Category Archives: Electronics

STMicroelectronics Joins Zigbee Alliance Board

DAVIS, CA, Jan 22, 2020 – The Zigbee Alliance, an organization of hundreds of companies creating, maintaining, and delivering open, global standards for the Internet of Things (IoT), today announced that STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has joined its Board of Directors. Along with other Zigbee Alliance promoter member companies, ST is set to play a vital role in the adoption and evolution of Zigbee, aiming to simplify development for manufacturers and increase device compatibility for consumers.

“In both the consumer and industrial markets, demand for reliable IoT connectivity is expanding fast and the trend towards wireless technologies is growing tremendously – whether in smart-home solutions, asset-tracking production tools, or building control,” said Hakim Jaafar, head of marketing for Wireless Microcontrollers at STMicroelectronics. “As a leading and trusted Arm Cortex-M supplier to both top OEMs and the mass market committed to propagating Zigbee technology in its 2.4GHz product roadmap, ST supports the mission of the Zigbee Alliance and joined the board to share our expertise and help continue the Alliance’s success.”

The inclusion of wireless technologies in ST’s microcontroller product portfolio delivers key benefits for greater flexibility in device architecture and faster transition for the mass market to add connectivity. With the evolution of the connectivity and IoT markets, the STM32 MCU/MPU products include strong integrated security mechanisms to guarantee IP and privacy protection.

ST’s membership at the Zigbee Alliance Board of Directors level aims to bring more visibility to the technology and accelerate new product developments with improved interoperability and cross-technology compatibility.

“STMicroelectronics plays an important role in powering next-generation IoT devices, and their leadership will be a great value-add at the board level and within working groups as we work diligently to create communication and connection standards that can be cast across continents,” said Tobin Richardson, president and CEO, Zigbee Alliance. “As we head into 2020, it’s extremely encouraging to see the impressive collection of global tech organizations like ST that are committed to cooperation and interested in taking a seat at the Alliance table.”

For more information about the Zigbee Alliance, its open IoT technologies, Project Connected Home over IP, or how to get involved to bring about good change for the industry, visit www.zigbeealliance.org.

About the Zigbee Alliance

The Zigbee Alliance is the foundation and future of the Internet of Things. Established in 2002, their wide-ranging global membership collaborates to create and evolve universal open standards for the products transforming the way they live, work, and play. With their members’ deep and diverse expertise, robust certification programs, and a full suite of open IoT solutions – including the recently announced Project Connected Home over IP – they are leading the movement toward a more intuitive, imaginative, and useful world. The Zigbee Alliance board of directors is comprised of executives from AmazonAppleComcastGoogleIKEAThe Kroger Co.LEEDARSONLegrandLutron ElectronicsMMB NetworksNXP SemiconductorsResideoSchneider ElectricSignify (formerly Philips Lighting), Silicon LabsSmartThingsSomfySTMicroelectronicsTexas Instruments, and Wulianwww.zigbeealliance.org, www.connectedhomeip.com.

About STMicroelectronics

STMicroelectronics is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life. ST’s products are found everywhere today, and together with their customers, they are enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and Internet of Things devices.

By getting more from technology to get more from life, ST stands for life.augmented.

In 2018, the Company’s net revenues were $9.66 billion, serving more than 100,000 customers worldwide. Further information can be found at www.st.com.

Radica Launches Electra Cloud

IPOH, Malaysia, Jan 17, 2020 – Radica Software Sdn. Bhd. announced the immediate availability of Electra Cloud, fully browser-based electrical CAD software that allows engineers to create, edit, and share 2D electrical, pneumatic and hydraulic schematic drawings with team members. Electra Cloud works on all computer operating systems including Microsoft Windows, Linux, and Apple Macintosh, as well as on any mobile devices such as smartphones. An easy-to-use software, Electra Cloud does not require extensive training, and furthermore, it helps engineers complete schematic drawings between 300% and 500% faster than traditional software currently available in the market. Electra Cloud is now available directly at https://cloud.radicasoftware.com.

An important advantage of Electra Cloud is that it allows users to collaborate on their drawings with team members located anywhere in the world in real-time, with just a browser and no additional software required.

Thomas Yip, CEO and founder of Radica Software said, “Software offerings in the electrical CAD industry have not seen much changes despite their long existence. So, we are thrilled to offer Electra Cloud, a breakthrough solution for engineers around the world. We’re saying this because Electra Cloud can be accessed from anywhere using a web browser and users no longer need to have a software installed on their computer to access electrical drawings like previously. This, sets Electra Cloud apart from ECAD products in the market.”

Team dashboard which is a key feature in Electra Cloud allows team members of the same project will always have access to the latest version of drawings, for teams to work effectively together. It enables easy sharing, commenting, chatting and collaborative editing.

In addition, Electra Cloud also comes with file version control feature that saves changes made in real-time automatically, allowing collaborators to revert to previous revisions without worrying about losing any previous work.

Electra Cloud contains all the necessary automated tooling including automatic tagging, circuit reuse, real time cross reference, extensive set of NFPA/JIC and IEC symbols, PLC modules, automatically generate bill of materials, terminals, panel layout and others.

“Electra Cloud makes design collaboration much simpler and easier. For instance, previously, recipients must have the same CAD software or a viewer to collaborate on a drawing, but that is not an issue anymore. With a click of a button, users of Electra Cloud can now share drawings with any authorized team members regardless of their location and they can edit, comment and chat about the designs using a web browser only,” Yip commented.

“It is a great concept, and it is great that you then have access from anywhere,” said Joseph Stieha (Electra Cloud Beta user), from PowerTech Water Inc, based in Lexington, Kentucky, USA.

Pricing: Electra Cloud is available for a free 30-day trial after which users can choose to downgrade to a Free Plan or continue to use Electra at USD99 per user per month, USD999 per user per year for Electra Standard (without hydraulic and pneumatic tools) and USD1499 per year for Electra Professional with hydraulic and pneumatic tools.

Radica Software also plans to release an offline version of Electra Cloud especially to those users who are concerned about privacy and would prefer to work entirely offline.

About Radica Software Sdn. Bhd.

Founded in 2005, Radica Software focuses on developing smart and fast electrical computer-aided design or ECAD software for electrical engineers. Electra helps improve productivity and work efficiency for engineers in the electrical, control and automation. In 2020, Radica Software launched world’s first fully browser-based electrical CAD software. Since its inception, Electra has been used by engineers from all around the world including in Australia, Canada, Japan, Malaysia, Norway, South Korea, and USA.

Radica Software is headquartered in Ipoh, Perak, Malaysia. Visit Radica Software’s website at www.radicasoftware.com.

EMA Launches CADSync with Native SOLIDWORKS Connector

ROCHESTER, NY, Jan 17, 2020 – EMA Design Automation, a full-service provider and innovator of electronic design automation (EDA) solutions, announced CADSync, providing a streamlined way to accurately pass high-fidelity design data and changes between Cadence PCB and SOLIDWORKS. “This patent pending technology provides native bidirectional collaboration and traceability,” said Manny Marcano, president and CEO of EMA. “Design teams can now work in concert for early communication and data sharing, enabling them to successfully launch mechatronic products on time and on budget.”

EMA CADSync

The current state of ECAD/MCAD ‘collaboration’ typically involves throwing large STEP files over the wall hoping each team can derive the data they need. This results in inaccuracy, miscommunication, delays, and even design re-spins. CADSync is the first and only native, bi-directional conduit between SOLIDWORKS and OrCAD/Allegro PCB Editor, providing a connection between ECAD and MCAD domains and eliminating the need for any middleware. PCB designers now have in-tool access to leverage native CAD data structures for maximum performance, efficiency, and accuracy, versus other solutions using common interchange formats.

CADSync includes a unique PCB toolkit for SOLIDWORKS which enables SOLIDWORKS teams to work on PCB features in their native design environment, while automatically capturing the data needed to properly specify changes and requirements in Cadence PCB. Since ECAD data is communicated to SOLIDWORKS using native solid parts, features, and assemblies, MCAD designers can also easily simulate and manipulate PCB elements in context of the mechanical assembly, which is not possible using traditional interchange format methods.

“Traditional ECAD/MCAD interface solutions either have a heavy server configuration that accompanies the product, or they have limitations in what information can be synchronized between the mechanical and electrical domain-CADSync has neither,” said Dan Fernsebner, PCB product marketing director, Cadence Design Systems, Inc. “It’s incredibly simple to deploy and easy to use, immediately empowering engineering cross-domain collaboration.”

“CADSync is a product truly driven by our customers’ needs to collaborate effectively and operate efficiently across the entire product development cycle,” added Marcano. “The EMA development team included both electrical and mechanical domain experts with over 20 years of experience in this space to ensure this product provided the best experience for both sides and delivered on the promise of a true, collaborative mechatronics design environment.”

CADSync is available worldwide exclusively through EMA. To get a free trial or for more information, visit go.ema-eda.com/cadsync.

About EMA Design Automation, Inc.

EMA Design Automation is a trailblazer in product development solutions offering a complete range of EDA tools, PLM integrations, services, training, and technical support.  EMA is a Cadence Channel Partner serving all of North America. EMA develops Ultra Librarian, TimingDesigner, CircuitSpace, CIP, EDABuilder, and a host of custom solutions to enhance the OrCAD products, and all are distributed through a worldwide network of value added resellers.  EMA is a privately held corporation headquartered in Rochester, NY.

Visit EMA at  www.ema-eda.com for more information.

TE Connectivity Releases OJT 10A Series Relays

HARRISBURG, PA, Jan 16, 2020 – TE Connectivity (TE), a world leader in connectivity and sensors, has designed a new 10A TV-8 rated OJT relay to meet market needs for high inrush capability, without sacrificing valuable PCB space. The need to embed more functionality into smaller spaces is becoming a requirement for engineers designing new applications. Their 10A TV-8 rated OJT power relays offer a compact and powerful design solution that can withstand up to a 117A inrush current in a 40% smaller size compared to similarly rated relays.

The 15.2mm (H) design is UL TV-8 rated to comply with global industry safety standards for high inrush applications. The UL TV-8 rating enables OJT 10A TV-8 relays to be used in devices that have a high inrush current when the switch is turned on, helping ensure safety and reliability.

Offered in 5 through 24 volt versions, OJT relays can be particularly useful in indoor lighting applications, smart plugs, appliances (washing machines, refrigeration and cooking), industrial machinery, motors, industrial controls, HVAC, printers and power supply controls.

Water Wang, product manager at TE Connectivity states, “The new OJT 10A power relay offers a high inrush capability in a compact size, making it an optimized design and cost solution for the market.”

About TE Connectivity

TE Connectivity is a $13 billion global industrial technology leader creating a safer, sustainable, productive, and connected future. Their broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With nearly 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 150 countries, TE ensures that every connection counts.

Learn more at www.te.com.

Siemens Partners with Arm

PLANO, TX, Jan 7, 2020 – Siemens Digital Industries Software announced a partnership with global semiconductor IP leader Arm, that will bring leading edge IP, methodologies, processes and tools together to help automakers, integrators and suppliers collaborate, design and bring to market their next-generation platforms much faster. This partnership was formed to address the increasingly complex challenges facing the industry in developing platforms to realize active-safety, advanced driver assistance, in-vehicle infotainment, digital cockpits, vehicle-to-vehicle/vehicle-to-infrastructure and self-driving vehicles. Key advances in computing and sensor technology are enabling companies to redefine mobility beginning with the integrated circuits and software within automotive electronics systems. The combination of Siemens’ and Arm’s innovative technologies can help automakers and suppliers deliver tomorrow’s electronic design and automotive solutions, today.

Siemens’ PAVE360 digital twin environment, featuring Arm IP, applies high-fidelity modeling techniques from sensors and ICs to vehicle dynamics and the environment within which a vehicle operates. Using Arm IP, including Arm Automotive Enhanced (AE) products with functional safety support, digital twin models can run entire software stacks providing early metrics of power and performance while operating in the context of a high-fidelity model of the vehicle and its environment, helping deliver a new future of mobility.

“Developing future transportation solutions requires collaboration across complex ecosystems,” said Dipti Vachani, senior vice president and general manager, Automotive and IoT Line of Business, Arm. “Arm technology has been deployed in applications across the whole vehicle for more than two decades, and our collaboration with Siemens redefines what is possible in terms of safety-capable, scalable heterogeneous compute. We see this as an important catalyst for the next wave of automotive semiconductor innovation.”

Using Siemens’ PAVE360 with Arm automotive IP, automakers and suppliers can simulate and verify sub-system and system on chip (SoC) designs, and better understand how they perform within a vehicle design from the silicon level up, long before the vehicle is built. Arm’s automotive IP is helping to democratize the ability to create safety-enabled silicon, bringing it within reach of the entire automotive supply chain. By rethinking IC design for the automotive industry, manufacturers can consolidate electronic control units (ECUs), leading to thousands of dollars in savings per vehicle by reducing the number of circuit boards and meters of wire within the vehicle design. This in turn reduces vehicle weight which can promote longer range electric vehicles.

“In all we do at Siemens, our goal is to provide transportation companies and suppliers the most comprehensive digital twin solutions, from the design and development of semiconductors, to advanced manufacturing and deployment of vehicles and services within cities,” said Tony Hemmelgarn, president and CEO at Siemens Digital Industries Software. “Siemens believes collaboration with Arm is a win for the entire industry. Carmakers, their suppliers, and IC design companies all can benefit from the collaboration, new methodologies and insight now sparking new innovations.”

Siemens‘ PAVE360 platform will be demonstrated in the Siemens Mobility booth at the Computer Electronics Show (CES) in Las Vegas, January 7 – 10, 2020.  This demonstration of industry-leading technology will showcase Arm’s automotive IP and technology from Siemens including Simcenter Prescan software, the Veloce hardware emulator, and Simcenter Amesim software.

About Siemens Digital Industries Software

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation.

For more information on Siemens Digital Industries Software products and services, visit www.sw.siemens.com.

About Siemens Digital Industries (DI) 

Siemens Digital Industries (DI) is an innovation leader in automation and digitalization. Closely collaborating with partners and customers, DI drives the digital transformation in the process and discrete industries. With its Digital Enterprise portfolio, DI provides companies of all sizes with an end-to-end set of products, solutions and services to integrate and digitalize the entire value chain. Optimized for the specific needs of each industry, DI’s unique portfolio supports customers to achieve greater productivity and flexibility. DI is constantly adding innovations to its portfolio to integrate cutting-edge future technologies. Siemens Digital Industries has its global headquarters in Nuremberg, Germany, and has around 76,000 employees internationally.

About Siemens AG

Siemens AG (Berlin and Munich) is a global technology powerhouse that has stood for engineering excellence, innovation, quality, reliability and internationality for more than 170 years. The company is active around the globe, focusing on the areas of power generation and distribution, intelligent infrastructure for buildings and distributed energy systems, and automation and digitalization in the process and manufacturing industries. Through the separately managed company Siemens Mobility, a leading supplier of smart mobility solutions for rail and road transport, Siemens is shaping the world market for passenger and freight services. Due to its majority stakes in the publicly listed companies Siemens Healthineers AG and Siemens Gamesa Renewable Energy, Siemens is also a world-leading supplier of medical technology and digital healthcare services as well as environmentally friendly solutions for onshore and offshore wind power generation. In fiscal 2019, which ended on September 30, 2019, Siemens generated revenue of €86.8 billion and net income of €5.6 billion. At the end of September 2019, the company had around 385,000 employees worldwide.

Further information is available on the Internet at www.siemens.com.

Altair Acquires newFASANT

TROY, MI, Jan 7, 2020 – Altair, a global technology company providing solutions in product development, high-performance computing and data analytics, announced the acquisition of newFASANT, offering leading technology in computational and high-frequency electromagnetics. newFASANT’s solutions address a wide range of electromagnetic problems in areas such as antenna design and placement, radar cross section (RCS) analysis, automotive V2V/ADAS, and infrared/thermal signatures.

Originally a spin-off from the University of Alcalá, near Madrid, newFASANT is home to world renowned industry pioneers. Its software portfolio containing various full-wave and high frequency asymptotic electromagnetic solvers, when combined with Altair Feko, will allow Altair to leapfrog its competition and offer advanced solutions in relevant technology areas like V2V, Doppler effects, radome analysis, periodic structures, reflectarrays and others.

“We are thrilled to welcome newFASANT and its brilliant engineers to Altair,” said James Scapa, Altair’s chief executive officer and founder. “By combining its people and software into our advanced solutions offerings, we are clearly emerging as the dominant player in high-frequency electromagnetics – technology that is critical for solving some of the world’s toughest engineering problems.”

“We couldn’t be more excited to join the ranks of such a globally relevant and growing software player,” said Felipe Cátedra, chief executive officer of newFASANT. “Ever since we spun off from the University of Alcalá, we have grown the sophistication of our offerings, but by joining a powerhouse like Altair, we will be able to commercially expand our footprint immensely.”

This move solidifies Altair’s place as a world leader in high-frequency electromagnetics, a critical technology that supports advanced digital communications for areas such as IoT, cellular networks, mobile phones and connected devices, V2V, radar and radio.

About Altair

Altair is a global technology company that provides software and cloud solutions in the areas of product development, high performance computing (HPC) and data analytics. Altair enables organizations across broad industry segments to compete more effectively in a connected world while creating a more sustainable future.

To learn more, please visit www.altair.com.