think3 Introduces ThinkDesign 2009.1

MILAN, Italy, Jul 22, 2009 - think3, the multinational company currently celebrating 30 years of activity in the Product Development Process, presents ThinkDesign 2009.1, its new release of CAD products developed and enhanced by think3’s R&D to offer strong functionality improvements to users in the engineering, styling and tooling departments.

The 2009.1 release includes new features for the creation of frame elements for the industrial machinery market, improvements to commands for curve and surface editing, enhancements in the sheet metal functionalities and many other new features for the Machinery and Components sectors.

Version 2009.1 introduces the new Frame functionality, a fully integrated module of ThinkDesign, which is an instinctive sketch-based method that facilitates the creation of frame elements. The Frame module simplifies the process of creating frame structures with easy-to-use, powerful and flexible tools to achieve significant reduction in design time.

The new Hole command has been redesigned, offering greater ease of use and completeness with respect to standards, in order to make designer’s work increasingly smooth and productive. It can be used for creating and redefining standard, simple, shaped, and free dimensional holes.

The new Mirror mode for curve and surface editing enables the user to maintain continuity of the curve/surface being edited with respect to the virtual mirror of the entity. Additional options under the Mirror mode node give full control to the user to define the type of continuity (Position, Tangent or Smooth curvature) to be maintained about a user-selected plane.

ThinkDesign 2009.1 introduces enhancements in the Global Modeling commands. With the Enhancement in GSM Transformation of Mesh, it is now possible to modify the original mesh thanks to GSM (Global Shape Modeling) technology.

Also new for the Die Design community: the new GSM command called GSM Fillet Reduction. It enables the modification of a set of selected fillet surfaces by changing their curvature, while retaining the desired continuity along borders. It can be used to modify some high curvature areas to let the material fill properly during stamping.

Improvements have been made also in color management to provide better control over the application of colors and increase understanding in complex models (better dynamic visualization). Different colors are now allowed for solid and solid faces, useful to highlight different technological meanings of different parts of the same object. It is possible to use a unique component’s color in order to better visualize it in an assembly. Color will be maintained after adding or modifying features and can be maintained after imploding/exploding of solids/surfaces.

The graphic environment has been enhanced with the new 3D Section View mode, the Planar Reflection option in High Quality rendering, the Shaded Drag&Drop for the visualization of components positioned in an assembly in shaded mode, and a set of other features that assist in the visualization of data.

As for new features and improvements in Part Modeling, a new Insert New Faces check box has been introduced in the Extend Faces/Close Solid command selection list which, upon activating, creates new faces to fill the selected holes. It enables an easy closure of holes by saving time in complex models, which is very useful to pre-process shapes used in metal stamping and mold creation.

ThinkDesign 2009.1 includes, among many other features, a completed extension to the CADENAS/PARTsolutions libraries and the full, seamless integration with TD PLM, think3’s web-based solution for implementing a PLM system.

About think3, Inc.

think3 has been operating in the ICT sector for 30 years and provides the only technology that links three separate design areas: the concept, its development and the finished product. In this way, think3 enables thousands of company customers to innovate, to compete and to rise to the challenges of global markets, thanks to the integration of processes, which helps to accelerate time to market and to reduce costs. think3 boasts a consolidated presence across Europe, the US and Asia. The company has also secured a strong presence in China following joint venture deal sealed with Beijing Extech Science & Technology Co. Ltd to create EXTECH, a brand new company based in Beijing, with offices across the country. In the rest of the world, think3 is present throughout its network of selected VARs (Value Added Resellers).

For more information, visit http://www.think3.com.

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See Also

think3 website

Additional News

Dec 17 - Mindpower to Sell ThinkDesign in Tamilnadu, India
Nov 17 - think3 Announces Jurors for 'PDP Award, Andrea Pininfarina'
Oct 14 - Ocean Rodeo Designs Kite Control System with ThinkDesign
Oct 13 - Germany's EniT to Sell think3 PLM Suite in India
Sep 29 - Italy's MAUS Selects thinkPLM
Sep 9 - think3 Releases TD PLM 2009.2
Sep 3 - Massachusetts Institute, India's Stylus Selects ThinkDesign
Jul 30 - think3 to Sell, Support 3Dconnexion Mice
Jul 27 - think3 Used in Yacht Design Class in Italy
Jul 22 - think3 Introduces ThinkDesign 2009.1
Jul 14 - Korg Italy Extends Use of think3 PLM
Jun 23 - think3, DME Launch 'Pininfarina' Design Contest
May 19 - Sys PO Ingenierie to Sell think3 products in France
May 12 - think3 Redesigns Website
Apr 15 - think3 Unveils TD-PLM Online System
Mar 18 - Italy's Zucchetti, think3 Introduces PLM Project for PDM
Feb 27 - thinkUSA to Sell think3 Products in North America
Feb 3 - think3 Releases MoldDesign
Jan 27 - Think3 Appoints Silvano Joly as VP Marketing
Nov 20 - Italy's Savio Macchine Tessili Adopts ThinkDesign
Nov 11 - Italy's CAM Selects think3 ThinkDesign
Nov 11 - Russia's Axoft to Sell think3 Products
Oct 20 - think3 Supports SATIN Multisensory Modeling Project Fund
Sep 3 - Canada's Tycos Expands Use of think3 Products
Aug 8 - think3 Joins India's Intel Business Exchange Program
Aug 1 - SENER Selects think3 ThinkDesign, thinkteam
Jul 9 - UK's Think PLM to Sell think3 Products

Source: Material used in press releases is often supplied by external sources and used as is.