WILSONVILLE, OR, Nov 12, 2019 – Mentor, a Siemens business, introduced Tessent Connect – an innovative design-for-test (DFT) automation methodology that delivers intent-driven hierarchical test implementation that helps IC design teams achieve manufacturing test quality goals faster and with fewer resources compared to traditional DFT methods. As part of the Tessent Connect rollout, Mentor today also announced the Tessent Connect Quickstart program, offering detailed flow assessments from Mentor’s applications and consulting services engineers.
Today’s advanced IC designs can achieve very high defect coverage for manufacturing and in-system test by integrating dedicated on-chip infrastructure such as embedded compression, built-in self-test, and IEEE 1687 IJTAG networks. As IC designs grow in size and more of this on-chip IP is integrated, engineers have increasingly adopted hierarchical DFT approaches that break down the traditional DFT process into smaller, more manageable elements. However, retrofitting existing flows and automation to use hierarchical components and technologies often presents new sets of time-consuming and expensive inefficiencies.
Designed from the ground up to support hierarchical DFT, Mentor’s Tessent Connect automation approach helps eliminate these design inefficiencies. With Tessent Connect, IC designers interact with the Tessent software design tools using a higher level of abstraction, which describes the intended result rather than step-by-step instructions. The benefits of this abstraction-based approach include seamless collaboration across disparate DFT teams, plug-and-play reuse of IC components, significantly shorter turn-around times and the automation of many time-consuming setup, connectivity and pattern generation tasks.
eSilicon speeds time to market with Tessent Connect
An early adopter of Tessent Connect is eSilicon, a leading provider of FinFET application-specific integrated circuits (ASICs), market-specific IP platforms and advanced 2.5D packaging solutions. Leveraging the advanced automation of Tessent Connect, eSilicon recently improved IC DFT implementation cost while enabling system-level DFT testing and debug capabilities for a highly sophisticated next-generation ASIC.
“eSilicon uses Tessent Connect to help us meet our aggressive production schedules and deliver industry-leading ICs like those based on eSilicon’s neuASIC 7nm platform for machine learning,” said Joseph Reynick, director of DFT services at eSilicon. “As design complexity continues to grow, our system/OEM customers’ needs expand from just focusing on high quality IC manufacturing test to also providing effective in-system test and functional debug capabilities. With today’s complex 2.5D/3D devices, we are not shipping in volume until our chips are fully operational in our customers’ systems, including DFT and IP test. It would be very difficult to meet these challenges without the Tessent DFT portfolio and the efficiencies gained from Tessent Connect automation.”
New Tessent Connect Quickstart offers additional cost and time savings
Part of the Tessent Connect rollout, Mentor’s new Tessent Connect Quickstart program offers expertise in delivering customized insights and services that help IC design teams fully optimize and automate their DFT processes when using Tessent Connect.
“Our customers are continuously looking to reduce their test implementation costs as their design sizes grow and quality requirements become more stringent,” said Brady Benware, vice president and general manager for the Tessent product family at Mentor, a Siemens business. “With Tessent Connect and the corresponding Quickstart program, our customers are empowered with an accelerated and automated path to DFT sign-off.”
For more information about Mentor’s Tessent product line, please visit: https://www.mentor.com/products/silicon-yield/tessent/. In addition, attendees of the 2019 International Test Conference are invited to visit booth #401 for demonstrations of Tessent products and solutions.
About Mentor Graphics Corp.
Mentor Graphics Corp., a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies.
For more information, visit www.mentor.com.
LONDON, UK, Nov 12, 2019 – EOS, leading technology supplier in the field of industrial 3D printing of metals and polymers, and AMFG, leading provider of MES software for additive manufacturing, have announced a partnership enabling direct streaming to and connectivity with EOS machines.
Making machine control a reality
The lack of connectivity across the additive manufacturing workflow remains one of the biggest barriers to adoption. Through their partnership, EOS and AMFG aim to remove this barrier and establish a fully connected and automated additive manufacturing workflow.
Customers of EOS machines will be able to manage their entire additive manufacturing operations with AMFG’s Manufacturing Execution System (MES), whilst simultaneously connecting directly with their machines through the software platform.
“EOS has always been at the forefront of technological developments in additive manufacturing,” stated Mirco Schöpf, product line manager connectivity & automation software at EOS. “We strive to work with partners who share our vision of innovation for additive manufacturing. Our collaboration with AMFG will help our customers continue to unlock the full benefits of our technologies.”
Keyvan Karimi, CEO of AMFG, said: “EOS is a global leader when it comes to 3D printing technologies and we’re thrilled to collaborate with such an esteemed partner. Our partnership not only makes machine control a reality, but it is also a major step towards establishing AM operations that are automated and scalable.”
Creating an end-to-end digital manufacturing workflow
Through AMFG’s MES software, EOS customers can also prepare build jobs and set important parameters like part orientation. Builds can then be sliced and the data sent directly to an EOS 3D printing system. The ability to monitor and receive machine data in real time is also in the works.
Both EOS and AMFG are exhibitors at this year’s Formnext trade show. Visit EOS in Hall 11.1, Stand D31 and AMFG in Hall 12.1, Stand G81.
EOS is the world’s leading technology supplier in the field of industrial 3D printing of metals and polymers. Formed in 1989, the independent company is a pioneer and innovator for comprehensive solutions in additive manufacturing. Its product portfolio of EOS systems, materials, and process parameters gives customers crucial competitive advantages in terms of product quality and the long-term economic sustainability of their manufacturing processes. Furthermore, EOS customers benefit from deep technical expertise in global service, applications engineering and consultancy.
To learn more about EOS, visit www.eos.info/en.
AMFG is a leading provider of MES software for additive manufacturing. Their software platform empowers companies to streamline and manage their entire additive manufacturing workflows, integrating machine learning technology to deliver streamlined, automated processes.
With customers in 26 countries and across industries, their expertise is in working with companies to scale their operations and successfully integrate AM into their manufacturing processes.
To learn more about AMFG, visit www.amfg.ai.
ATHENS, Greece, Nov 12, 2019 – Plexscape, developers of Plex.Earth, one of the most popular tools for AutoCAD for the acceleration of architectural, engineering and construction (AEC) projects, launched Timeviews, a unique service in the global AEC market, which makes the most up-to-date satellite imagery affordable and easily accessible within AutoCAD.
Following a strategic partnership with Bird.i, a company that combines the latest satellite imagery and artificial intelligence to provide valuable insights, Plex.Earth Timeviews opens up access to very recent satellite imagery from world leading commercial satellite providers – Maxar Technologies/DigitalGlobe, Airbus and Planet – introducing a unique pricing model: any AEC professional can now have unlimited instant access to Timeviews’ premium satellite data for better planning through very affordable monthly or annual Plex.Earth subscriptions.
Until today, the use of commercial satellite imagery came with a high cost, significant delays and the requirement for a certain level of expertise for processing and analyzing the data. Furthermore, free satellite images are often outdated, of low quality, and do not always provide sufficient permissions for commercial use or the creation of derivative work. Drones and ground-based surveys, on the other hand, require on-site presence, inducing delays and team mobilization costs, and are subject to other possible restrictions (not suitable weather, no-drone flying zones etc.).
Plex.Earth Timeviews puts an end to these limitations by democratizing the access to high-quality, up-to-date satellite imagery within AutoCAD, and soon other CAD platforms. By having easy and instant access to premium satellite data, AEC professionals can have the most up-to-date view of their targeted area to better understand their project’s environment, make informed decisions and avoid costly mistakes, from the very beginning of the design process.
Furthermore, Timeviews enables businesses of any size to monitor the progress of their ongoing projects (and those of the competition), see how an area of interest evolves over time, or assess the actual impact of natural disasters on worksites.
“Ten years ago, being a civil engineer myself, I got a taste of the true cost of rework, leading me to develop a tool that directly connected AutoCAD and Google Earth.” said Mr. Lambros Kaliakatsos, founder & CEO of Plexscape. “Now, Plex.Earth is on its 4th generation and our vision remains the same: to eliminate the need for engineers to get on-site for the conceptual planning and preliminary design of their projects. Timeviews, our new premium service, is one step further to this goal, given that it opens up access for the first time to absolutely everyone to the world’s most recent satellite imagery and to the valuable insights they bring.”
Plexscape is a software company committed to changing the way engineers work on architectural, engineering and construction (AEC) projects, by developing innovative solutions that bridge the gap between design and the real-world.
Plex.Earth, their flagship product, is the first cloud-based software ever created in the CAD market and one of the most popular tools in the Autodesk App Store.
Their solution, originally released in 2009, is being used by thousands of engineers in over 120 countries worldwide, enabling them to have the complete 3D geographical view of their real-world project sites within minutes, through Google Earth, Bing Maps, other mapping services and leading commercial satellite providers (Maxar Technologies/DigitalGlobe, Airbus and Planet).
For more information on Plex.Earth’s benefits, visit www.plexearth.com.