridge has filed more than 30 patent applications with Cooprider listed as an inventor.

About Stoneridge, Inc.

Stoneridge, Inc., headquartered in Novi, MI, is a global designer and manufacturer of highly engineered electrical and electronic systems, components, and modules for the automotive, commercial, off-highway and agricultural vehicle.

SAN JOSE, CA, Mar 14, 2024 – Cadence Design Systems, Inc. announced a collaboration with Arm to deliver a chiplet-based reference design and software development platform to accelerate software-defined vehicle (SDV) innovation. The automotive reference design, initially for advanced driver assistance system (ADAS) applications, specifies a scalable chiplet architecture and interface interoperability to foster industry-wide collaboration, enable heterogeneous integration and expand system innovation.

The solution is architected and built using the latest generation of Arm Automotive Enhanced technologies and Cadence IP. The complementary software stack development platform is provided as a digital twin of the hardware that is compliant with the Scalable Open Architecture for Embedded Edge (SOAFEE) initiative software standard, enabling software development to begin before hardware is available and allowing subsequent system integration validation. The combined solution speeds both hardware and software development, accelerating time-to-market.

The growing prevalence of ADAS and SDVs is driving the need for more complex AI and software capabilities, as well as greater levels of interoperability and collaboration in the automotive electronics ecosystem. Coupled with the need to quickly customize 3D-IC systems for a plethora of automotive applications, chiplets are an increasingly attractive solution. However, it’s crucial that chiplets from different IP providers work together seamlessly. In addition, the rapid pace of automotive development necessitates that 3D-IC system developers have a software development platform to shift left in the process flow while the IP and chiplets are still being designed.

The new solution architecture and reference design provide a standard for chiplet interface interoperability, addressing a critical industry need. The Cadence components of the solution include:

• Helium Virtual and Hybrid Studio for the rapid creation of virtual and hybrid platforms and Helium Software Digital Twin to support deployment at scale for software developers
• I/O IP solutions for industry-leading interface and memory protocols, including Universal Chiplet Interconnect Express (UCIe) for high-speed chiplet-to-chiplet communication
• Comprehensive compute IP portfolio including advanced AI solution, the Neo neural processing unit (NPU) IP, the NeuroWeave software development kit (SDK) for machine learning (ML) solutions, and world-class DSP compute solutions

“The automotive industry is evolving rapidly and AI and software advancements are emphasizing a greater need to speed up development cycles,” said Dipti Vachani, senior vice president and general manager, Automotive Line of Business, Arm. “Together with critical ecosystem partners like Cadence, we’re enabling faster software and hardware development by bringing together a complete solution of design and verification technologies underpinned by the latest Automotive Enhanced technologies from Arm, allowing developers to start building for next-generation SDVs well before silicon is available in the market.”

“Reducing the overall system design workload and shifting hardware and software development left are both crucial to meet shrinking time-to-market windows when developing today’s increasingly complex SDVs. Virtual platforms and chiplets are both key enablers for automotive 3D-IC SoC developers,” said Paul Cunningham, senior vice president and general manager of the System Verification Group at Cadence. “Working closely with Arm, we are addressing key inefficiencies in both software and hardware development and verification processes, while catalyzing the multi-die chiplet ecosystem for automotive semiconductors.”

The virtual platform and component IP for the reference platform are available now for early adopters.

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For.

Learn more at cadence.com.

VERNON HILLS, IL, Mar 14, 2024 – Mitsubishi Electric Corp. announced that it has signed an agreement with Dispel LLC, a developer and distributor of secure remote access and operational management solutions, to expand its operational technology (OT) security business through marketing and technical development.

Based on the agreement, Mitsubishi Electric will integrate its factory automation (FA) equipment and OT security solutions with Dispel’s secure remote-access technology to provide a Zero Trust Remote Access Service that monitors, controls, and verifies remote-access operations involving equipment in manufacturing facilities. For Mitsubishi Electric, the goal is to accelerate digital manufacturing by utilizing data throughout entire product lifecycles, from design and installation to operation and maintenance, and thereby strengthen the company’s circular digital engineering business.

Mitsubishi Electric, a leading supplier of FA control-system equipment, provides complete one-stop OT security solutions that incorporate services ranging from assessment and consulting to countermeasures and operations. The company is dedicated to ensuring network security and reliable communication management by controlling access to OT assets and implementing traceability measures.

Dispel is a U.S. security vendor that provides secure remote-access services to critical facilities, including power and water utilities, financial companies and research institutions, primarily in North America. Dispel has technologies for access control and traceability through logging and recording based on “when, who, and where,” enabling more detailed and secure management compared to traditional VPN solutions. The company adheres to worldwide security standards, such as NIST CSF* and IEC 62443**, in its provision of remote access environments on a global scale.

“At Mitsubishi Electric, we are creating new value in OT security by combining our OT technology and expertise in manufacturing with information-system security technologies from leading security vendors,” said Kunihiko Kaga, Mitsubishi Electric’s representative executive officer and industry and mobility business area owner.

“Through our collaboration with Dispel, we expect to contribute to OT security and society as a whole by providing secure environments for remote maintenance.”

“What matters to industrial customers is uptime, availability, and crew safety,” said Mr. Ian Schmertzler, president of Dispel. “Cyber security should not be something they need to worry about, but the shifting regulatory and threat landscape has made it impossible to ignore. By providing a Zero Trust Access platform aligned with NIST 800-53 to their customer base, Mitsubishi Electric is making it possible for their clients to refocus on what matters.”

Remote maintenance, which involves utilizing internet technology to monitor and troubleshoot production lines from remote locations, is attracting increasing interest due to manufacturing’s globalization as well as its implementation of IoT and digital transformation. However, accessing factory systems via the Internet has increased security risks, such as cyberattacks targeting communication pathways, which is inhibiting the adoption of remote maintenance. In addition, large manufacturing sites typically use equipment from multiple equipment vendors, which requires a dedicated communication path for each vendor’s equipment, resulting in multiple communication paths being exposed to security risks.

For more information about the Dispel, please visit https://dispel.com/.

^{* A cyber security framework (CSF) for critical infrastructure, issued by NIST (National Institute of Standards and Technology)
** Generic control system security standards issued by IEC (International Electrotechnical Commission)
Originally (initially) released in Japanese and English}

For more information about Dispel LLC, visit https://dispel.com/.

About Mitsubishi Electric Automation, Inc.

Headquartered in Vernon Hills, IL, Mitsubishi Electric Automation, Inc. is a US affiliate company of Mitsubishi Electric Corporation. It offers a broad product portfolio including programmable automation controllers (PAC), programmable logic controllers (PLC), human machine interfaces (HMI), variable frequency drives (VFD), servo amplifiers and motors, control software, computerized numerical controllers (CNC), motion controllers, robots and low-voltage power distribution products.

Additional information about Mitsubishi Electric Automation is available at us.mitsubishielectric.com/fa/en/.

About Mitsubishi Electric Corp.

With more than 100 years of experience in providing reliable, high-quality products, Mitsubishi Electric Corp. is a recognized world leader in the manufacture, marketing, and sales of electrical and electronic equipment used in information processing and communications, space development and satellite communications, consumer electronics, industrial technology, energy, transportation, and building equipment. Mitsubishi Electric enriches society with technology in the spirit of its “Changes for the Better.” The company recorded a revenue of 5,003.6 billion yen (U.S.$ 37.3 billion*) in the fiscal year ended March 31, 2023.

For more information, please visit www.MitsubishiElectric.com.

^{*U.S. dollar amounts are translated from yen at the rate of \134=U.S.$1, the approximate rate on the Tokyo Foreign Exchange Market on March 31, 2023}

Singapore, Mar 11, 2024 – ENNOVI, a mobility electrification solutions partner, announces the launch of ENNOVI-CellConnect-Prism, a groundbreaking prismatic battery cell contacting system designed to redefine the connectivity and efficiency of battery modules.

ENNOVI-CellConnect-Prism empowers engineers with unparalleled flexibility, enabling the seamless integration of individual prismatic cells to create larger battery modules or advanced cell-to-pack (CTP) and cell-to-chassis (CTC) configurations. By streamlining the assembly process and eliminating inefficiencies, ENNOVI-CellConnect-Prism accelerates battery pack production while optimizing material usage and reducing costs.

Randy Tan, product portfolio director for Battery Platform Development Solutions, ENNOVI, explains, “Traditionally, prismatic cell contacting systems have relied on current collector assembly (CCA) technologies, which often suffer from inherent inefficiencies. These systems entail complex processes, including laminating and assembling carriers with low-voltage data collection circuits, current collectors, and terminal busbars. However, ENNOVI-CellConnect-Prism revolutionizes this approach by introducing innovative features that enhance performance and sustainability.”

One of the key innovations of ENNOVI-CellConnect-Prism is the adoption of a die-cut circuit (FDC) as an alternative to the conventional flexible printed circuit (FPC). This reel-to-reel process reduces production time and costs while minimizing environmental impact. Additionally, the use of automotive-grade PET material and hot-bar soldering ensures optimal thermal resistance and component attachment without compromising integrity.

Furthermore, ENNOVI-CellConnect-Prism eliminates the need for traditional insulation methods by integrating voltage and temperature sensing directly into the assembly. This approach optimizes material usage and production efficiency while maintaining the highest standards of reliability and safety.

ENNOVI’s patent-pending ENNOVI-CellConnect system represents a paradigm shift in battery interconnect technology, empowering OEMs and gigafactories to scale production and meet the growing demand for electrified mobility solutions. Compatible with prismatic, cylindrical, and pouch cell formats, this versatile platform offers unique customization options for diverse applications.

For more information on the new ENNOVI-CellConnect-Prism, please visit https://ennovi.com/cell-contacting-system-prismatic/.

About ENNOVI

ENNOVI, a Mobility Electrification Solutions Partner, is a world leader in designing and manufacturing customized interconnect and high-precision system solutions for electric vehicles. The company is fully dedicated to the mobility market with the agility to act at speed in realizing EV OEMs’ needs, from product, process, and manufacturing, on a global level. ENNOVI is accelerating EV market customers’ ideas and requirements through end-to-end competencies in battery platform, power and signal interconnect needs. Headquartered in Singapore, ENNOVI has more than 10,000 employees across 15 sites globally, where all its activities are socially responsible, with minimal environmental impact.

Learn more at www.ennovi.com.

BARCELONA, Spain, Mar 7, 2024 – Semidynamics, the European RISC-V custom core specialist, has released its new tool called ‘Configurator’ that puts the power of Semidynamics’ full customization of a RISC-V processor core in the hands of the customer. It uses dozens of blocks that have already been verified by Semidynamics so that the final core is therefore also verified. This gives customers an incredible fast time to a workable core design in a matter of a few hours from the thousands of possible variants.

Semidynamics’ unique ‘Open Core Surgery’ allows the customer to tailor the Semidynamics IP to their needs, including adding new instructions, new interfaces and the customer’s ‘secret sauce’ deep inside. This process entails two steps. First step is to configure the base parameters of the architecture, which is what Configurator enables. The second step is to describe the special features required by the customer; the Semidynamics engineering team will take those requests and implement them according to the customer’s requirements. The newly released Configurator helps in both steps. First, it provides an easy way for the customer to specify the configuration parameters for the IP. Second, it allows the customer to describe the additional changes, beyond configuration, required.

Roger Espasa, Semidynamics’ CEO, explained, “We are the only company offering fully customizable RISC-V IP cores so there are many choices to be made by customers when specifying their requirements. Our new Configurator tool makes this process extremely easy for the customer to do on their own computer screen. The tool has a sequential set of options that logically works through the thousands of possible variants. As each one option is selected, the resulting core configuration is immediately displayed on the screen so that the customer can see how the layout of blocks builds. The customer can go back and change any of the options to see the effect on the core layout. Naturally, we are available to help and advise customers in the choices to ensure the best possible core design for their application.

“When the customer has finalized the design, it is sent to us for a PPA and licensing quote. Once this is agreed and the contract signed, the RTL is sent to them immediately and as it is already verified by us they don’t have that time consuming stage to do. The whole aim of Configurator is to empower the customer with an easy-to-use way to have the exact custom core that they need in the shortest possible time so that they are fastest to market with their innovative product.”

Some of the choices offered by the Configurator tool include instruction and data cache sizes, main memory bus size and type, and eight optional extensions. Additional options include Semidynamics’ state-of-the-art Tensor and RISC-V 1.0 compliant Vector Units with a choice of number of cores and data configuration. On top of these, Gazzillion technology that ensures constant data flow from memory.

The Semidynamics Configurator tool is web-based so it can be run on the customer’s own computer system once they have registered which can be done at www.semidynamics.com/configurator.

About Semidynamics

Founded in Barcelona on 2016, Semidynamics is a European supplier of RISC-V IP cores, specialising in high-bandwidth high-performance cores with vector units targeted at machine learning and artificial intelligence applications.

Proud participant in the European Processor Initiative (EPI).

For more information, visit website.

^{with Qt Group Graphics}

MUNICH, Germany, Mar 7, 2024 – In the highly competitive global semiconductor market, manufacturers are constantly striving for shorter time-to-market. At the same time, the demand for fluid and high-resolution graphical displays is increasing. To address these market demands, Infineon Technologies AG announces its strategic collaboration with Qt Group, a global software company providing cross-platform solutions for the entire software development lifecycle. This collaboration brings Qt’s lightweight, high-performance graphics framework to Infineon’s graphics-enabled TRAVEO T2G cluster microcontrollers and represents a paradigm shift in graphical user interface (GUI) development.

TRAVEO T2G cluster

Microcontrollers nowadays offer extensive graphical capabilities that enable compact designs, cost-efficiency, and lower power consumption. With features such as instant boot-up, small footprint and efficient real-time processing, they are widely used in various sectors, including automotive instrument clusters, two-wheelers, construction machinery, industrial and medical applications. Infineon’s TRAVEO T2G MCUs are designed to meet the requirements of these applications, especially the TRAVEO T2G cluster family. This device family provides graphical user interfaces with high refresh rates and up to full HD resolution. By integrating the Qt graphics solution directly into these MCUs, Infineon further optimizes these devices and enables intelligent rendering technology with benefits such as:

• Up to 5x more efficient memory usage compared to the market average.
• Up to 2x faster boot time compared to average boot times in the market.
• Up to 50 percent shorter time to market, from design to production.

“Whether in the automotive industry, healthcare or industrial automation, responsive user interfaces with high-quality graphics are essential,” said Toni Paila, director, Qt for MCUs at Qt Group. “However, the MCUs used for these applications typically lack integrated advanced design and development tools especially for modern user interfaces. We are therefore proud to support Infineon in bridging this gap and enabling device manufacturers to deliver outstanding user interfaces with low memory footprints on their MCUs. This will allow designers to create GUIs that were previously considered impossible due to resource constraints.”

“Qt’s efficient design and development workflow, coupled with over 30 years of production experience in various industries, has accelerated our UI application development,” said Ralf Ködel, Vice President Microcontrollers at Infineon. “By extending this efficiency to our microcontrollers, our customers can significantly shorten the time to market – from product design to production.”

A live demonstration of Qt for MCUs on Infineon`s TRAVEO T2G will be showcased at Qt`s booth at Embedded World 2024 in Nuremberg from April 9 to 11 in Hall 4, Stand 4-258.

Availability

The TRAVEO T2G cluster microcontroller products featuring Qt’s advanced graphical libraries are now available. Further information is available at www.infineon.com/traveocluster.

About Qt Group

Qt Group is a global software company, trusted by industry leaders and over 1.5 million developers worldwide to create applications and smart devices that users love. Their customers are in more than 70 different industries in over 180 countries. Qt Group employs some 800 people, and its net sales in 2023 were 180.7 MEUR.

To learn more, visit www.qt.io .

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September).

Further information is available at www.infineon.com.