Flomerics Ships Flopack v6.2 for Thermal Design Engineers
 MARLBOROUGH,
Massachusetts, February 20, 2007 - Flomerics has further enhanced the
productivity of Thermal Design Engineers with the launch of Flopack V6.2 (www.flopack.com)
- the latest version of its web-based SmartPart library that generates fast,
accurate thermal models for IC packages and associated parts.
FLOPACK V6.2 speeds generation of thermal models for IC packages
Thermal models created within Flopack can be instantly imported into
Flomerics’ Flotherm or FloPCB software to analyze the cooling requirements
of electronic components, boards and systems.
Key new features contained within Flopack V6.2 include:
- a major expansion of the power/discrete semiconductor package
library;
- a new parametric rules engine that checks for errors in design data
inputs;
- an enhanced, more accurate model for bond-wires; and
- overall improved usability.
Commenting on Flopack V6.2, Sarang Shidore, Flomerics’ Product Manager
for Semiconductor Software Products said, “Providing Design Engineers with
productivity gains is the driving force behind all of Flomerics’ products.
Flopack V6.2 achieves this by continuing to expand its already formidable
package portfolio, incorporating new design-friendly features, and by making
it even easier for those people who are not usually involved with IC package
design to realize substantial improvements in productivity."
For more details, please visit
www.flopack.com.
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Source: Material used in press releases is often supplied by external
sources and used as is.
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