Apr 11 - Flomerics Releases ThermPaq for Semiconductor Packages

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Flomerics Releases ThermPaq for Semiconductor Packages

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MARLBOROUGH, MA, Apr 11, 2008 - Flomerics has released a unique new software product, ThermPaq, that revolutionizes the process of semiconductor thermal characterization and design. ThermPaq provides a fast, simple, proven, automated process that reduces the number of distinct steps required to be performed by thermal experts, reducing the risk of modeling errors to enhance the quality, reliability, and availability of package thermal models.

Thermal image of TO-style package from Thermpaq

ThermPaq is built upon Flomerics’ FLOPACK SmartPart technology and FLOTHERM’s CFD solver. The web-based tool is entirely wizard-driven which makes it attractive for engineers who are not thermal specialists. The result is a fully automated process for generating accurate package models and computing the complete set of JEDEC-compatible thermal characterization data. These include all Theta and Psi metrics under various environmental conditions and industry-standard compact thermal models. Interfacing with Cadence APD, ThermPaq can take advantage of existing BGA layouts to capture metallization and via placement detail.

ThermPaq also serves as a powerful design tool for thermal specialists. Changes in thermal performance can be investigated through parametric variation of key package parameters to optimize the package thermal design. A comprehensive search function on all key package parameters and metric values allows the user to optimize the starting point for a new design. Package sub-elements such as substrates and lead frames are stored as separate libraries, facilitating the use of data from third-party vendors. Direct interfaces to semiconductor manufacturer packaging databases can also be created with minimal customization.

All this adds up to a huge productivity boost for semiconductor package characterization and design compared to existing approaches. Commenting on the new product, Sarang Shidore Director of Web Products at Flomerics Inc. said “ThermPaq is a quantum leap in Flomerics’ offerings to the semiconductor industry. In creating this product our focus has been on one thing – to deliver even higher productivity. ThermPaq would not have happened without the critical feedback we have received from our customers over the past several years. We thank them for their support.”

About Flomerics

Flomerics is a world-leading developer of engineering simulation software and services for analysis of fluid flow, heat transfer and electromagnetic radiation. Flomerics' business model is drastically different from traditional analysis because its software is designed to be embedded deeply into the design process and used by mainstream design engineers, not just by analysis specialists.

For more information, visit http://www.flomerics.com.

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