Flomerics Releases EFD v8.1 for Fluid Dynamics
MARLBOROUGH,
MA, Nov 28, 2007 - Flomerics has released Version 8.1 of its
increasingly popular Engineering Fluid Dynamics (EFD) simulation software,
containing many new enhancements built on Flomerics' 20 years experience and
research in thermal analysis of electronics. The new functionality includes
simulation of "Joule heating", plus new "compact" models for IC components,
heat pipes, and thermoelectric coolers. The treatment of thermal
conductivity in printed-circuit boards has been improved and extended. The
simulation of fans has also been improved with radial and swirl components
of velocity as well as the fan performance curve now fully accounted for.
Fans and heat sources can be switched on or off at specified times,
temperatures or other specified engineering goals.

Flomerics v8.1 EFD fluid simulation
software performs themal analysis of
electronics
The new Joule heating model enables automatic determination of heat
sources in conducting objects as they heat up due to electric current
passing through them. The new "compact" models use a simple two-resistor
approach to represent thermal characteristics of IC packages realistically
and efficiently. Simplified models for heat pipes and thermoelectric coolers
are also available. A new PCB generator enables automatic calculation of the
orthotropic material properties associated with complex multi-layer printed
circuit boards, and this treatment is applicable to boards set at any
arbitrary angle to the coordinate system.
The comprehensive new library facility includes fans, thermoelectric
coolers, thermal interface materials, perforated plates and material
properties for most solid materials used in electronic systems - including
surface radiation properties.
"The combination of our existing CAD-embedded approach to simulation
coupled with the new electronics-specific functionality and comprehensive
libraries in EFD Version 8.1 delivers maximum productivity for mechanical
designers in the electronics industry and positions us far ahead of our
competitors." said Ivo Weinhold, Engineering Fluid Dynamics business manager
at Flomerics.
A unique feature of EFD is its ability to detect fluid regions within a
CAD solid model and mesh them automatically. In Version 8.1, this powerful
feature has been enhanced to detect and close any external gaps or openings
in the solid model automatically. This saves the user time and effort by
making the definition of the fluid region even easier.
All the above functionality is available as an optional upgrade for users
of CAD-embedded versions of EFD, namely EFD.Pro for Pro/ENGINEER, EFD.V5 for
CATIAV5, and EFD.Lab for other CAD systems including SolidWorks, Inventor
and NX.
EFD 8.1 is available for immediate delivery. Interested readers should
send an email to info@flomerics.com
to arrange a demonstration or evaluation.
About Flomerics
Flomerics is a world-leading developer of engineering simulation software
and services for analysis of fluid flow, heat transfer and electromagnetic
radiation. Flomerics' business model is drastically different from
traditional analysis because its software is designed to be embedded deeply
into the design process and used by mainstream design engineers, not just by
analysis specialists.
For more information visit at,
www.flomerics.com.
----------
If news like this is important to you, sign up for our TenLinks Daily at www.tenlinks.com/news/sub_unsub.htm.
Related News
May 6 - Flomerics Ships EFD v8.2 for Fluid Dynamics Apr 15 - CFD-Online Launches 'Flomerics EFD' User Forum Apr 11 - Flomerics Releases ThermPaq for Semiconductor Packages Mar 18 - UK's Thales Selects Flomerics EFD.Pro for Pro/E Mar 5 - Dialight Selects Flomerics' EFD.Pro Jan 23 - Flomerics Celebrates 20th Anniversary Jan 17 - Flomerics EFD.Pro to Support Pro/E Wildfire 4.0 Nov 28 - Flomerics Releases EFD v8.1 for Fluid Dynamics Oct 31 - Flomerics Customer Survey - 60% Are Pro/E, CATIA Users Sep 13 - Most Engineers Not Using CFD - Flomerics Survey Sep 7 - Flomerics Releases FLO/PCB v4.1 for Thermal Design Aug 09 - Flomerics Releases EFD v8 for Fluid Dynamics Jul 5 - Flomerics Adds Fans' Thermal Models to SmartParts3D Website May 16 - Flomerics Flovent v7 Offers Response Surface Optimization May 8 - Flomerics Flotherm v7 Offers Response Surface Optimization Apr 26 - Flomerics Announces EFD for Education Initiative Apr 25 - Flomerics Releases Findings of CFD Analysis Survey Apr 12 - Flomerics Users Do Thermal Analysis Faster, Says Aberdeen Apr 03 - Flomerics FY06 Sales Up 24% to $28M, Profits Up 30% to $3M Mar 7 - Flomerics Releases 6 Diffuser 'SmartParts' for Flovent Mar 2 - Sarantel Buys Flomerics MicroStripes Licenses Worth $620K Mar 1 - Flomerics EFD.Pro Supports Pro/E Mechanica Feb 20 - Flomerics Ships Flopack v6.2 for Thermal Design Engineers Jan 25 - Flomerics FLO/PCB Thermal Finalist in IECDesignVision 2007 Jan 17 - Flomerics Releases EFD Version 7.3
Source: Material used in press releases is often supplied by external
sources and used as is.
|