Mindpower to Sell ThinkDesign in Tamilnadu, India
Bangalore,
India, Dec 17, 2009 - think3 a leading CAD and PLM solution provider joins
hands with MINDPOWER (Mindpower Engineering Solutions Pvt. Ltd) to penetrate
in the Tamilnadu territory. Mindpower is a technological solutions company
for engineering design & manufacturing industry formed by a team of highly
qualified and experienced professionals. Mindpower Engg's core strength is
its domain expertise, consultant approach and ensuring confined deliveries
for its customer requirements. It holds vast experience in the CAD/CAM/PLM
industry with highly motivated and qualified team of professionals to cater
to the customer needs.
MINDPOWER
would focus on the entire range of ThinkDesign suite of products for the TN
territory. think3’s ThinkDesign Engineering addresses the needs of
mechanical manufacturing companies by offering productive and reliable
tools. From traditional 2D design controls, to innovative and integrated 3D
design functionalities in a single environment, ThinkDesign Engineering
provides a comprehensive CAD solution that allows companies to define their
products in a faster, more efficient and flexible way. Part Modeling,
2D/3D/PLM Transparency, AutoCAD Compatibility, Interactive Solid Modeling,
Smart Objects and Adaptive Measures, Integrated Sheet Metal, Advanced
Assembly Management, 2D and 3D translators, direct FEA/FEM interface,
product data management are all in one intuitive and easy-to-use product.
These are just a few aspects of ThinkDesign Engineering’s world. think3 and
Mindpower would follow a strong strategy to cater to the market demands in
Tamilnadu and offer the best and effective solutions to its customers.
“With this partnership think3 plans a strong go to market strategy and
explores the potential market in Tamilnadu for CAD/PLM/PDM” adds Mr. Silvano
Joly, Vice-President Sales and worldwide Marketing at think3. “With think3’s
advanced technology and MINDPOWER’S vast CAD/PLM experience we are positive
to create a niche in the TN market by meeting the expectations of the
prospects and delighting the customers with our service” he further adds.
“Tamilnadu Industrial Segment is huge and multi-segmented into various
streams of engineering and interestingly think3 has the best technology
addressing the each specific stream of engineering right from 2D Drafting,
3D Modeling, Engineering Design, Styling for New Product Development and
Integrated Tooling Solutions from Concept to product. And to unleash the
best, the unexplored PDM / PLM Market segment is wide open for Stable &
Sustainable solutions from think3 Suite of offerings” states Mr.R.
Krishnamoorthy, Director Mindpower. He further adds “Mindpower relationship
with think3 will be a strategic partnership to offer the best in class
engineering solutions to the market segment we address and ensure the
implementation success will yield more referral customers in the industry”.
To add, he states a famous quote on Collaboration by Sir Issac Newton &
MESPL go by that, “If I have seen further than others, it is by standing
upon the shoulders of giants.”
For more information about Mindpower, visit
www.mindpowerengg.com.
About think3, Inc.
think3 has been operating in the ICT sector for 30 years and provides the
only technology that links three separate design areas: the concept, its
development and the finished product. In this way, think3 enables thousands
of company customers to innovate, to compete and to rise to the challenges
of global markets, thanks to the integration of processes, which helps to
accelerate time to market and to reduce costs.
think3 boasts a consolidated
presence across Europe, the US and Asia. The company has also secured a
strong presence in China following joint venture deal sealed with Beijing Extech Science & Technology Co. Ltd to create EXTECH, a brand new company
based in Beijing, with offices across the country. In the rest of the world,
think3 is present throughout its network of selected VARs (Value Added
Resellers).
For more information, visit
http://www.think3.com.
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