home · about · advertise
Corporate
Sponsors
Search:
advertisment  What's new in SolidWorks 2008?  Watch the demo here

TenLinks Partners

CADdepot
CADdigest
CADtalent
Innovate3D
FreeCAD
 upFront.eZine

News via Email
TenLinks Daily
CADdepot.com Update
CAD Digest  Weekly

NewsBreak

Flomerics Users Do Thermal Analysis Faster, Says Aberdeen

See Also

 ·  Flomerics website
 ·  TenLinks CFD Products and Companies list
 ·  related news

MARLBOROUGH, Massachusetts, April 12, 2007 - An independent survey by the Aberdeen Group found that users of Flomerics' thermal analysis software complete thermal design verification three times faster and have over 40% fewer re-spins on average per printed circuit board (PCB) design than non-users. The survey shows that 65% of Flomerics' users have only one re-spin, 24% have two, 11% have three and none have 4 or more. For companies not using Flomerics' software, only 13% have one re-spin, 34% have two, 48% have three, and 5% have four or more.

The survey also showed that Flomerics' customers are ahead of the industry curve in performing thermal design reviews, with 47% saying they perform "real-time" reviews and 32% "daily" reviews. For companies not using Flomerics' software, only 11% perform real-time reviews, 5% perform daily reviews, 8% perform monthly reviews, 42% perform ad-hoc reviews and 26% never carry out thermal design reviews at all.

These results are significant because the top pressure in the electronics business - cited by 53% of electronics manufacturers in Aberdeen's benchmark surveys - is decreasing time to market. This is followed by the need to improve productivity (45%), driven by the need to reduce cost as well as time.

"We are delighted to have the benefits of our thermal software products confirmed by independent research," said Dr. Mike Reynell, Director of Marketing for Flomerics. "Our products reduce thermal analysis time and re-spins by promoting a conceptual design process that integrates electrical and mechanical design, enabling early resolution of component placement and thermal issues - a capability that is proving critical for design of high-performance electronics."

Flomerics' promotes an integrated analysis environment that includes Flo/PCB for board-level thermal analysis, Flotherm for system and component-level thermal analysis, and Flo/EMC for electromagnetic compatibility analysis. Flomerics also partners with companies such as Cadence, Parametric Technology, and Dassault Systemes to build more integrated design solutions for the marketplace.

The Aberdeen Group survey examined the electronic design procedures, experiences, and intentions of about 170 electronics companies between December 2006 and January 2007. Responding participants were interviewed and completed an in-depth survey that included questions designed to determine the current challenges of increasingly shorter windows of opportunity, the effectiveness of existing electronic design procedures and infrastructures, the use of automation to improve and accelerate design, and the results and benefits of key technologies and organizations and process approaches in managing complexity. The responding companies compete in industrial electronics (41%), wireless communications (29%), design services (25%), computer peripherals (19%), data storage (15%), medical devices (14%), desktop PCs (7%) and optical devices (4%).

For more information, visit Flomerics' Web site at http://www.flomerics.com 

----------

If news like this is important to you, sign up for our TenLinks Daily at www.tenlinks.com/news/sub_unsub.htm.

Related News

May 6 - Flomerics Ships EFD v8.2 for Fluid Dynamics
Apr 15 - CFD-Online Launches 'Flomerics EFD' User Forum
Apr 11 - Flomerics Releases ThermPaq for Semiconductor Packages
Mar 18 - UK's Thales Selects Flomerics EFD.Pro for Pro/E
Mar 5 - Dialight Selects Flomerics' EFD.Pro
Jan 23 - Flomerics Celebrates 20th Anniversary
Jan 17 - Flomerics EFD.Pro to Support Pro/E Wildfire 4.0
Nov 28 - Flomerics Releases EFD v8.1 for Fluid Dynamics
Oct 31 - Flomerics Customer Survey - 60% Are Pro/E, CATIA Users
Sep 13  - Most Engineers Not Using CFD - Flomerics Survey
Sep 7 - Flomerics Releases FLO/PCB v4.1 for Thermal Design
Aug 09 - Flomerics Releases EFD v8 for Fluid Dynamics
Jul 5 - Flomerics Adds Fans' Thermal Models to SmartParts3D Website
May 16 - Flomerics Flovent v7 Offers Response Surface Optimization
May 8 - Flomerics Flotherm v7 Offers Response Surface Optimization
Apr 26 - Flomerics Announces EFD for Education Initiative
Apr 25 - Flomerics Releases Findings of CFD Analysis Survey
Apr 12 - Flomerics Users Do Thermal Analysis Faster, Says Aberdeen
Apr 03 - Flomerics FY06 Sales Up 24% to $28M, Profits Up 30% to $3M
Mar 7 - Flomerics Releases 6 Diffuser 'SmartParts' for Flovent
Mar 2 - Sarantel Buys Flomerics MicroStripes Licenses Worth $620K
Mar 1 - Flomerics EFD.Pro Supports Pro/E Mechanica
Feb 20 - Flomerics Ships Flopack v6.2 for Thermal Design Engineers
Jan 25 - Flomerics FLO/PCB Thermal Finalist in IECDesignVision 2007
Jan 17 -  Flomerics Releases EFD Version 7.3

Source: Material used in press releases is often supplied by external sources and used as is.

feedback - newsletters - privacy statement - suggest a site - terms of service
Copyright © 2008 by TenLinks, Inc. All rights reserved.