ANSYS v14.5 Released
PA, Nov 14, 2012 - Building upon its comprehensive portfolio of advanced
multiphysics engineering simulation technology, ANSYS (NASDAQ: ANSS) today
released version 14.5 to further support an integrated and streamlined
approach to design exploration and the creation of a complete virtual
prototype. New multiphysics capabilities are seamlessly brought together
with the ANSYS Workbench platform to deliver unmatched engineering
productivity and innovation.
ANSYS Maxwell's new advanced hysteresis material modeling capability can
analyze the magnetization and demagnetization of permanent magnets.
In the real world, product performance varies by operating conditions,
consumer usage, manufacturing processes and material properties. As products
become increasingly complex, it is more challenging for engineers to fully
understand the performance implications of design variations. Multiphysics
simulation technology enables companies to make informed decisions based on
insight gained from these analyses to deliver optimal results. Built on a
platform that streamlines workflow among simulation applications, ANSYS 14.5
delivers many new and critical multiphysics solutions, enhancements to
pre-processing and meshing capabilities as well as a new parametric
high-performance computing (HPC) licensing model to make design exploration more
Shape optimization of manifold. For reduced pressure drop, push red areas in and
pull blue areas out.
"It's no secret that while today's products are getting smarter, they're also
becoming more complex," said Jim Cashman, president and CEO at ANSYS. "Having a
holistic view of the product requirements and design is crucial to reduce design
uncertainty and ultimately create a successful product. Our customers are
depending on the depth and breadth of ANSYS 14.5 and our Workbench platform to
confidently predict how their products will perform and, at the end of the day,
provide good value and satisfaction to their customers."
New Parametric licensing solution for design exploration
A single ANSYS HPC Parametric Pack license enables execution of four
simultaneous design points.
ANSYS 14.5 builds on a tradition of HPC leadership. The technology supports
robust design exploration via a combination of Workbench's enhanced parametric
simulation technology with improved job management and a new HPC licensing
solution that enables scalable throughput computing.
Specifically, the new HPC Parametric Pack amplifies the available licenses
for individual applications (pre-processing, meshing, solve, HPC,
post-processing), enabling simultaneous execution of multiple design points
while consuming just one set of application licenses.
Chip-package-system design flow
To meet increasing market demands of higher performance, smaller size and
lower-cost electronics, the design of electronic chips, packages and systems
requires an integrated analysis and verification methodology. To resolve these
challenges, ANSYS 14.5 introduces the first chip-package-system (CPS) design
flow on the market. This coupled approach addresses multidisciplinary
requirements from the first phase of the design process and results in a final
product whose individual components work together as an integrated system.
ANSYS 14.5's new CPS design flow links ANSYS subsidiary Apache Design's
integrated circuit (IC) power analysis products to ANSYS' electromagnetic field
simulation products. Additionally, the power delivery network channel builder
automatically connects electronic package models from ANSYS SIwave to IC power
simulations in Apache's RedHawk and Totem for increased convenience.
Advanced meshing solutions
Users of ANSYS 14.5 can create higher-fidelity simulation results faster.
ANSYS TGrid functionalities are integrated in the ANSYS Fluent environment in
version 14.5 to further reduce pre-processing time. CAD readers and new advanced
surface meshing capabilities are also integrated and available in a single user
environment. Additionally, meshing enhancements allow for higher-quality
hexahedral meshes that result in smaller problem size and overall reduced solver
Complex 3-D composites shape simulation
The use of composites parts across different industries is growing due to
their ability to reduce the weight of a product. While many composites can be
efficiently modeled as thin structures, some complex geometries, such as turbine
blades, pressure vessels and automotive structures, require the setup of 3-D
models and their inclusion within larger assemblies made of non-composites
parts. ANSYS Workbench provides the necessary framework and streamlined workflow
in version 14.5 to further improve the ability to create 3-D layered
composites from complex geometry and conveniently combine them with
non-composites parts in global assemblies.
Extended fluid-thermal multiphysics capabilities
Continuing its history of innovation in multiphysics, ANSYS 14.5 introduces
extended fluid-thermal capabilities, such as two-way coupling between fluid
simulation in ANSYS Fluent and electromagnetic field simulation in ANSYS
Maxwell. The ANSYS Workbench platform supports the efficient coupling of
multiple physics models and, when paired with this new feature, users can
quickly and accurately predict losses and understand the effects of temperature
on material performance in electromechanical devices such as motors and
A holistic solution for one-way thermal-fluid-structure interaction (FSI),
ANSYS system coupling supports a wide variety of one-way thermal FSI workflows,
which promotes higher-fidelity simulations. Furthermore, the robustness of
coupled two-way force/displacement FSI is enhanced, allowing engineers to gain
insight into their complete products more quickly and with less hassle. A global
liquid food packaging and processing leader, Tetra Pak, has seen marked
improvements with 14.5's new two-way FSI capabilities:
"Historically, simulating two-way FSI has been an incredibly time-consuming
and complex process and, in some applications, not even possible," said Ulf
Lindblad, technology specialist at Tetra Pak. "The solution stabilization
algorithm implemented in ANSYS 14.5 broadens the range of applications where we
can execute this difficult task with increased accuracy and efficiency.
Designing our systems with optimized FSI will ultimately lead to improved
machine performance for our customers and improved package performance for their
Esterel Technologies' SCADE Suite with ANSYS Simplorer
New coupling of Esterel Technologies’ SCADE suite to ANSYS Simplorer
enables virtually validation of both hardware and software that are critical
components of power electronic and mechatronic systems.
A systems-level engineering approach that brings hardware and software
together earlier in the design process is crucial to avoiding design errors
being introduced at a point when changes are costly.
With the integration of recently acquired ANSYS subsidiary Esterel
Technologies' SCADE Suite with ANSYS Simplorer in version 14.5, companies can
virtually validate power electronic and mechatronic systems earlier in the
design process by simulating the embedded software with the hardware, including
electrical, mechanical and fluidic subsystems. This capability increases the
design fidelity and boosts confidence that products will perform as expected in
the real world.
ANSYS HFSS for ECAD integration
As companies face pressure to do more with their current engineering
resources, ANSYS 14.5 further streamlines the design workflow and introduces
ANSYS HFSS for ECAD. This capability contributes to accuracy by enabling
engineers to run complex 3-D HFSS simulations directly from the ANSYS
Designer layout-based interface and from other popular layout-based ECAD
Scott McMorrow, director of engineering at Teraspeed Consulting Group LLC,
has chosen to switch to ANSYS HFSS, ANSYS DesignerSI and SIwave after using a
competitor's electromagnetic modeling and simulation products for nearly 10
years. "After a two-year extensive evaluation and measurement correlation of the
ANSYS tools against multiple industry products, the measurement comparisons have
shown that the ANSYS solutions are robust and accurate across the widest range
of applications and structures. We found through detailed measurement testing
that HFSS is truly the 'golden standard' in electromagnetic modeling. When the
structures we measured were modeled faithfully and the material properties were
characterized and entered accurately, ANSYS HFSS produced extremely accurate
results with no discernible difference between measured and modeled results."
ANSYS version 14.5 is available for
download via the ANSYS
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex design challenges
through fast, accurate and reliable engineering simulation. Our technology
enables organizations - no matter their industry - to predict with confidence
that their products will thrive in the real world. Customers trust our software
to help ensure product integrity and drive business success through innovation.
Founded in 1970, ANSYS employs more than 2,000 professionals, many of them
expert in engineering fields such as finite element analysis, computational
fluid dynamics, electronics and electromagnetics, and design optimization.
Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 60 strategic
sales locations throughout the world with a network of channel partners in 40+
countries. Visit www.ansys.com for more
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